Water-based nano coating material, preparation process of micro-crack diagnosis circuit and application of micro-crack diagnosis circuit

Abstract

The invention discloses a water-based nano coating material and a preparation process and application of a micro-crack diagnosis circuit; the self-developed water-based nano coating material capable of being subjected to laser metallization treatment is adopted, and a laser beam moves on the surface of a product so as to activate the surface of the material at a place where a conductive path needsto be arranged. By means of a laser direct patterning + grain refining plating method, a conductive path width of 100 microns or less can be obtained. The invention aims to take out the influence ofother fillers and improve the precision of a laser direct graphical line, so that the laser direct graphical line reaches the preset mechanical property. The added laser direct patterning workpiece issprayed with a water-based nano coating in advance, so that the influence of other fillers on the material processability, the mechanical property and the later laser processability is avoided, and the quality of the workpiece is greatly improved; the prepared coating has good adhesive force, salt fog resistance, high temperature and high humidity resistance and cold and hot impact resistance, and a diagnosis circuit has good adhesive force and conductivity.

Description

technical field [0001] The invention belongs to the technical field of surface microcrack diagnosis, and in particular relates to a preparation process and application of a water-based nano-coating material and a microcrack diagnosis circuit. Background technique [0002] At present, in order to diagnose surface microcracks, the method of embedding thin metal wires in materials is mainly used. The shortcoming of this scheme is 1: the strength of existing thin metal wire is better than matrix material, so when material cracks, thin metal wire does not necessarily break. The error rate of detection by conductive signal and RF signal reaches about 40%. 2. In order to ensure that the fracture of the matrix material and the thin metal wire are broken simultaneously, the diameter of the metal wire is required to be very thin, and the preparation of the metal wire and the implantation of the metal wire into the matrix material are difficult to operate. When metal wire is used as ...

AI Technical Summary

Problems solved by technology

The disadvantage of this solution is 1: the strength of the existing thin metal wire is better than that of the base material, so when the material cracks, the thin metal wire does not necessarily break

2. In order to ensure the synchronization of the fracture of the matrix material and the fracture of the fine metal wire, the diameter of the metal wire is required to be very thin, and it is difficult to operate the wire preparation and implantation of the metal wire into the matrix material

[0006] In the conventional method, the added laser direct patterning material is directly filled without any treatment, which affects its use effect, and the formulation involved in practical applications usually contains other fillers. The performance of laser processing is reduced

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