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Improved hot melt compositions

A composition and substrate technology, applied in the direction of photoengraving process, instruments, circuit covers, etc. on the pattern surface, can solve problems such as defective electronic devices, damaged adhesion or metal plating, etc., and achieve good image clarity, good Effects of low flow mobility

Active Publication Date: 2011-01-05
SUN CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Any residue left on the PCB after stripping may damage the bond or metallization, resulting in defective electronics

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-7

[0062] Inkjet Resist Composition

[0063] Table 1

[0064] formula

1

2

3

4

5

6

7

monomer

Isobornyl Acrylate

40wt%

40wt%

Tripropylene glycol diacrylate

45wt%

35wt%

80wt%

Trimethylolpropane Ethoxylation

Triacrylate

50wt%

45wt%

80wt%

Butyl acrylate

60wt%

50wt%

2-Hydroxypropyl Acrylate

30wt%

20wt%

free radical initiator

Isopropylthioxanthone

2wt%

10wt%

2.5wt%

5wt%

Hydroxycyclohexyl phenyl ketone

3wt%

2.5wt%

10wt%

2.5wt%

5wt%

2-tert-butylanthraquinone

5wt%

2.5wt%

Benzoin isopropyl ether

5wt%

acid wax

montan ...

Embodiment 8

[0068] Application of Resist in Printed Circuit Board

[0069] The resist compositions in Examples 1-7 were selectively sprayed from piezoelectric drop-on-demand (Spectra TM Se-128) onto seven FR4 epoxy boards with copper clad thickness ranging from 15 μm to 30 μm. Inkjet temperature from 65°C to 95°C. After the resist composition was selectively applied to the respective panels, the composition was exposed to 150 mJ / cm of a Fusion D bulb operating at 120 W / cm 2 to 200mJ / cm 2 in ultraviolet light. All resists are expected to cure.

[0070] The hardness of all resists was measured using the pencil hardness test of ASTM D3363-05. Hardness values ​​are expected to be 3H or higher. The hardest value available is 5H and the softest is 1H.

[0071] Each board was then immersed in an aqueous etching solution of 4N copper chloride and etched at 50° C. for 5 minutes to etch away the copper portion not covered with the etchant resist. Copper was etched to a depth of 38 μm. The ...

Embodiment 9

[0074] Application of Resist in Semiconductor

[0075] Seven doped monocrystalline silicon semiconductor wafers with pn junctions were provided. The front or emitter layer of a doped monocrystalline silicon wafer is textured and n++ doped. The backside is doped with aluminum p++. The region between the n++ doped emitter layer and the p++ doped backside is n+ doped. The front side of the doped monocrystalline silicon wafer is covered with a 500nm thick layer of silicon nitride. The silicon nitride is insulating and acts as an antireflection layer.

[0076] Each anti-reflection layer of the silicon wafer was selectively covered with one of the seven resist compositions in Examples 1-7, and a circuit was formed by a drop-on-demand inkjet printer at 80°C to 100°C. The resist composition was deposited with a distance of 3 mm between each circuit. A resist is deposited on the insulating layer to a thickness of 10 μm. The resist is then exposed to 150mJ / cm of fusion UV tape sys...

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Abstract

Hot melt compositions include acid waxes and acrylate functional monomers free of acid groups. Upon application of actinic radiation, the hot melt compositions cure to form and etch resist. The hot melt compositions may be used in the manufacture of printed circuit boards, optoelectronic and photovoltaic devices.

Description

technical field [0001] The present invention relates to hot melt compositions which cure upon exposure to actinic radiation for use as plating resists and which are readily peelable from substrates. More particularly, the present invention relates to hot melt compositions useful as plating and etch resists which cure upon exposure to actinic radiation, which are readily peelable from substrates, and which contain and do not contain acid groups. Ester monomer bound high acid number wax. Background technique [0002] Hot melts are solid at room temperature, but exist in a liquid state in inkjet printing devices at elevated operating temperatures. At inkjet operating temperatures, droplets of liquid hot melt are ejected from the printing device, and when the droplets contact the surface of the printed material, they harden to form a predetermined pattern of droplets. [0003] Hot melts are used in both direct and transfer printing processes. The hot melt is usually cast as a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L33/04C08K5/00C08F220/10G03F7/027G03F7/00
CPCC09D11/32H05K2203/122H05K3/0076H05K3/108H05K3/061C09D11/101G03F7/0045
Inventor K·J·奇特汉姆T·C·舒特
Owner SUN CHEM CORP
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