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94results about "Circuit masks composition" patented technology

Ink-jet ink composition for etching resist

An ink composition for ink jet printing is provided which gives a cured object excellent in adhesion to metallic plates, resistance to etchants, and alkali removability and can be stably ejected with an ink jet apparatus. The ink jet composition for etching resists has a viscosity at 25° C. of 3-50 mPa s and includes monomers comprising: either a polymerizable phosphoric ester compound represented by general formula (I); a polyfunctional monomer having two or more ethylenic double-bond groups per molecule and having no phosphoric ester group, the content of the ethylenic double-bond groups being 4×10−3 to 8×10−3 mol / g; and a monofunctional monomer having one ethylenic double-bond group per molecule and having neither phosphoric ester group nor carboxy group.In the formula, X represents C1-3 alkylene, Y represents C2-3 alkylene, and R represents hydrogen or methyl.
Owner:NISSHIN STEEL CO LTD +1

Flowable compositions and use in filling vias and plated through-holes

A printed circuit board or card having plated through-holes is provided wherein plated through-holes are filled with a photocured polymerized composition. Also, a method for fabricating these printed circuit boards or cards is provided. Also provided are compositions and methods of providing carrier films coated with the compositions for use in filling vias or plated through-holes.
Owner:IBM CORP

Method of Forming Conductive Lines and Similar Features

A print-patterned structure may be used as a self-aligned etch and deposition mask. A method of forming conductive lines and other similar features over a plurality of layers comprises forming a print-patterned structure over a first layer. The print-patterned structure is used as an etch mask to expose a portion of a second layer. A seed layer is formed over the exposed portion of the second layer, using the print-patterned structure as a deposition mask. Conductive lines or other features may be formed, for example, by electroplating using the seed layer as a contact pad and the print-patterned structure as deposition mask. The present invention is particularly useful in the formation of features for solar cells and the like where the print-patterned structure may be used to form high aspect ratio features.
Owner:PALO ALTO RES CENT INC

Etching or plating process and resist ink

The present invention provides a process of etching or plating comprising the steps of: i) ink jet printing an alkali removeable water insoluble hot melt ink jet ink onto a substrate to form a resist image; ii) etching or plating the substrate in an aqueous acid medium; and iv) removing the resist image with an aqueous alkali.
Owner:SUN CHEM CORP

Curable composition, film, and method of producing film

Provided is a curable composition, including a polymerization initiator; a polymerizable compound; and an internal addition type release agent having a hydrophilic functional group, in which the internal addition type release agent is prevented from being unevenly distributed in a gas-liquid interface of the curable composition.
Owner:CANON KK

Solvent-containing dry film and method for applying the same on a substrate

The present disclosure relates to a solvent-containing dry film and a method for applying a dry film on a substrate. The dry film includes a carrier and a resin layer. The resin layer contains a resin composition and a solvent and the solvent is present in a total amount of at least 5 wt % based on the total weight of the resin layer. The dry film of the present invention can be applied onto a substrate without the use of a prior art vacuum lamination apparatus. The application process is simple and is more cost-efficient than the prior art techniques.
Owner:ETERNAL MATERIALS CO LTD

Photosensitive resin composition, cured product thereof, and printed wiring board

Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent, a coloring agent that is in a complementary color relation with the perylene coloring agent, a carboxyl group-containing resin, a compound that contains two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator.
Owner:TAIYO INK MFG

Water-base ink, method of manufacturing the ink, and method of printing using the ink

An objective of the present invention is to provide ink which is best suited for inkjet printing of a printed substrate. The ink is a photo polymerizing type water-base ink including at least a colorant, a photo polymerization resin, a photo initiator, and a water-base solvent. The photo polymerization resin includes oligomer particles in an emulsion state and monomers which reside in the oligomer particles. The water-base ink contains, with content ratio in terms of the percentage weight, 5% of ethyleneglycol, and between 0.1% to 10% of 2-pyrodoline and N-acrylonitrile morpholine combined.
Owner:SEIKO EPSON CORP

Photosensitive element, method for forming resist pattern, and method for producing printed circuit board

The invention relates to a photosensitive element comprising a support film and a photosensitive layer derived from a photosensitive resin composition formed on the support film, wherein the support film haze is 0.01-1.5%, the total number of particles with diameters of 5 μm and larger and aggregates with diameters of 5 μm or larger in the support film is no greater than 5 / mm2, the photosensitive layer contains a binder polymer, a photopolymerizable compound with an ethylenically unsaturated bond and a photopolymerization initiator, and the thickness T of the photosensitive layer and the absorbance A of the photosensitive layer at 365 nm satisfies the relationship represented by inequality (I):0.001≦A / T≦0.020  (I).
Owner:RESONAC CORP

Thiol Compound And Photosensitive Composition Using The Same

The present invention relates to a thiol compound represented by formula (1): wherein R1, R2 and n have the same meanings as in the specification, method for producing the compound, and to a photosensitive composition and a black matrix resist composition using the same which have high sensitivity and excellent property of retaining a line width in fine line patterns at the time of alkaline development, that is, being excellent in development latitude.
Owner:SHOWA DENKO KK

Resist composition

There is provided a resist composition used for the production of printed boards, which comprises (A) a resin component, (B) a photopolymerization initiator, (C) water and (D) an organic solvent, wherein the organic solvent (D) contains: (D-1) at least one organic solvent selected from the group consisting of an α-hydroxycarboxylate ester, a β-alkoxycarboxylate ester, a 1,3-diol compound and a 1,3-diol compound derivative, and (D-2) an organic solvent having a hydroxyl group other than (D-1).
Owner:SHOWA DENKO KK

Ultraviolet light block and photocatalytic materials

Nanoscale UV absorbing particles are described that have high UV absorption cross sections while being effectively transparent to visible light. These particles can be used to shield individuals from harmful ultraviolet radiation. These particles can also be used in industrial processing especially to produce solid state electronic devices by creating edges of photoresist material with a high aspect ratio. The UV absorbing particles can also be used as photocatalysts that become strong oxidizing agents upon exposure to LV light. Laser pyrolysis provides an efficient method for the production of suitable particles.
Owner:NANOGRAM

Ink jet printing process for etching metal and alloy surfaces

A process for etching a metal or alloy surface which comprises applying an etch-resist ink by ink jet printing to selected areas of the metal or alloy, solidifying the etch-resist ink without the use of actinic light and / or particle beam radiation and then removing the exposed metal or alloy by a chemical etching process wherein the etch-resist ink comprises the components:A) 60 to 100 parts carrier vehicle comprising one or more components which contain at least one metal chelating group;D) 0 to 40 parts colorant; andE) 0 to 5 parts surfactant;wherein the ink has a viscosity of not greater than 30 cPs (mPa·s) at the firing temperature, all parts are by weight and the total number of parts A)+B)+C)=100.
Owner:FUJIFILM IMAGING COLORANTS

Positive photoresist composition, thick film photoresist laminate, method for producing thick film resist pattern, and method for producing connecting terminal

This positive photoresist composition is a positive photoresist composition for exposing to light having one or more wavelengths selected from g-rays, h-rays and i-rays, comprising: (A) a compound which generates an acid under irradiation with active rays or radiation, and (B) a resin whose solubility in an alkali is enhanced by an action of an acid, wherein the component (A) contains an onium salt (A1) having a naphthalene ring in the cation moiety.
Owner:TOKYO OHKA KOGYO CO LTD

Hot melt compositions with improved etch resistance

Hot melt compositions include non-aromatic cyclic (alkyl)acrylates and low acid number waxes. Upon application of actinic radiation, the hot melt compositions cure to form resists. They may be stripped from substrates with high alkaline strippers. The hot melt compositions may be used in the manufacture of printed circuit boards and photovoltaic devices.
Owner:ROHM & HAAS ELECTRONICS MATERIALS LLC

Ink-jet ink composition for etching resist

An ink composition for ink jet printing is provided which gives a cured object excellent in adhesion to metallic plates, resistance to etchants, and alkali removability and can be stably ejected with an ink jet apparatus. The ink jet composition for etching resists has a viscosity at 25° C. of 3-50 mPa s and includes monomers comprising: either a polymerizable phosphoric ester compound represented by general formula (I); a polyfunctional monomer having two or more ethylenic double-bond groups per molecule and having no phosphoric ester group, the content of the ethylenic double-bond groups being 4×10−3 to 8×10−3 mol / g; and a monofunctional monomer having one ethylenic double-bond group per molecule and having neither phosphoric ester group nor carboxy group.In the formula, X represents C1-3 alkylene, Y represents C2-3 alkylene, and R represents hydrogen or methyl.
Owner:NISSHIN STEEL CO LTD +1

Photosensitive Resin Composition

Disclosed are: a photosensitive resin composition having excellent chemical resistance, excellent adhesion to ITO films, and excellent storage stability; and a photosensitive resin laminate comprising the photosensitive resin composition. The photosensitive resin composition comprises (A) 40 to 90% by mass of an alkali-soluble resin, (B) 5 to 50% by mass of a compound having an ethylenically unsaturated double bond, (C) 1 to 20% by mass of a photopolymerization initiator, (D) 0.001 to 2.5% by mass of an epoxysilane compound, and (E) 0.005 to 1.0% by mass of a thiol compound.
Owner:ASAHI KASEI KK

Method of manufacturing an inlet member for an electronic tag

In order to offer the technology which can form the pattern of the antenna of the inlet for electronic tags accurately and cheaply, the resist layer at the time of forming the pattern of an antenna by chemical etching is formed using a photogravure printing machine. Let the extending direction of region 16C which has the minimum width in the height of the front surface of a gravure plate be an opposite direction to the direction of rotation of a gravure plate (a doctor's relative direction of movement seen from the gravure plate). The radius of curvature of an inner circumference of the curved part in region 16B is made larger than the radius of curvature of a periphery. The outer edge of region 16D is formed so that it may become forward tapered shape-like toward position D, so that the width of region 16D may become larger than the width of region 16C in position D which the end of height attains.
Owner:RENESAS TECH CORP

Improved hot melt compositions

Hot melt compositions include acid waxes and acrylate functional monomers free of acid groups. Upon application of actinic radiation, the hot melt compositions cure to form and etch resist. The hot melt compositions may be used in the manufacture of printed circuit boards, optoelectronic and photovoltaic devices.
Owner:SUN CHEM CORP
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