Photosensitive resin composition for permanent mask resist, photosensitive element, method for forming resist pattern, and method for producing printed wiring board

A technology of photosensitive resin and resist, which is applied in the fields of printed circuit manufacturing, circuit mask manufacturing, photoplate making process of patterned surface, etc., can solve the problems such as difficult to form resist image, and achieve increased exposure margin , good reproducibility and excellent heat resistance

Inactive Publication Date: 2015-04-15
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the conventional resist formation method by screen printing, it is difficult to form a high-definition resist image because bleeding, dripping, etc. occur during printing.

Method used

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  • Photosensitive resin composition for permanent mask resist, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
  • Photosensitive resin composition for permanent mask resist, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
  • Photosensitive resin composition for permanent mask resist, photosensitive element, method for forming resist pattern, and method for producing printed wiring board

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Embodiment 1～12 and comparative example 1～5

[0145] After compounding the composition according to the compounding composition (unit: parts by mass) shown in the following Table 1, carbitol acetate was added so that the solid content concentration became 70 mass %, and the photosensitive resin composition was obtained. In addition, the compounding quantity of each component in following Table 1 shows the compounding quantity of a solid content.

[0146] [Table 1]

[0147]

[0148] In addition, the details of each component in Table 1 are as follows.

[0149] (A) Ingredients

[0150] EXP-2810: cresol novolak type acid-modified epoxy acrylate (weight average molecular weight 7000, acid value 65 mgKOH / g, manufactured by DIC Corporation),

[0151] ZAR-1753: bisphenol A type acid-modified epoxy acrylate (weight average molecular weight 10000, acid value 70mgKOH / g, manufactured by Nippon Kayaku Co., Ltd.)

[0152] UXE-3024: Urethane-modified bisphenol A acid-modified epoxy acrylate (weight-average molecular weight 10,000...

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Abstract

The present invention provides a photosensitive resin composition for a permanent mask resist, the resin composition containing (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerization initiator and (C) a nitroxyl compound. The nitroxyl compound (C) contains a compound having a specific structure.

Description

technical field [0001] The present invention relates to a photosensitive resin composition for a permanent mask resist, a photosensitive element, a method for forming a resist pattern, and a method for producing a printed wiring board. Background technique [0002] Conventionally, permanent mask resists in the manufacture of printed wiring boards have been produced by screen printing thermal or ultraviolet curable resist inks. In recent years, with the high integration of electronic devices, high-definition wiring patterns and insulating patterns in printed wiring boards are required. However, in the conventional resist forming method by screen printing, it is difficult to form a high-definition resist image because bleeding, dripping, and the like occur during printing. Therefore, in order to form a high-definition resist image, a resist image forming method by photolithography has been developed. [0003] The resist image forming method by photolithography is specificall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027H05K3/28
CPCH05K3/287G03F7/027H05K3/0076H05K1/0346G03F7/0388G03F7/038
Inventor 赖华子太田绘美子村上泰治名越俊昌田中惠生
Owner HITACHI CHEM CO LTD
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