94results about "Circuit masks composition" patented technology

A printed circuit board or card having plated through-holes is provided wherein plated through-holes are filled with a photocured polymerized composition. Also, a method for fabricating these printed circuit boards or cards is provided. Also provided are compositions and methods of providing carrier films coated with the compositions for use in filling vias or plated through-holes.

The present invention provides a process of etching or plating comprising the steps of: i) ink jet printing an alkali removeable water insoluble hot melt ink jet ink onto a substrate to form a resist image; ii) etching or plating the substrate in an aqueous acid medium; and iv) removing the resist image with an aqueous alkali.

The present disclosure relates to a solvent-containing dry film and a method for applying a dry film on a substrate. The dry film includes a carrier and a resin layer. The resin layer contains a resin composition and a solvent and the solvent is present in a total amount of at least 5 wt % based on the total weight of the resin layer. The dry film of the present invention can be applied onto a substrate without the use of a prior art vacuum lamination apparatus. The application process is simple and is more cost-efficient than the prior art techniques.

The invention relates to a method of forming conductive lines and similar features. A print-patterned structure may be used as a self-aligned etch and deposition mask. A method of forming conductive lines and other similar features over a plurality of layers comprises forming a print-patterned structure over a first layer. The print-patterned structure is used as an etch mask to expose a portion of a second layer. A seed layer is formed over the exposed portion of the second layer, using the print-patterned structure as a deposition mask. Conductive lines or other features may be formed, for example, by electroplating using the seed layer as a contact pad and the print-patterned structure as deposition mask. The present invention is particularly useful in the formation of features for solar cells and the like where the print-patterned structure may be used to form high aspect ratio features.

An objective of the present invention is to provide ink which is best suited for inkjet printing of a printed substrate. The ink is a photo polymerizing type water-base ink including at least a colorant, a photo polymerization resin, a photo initiator, and a water-base solvent. The photo polymerization resin includes oligomer particles in an emulsion state and monomers which reside in the oligomer particles. The water-base ink contains, with content ratio in terms of the percentage weight, 5% of ethyleneglycol, and between 0.1% to 10% of 2-pyrodoline and N-acrylonitrile morpholine combined.

The present invention relates to a thiol compound represented by formula (1): wherein R1, R2 and n have the same meanings as in the specification, method for producing the compound, and to a photosensitive composition and a black matrix resist composition using the same which have high sensitivity and excellent property of retaining a line width in fine line patterns at the time of alkaline development, that is, being excellent in development latitude.

The present invention provides a photosensitive resin composition which contains: a binder polymer that has a structural unit derived from a (meth)acrylic acid, a structural unit derived from styrene or α-methyl styrene, and a structural unit derived from benzyl (meth)acrylate; a photopolymerizable compound containing a first bisphenol di(meth)acrylate which has an ethyleneoxy group and a propyleneoxy group, and wherein the number of structural units of the ethyleneoxy group is 1-20 and the number of structural units of the propyleneoxy group is 2-7, with the total number of structural units of the ethyleneoxy group and the propyleneoxy group being more than 10; and a photopolymerization initiator.

A process for etching a metal or alloy surface which comprises applying an etch-resist ink by ink jet printing to selected areas of the metal or alloy, solidifying the etch-resist ink without the use of actinic light and / or particle beam radiation and then removing the exposed metal or alloy by a chemical etching process wherein the etch-resist ink comprises the components:A) 60 to 100 parts carrier vehicle comprising one or more components which contain at least one metal chelating group;D) 0 to 40 parts colorant; andE) 0 to 5 parts surfactant;wherein the ink has a viscosity of not greater than 30 cPs (mPa·s) at the firing temperature, all parts are by weight and the total number of parts A)+B)+C)=100.

A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.

This positive photoresist composition is a positive photoresist composition for exposing to light having one or more wavelengths selected from g-rays, h-rays and i-rays, comprising: (A) a compound which generates an acid under irradiation with active rays or radiation, and (B) a resin whose solubility in an alkali is enhanced by an action of an acid, wherein the component (A) contains an onium salt (A1) having a naphthalene ring in the cation moiety.

The present invention provides a process of etching or plating comprising the steps of: i) ink jet printing an alkali removeable water insoluble hot melt ink jet ink onto a substrate to form a resist image; ii) etching or plating the substrate in an aqueous acid medium; and iv) removing the resist image with an aqueous alkali.

An ink composition for ink jet printing is provided which gives a cured object excellent in adhesion to metallic plates, resistance to etchants, and alkali removability and can be stably ejected with an ink jet apparatus. The ink jet composition for etching resists has a viscosity at 25° C. of 3-50 mPa s and includes monomers comprising: either a polymerizable phosphoric ester compound represented by general formula (I); a polyfunctional monomer having two or more ethylenic double-bond groups per molecule and having no phosphoric ester group, the content of the ethylenic double-bond groups being 4×10−3 to 8×10−3 mol / g; and a monofunctional monomer having one ethylenic double-bond group per molecule and having neither phosphoric ester group nor carboxy group.In the formula, X represents C1-3 alkylene, Y represents C2-3 alkylene, and R represents hydrogen or methyl.