Laser plane machining device

Abstract

The invention discloses a laser plane machining device. The device comprises a supporting assembly, a clamping block, a laser head, a monitoring assembly and a measuring assembly, wherein a workpieceis placed on the supporting assembly, and the clamping block is arranged above the supporting assembly; the laser head is arranged on the clamping block and is located above the workpiece, and an angle is arranged between the laser head and a to-be-machined surface of the workpiece; the monitoring assembly comprises a camera, the camera is arranged on the clamping block, the camera is aligned withthe workpiece, and the central axis of the camera is perpendicular to the to-be-machined surface of the workpiece; and the measuring assembly comprises an optical distance measuring instrument, the optical distance measuring instrument is arranged on the clamping block, and the optical distance measuring instrument is aligned with the workpiece. According to the device, by means of the mode, thelaser can be used for machining the workpiece in the direction inclined to the to-be-machined surface of the workpiece, the device can be suitable for a workpiece with an uneven initial surface, the application range of the device is wide, and the effect of laser machining is improved.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser plane processing equipment. Background technique [0002] Most of the traditional surface machining technologies are milling or grinding using tools with higher hardness than the workpiece to be processed. There are also surface machining using electric spark discharge, that is, milling cutter milling, grinding wheel, electric spark discharge or micro powder grinding. class method. [0003] Face milling with milling cutters cannot machine superhard materials such as diamond and cubic boron nitride, because no milling cutter grade is harder than these materials. [0004] The use of electric spark grinding used to be a popular method, and now there are some products of superhard materials that continue to be processed by this process. However, spark discharge will damage the internal structure of the material, resulting in a decline in the final quality of the pr...

AI Technical Summary

Problems solved by technology

[0006] Recently, laser ablation has been used, but the effect of laser plane processing (or partly called laser grinding) is not ideal. Most of them can only process workpieces with a flat initial surface. If the initial surface is uneven, it is difficult to process. To the flatness and roughness close to grinding

If the workpiece is flattened first, then laser-polished, and finally ground with a grinder, the superiority of laser processing will not be reflected, and the cost will not be effectively controlled.

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