Preparation process and application of water-based nano-coating materials and micro-crack diagnostic circuits

Abstract

The invention discloses a preparation process and application of a water-based nano-coating material, a microcrack diagnostic circuit. The invention adopts a self-developed water-based nano-coating material that can be treated by laser metallization, and moves on the surface of the product through a laser beam The surface of the material is thereby activated where a conductive path is to be provided. With the help of laser direct patterning + fine-grained plating method, a conductive path width of 100 microns or less can be obtained. The purpose of the present invention is to remove the influence of other fillers, improve the accuracy of laser direct patterning lines, and make them reach preset mechanical properties. The added laser direct patterning workpiece is pre-sprayed with water-based nano-coating to avoid other fillers from affecting the material processing performance, mechanical properties and later laser processing performance, which greatly improves the quality of the workpiece; the prepared coating has good attachment Strength, salt spray resistance, high temperature and high humidity resistance and thermal shock resistance, the diagnostic circuit has good adhesion and conductivity.

Description

technical field [0001] The invention belongs to the technical field of surface microcrack diagnosis, and in particular relates to a preparation process and application of a water-based nano-coating material and a microcrack diagnosis circuit. Background technique [0002] At present, in order to diagnose surface microcracks, the method of embedding thin metal wires in materials is mainly used. The shortcoming of this scheme is 1: the strength of existing thin metal wire is better than matrix material, so when material cracks, thin metal wire does not necessarily break. The error rate of detection by conductive signal and RF signal reaches about 40%. 2. In order to ensure that the fracture of the matrix material and the thin metal wire are broken simultaneously, the diameter of the metal wire is required to be very thin, and the preparation of the metal wire and the implantation of the metal wire into the matrix material are difficult to operate. When metal wire is used as ...

AI Technical Summary

Problems solved by technology

The disadvantage of this solution is 1: the strength of the existing thin metal wire is better than that of the base material, so when the material cracks, the thin metal wire does not necessarily break

2. In order to ensure the synchronization of the fracture of the matrix material and the fracture of the fine metal wire, the diameter of the metal wire is required to be very thin, and it is difficult to operate the wire preparation and implantation of the metal wire into the matrix material

[0006] In the conventional method, the added laser direct patterning material is directly filled without any treatment, which affects its use effect, and the formulation involved in practical applications usually contains other fillers. The performance of laser processing is reduced

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