48results about How to "High plating rate" patented technology

Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.

Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.

Novel methods of electroless plating are described. Catalyst coatings can be applied within microchannel apparatus. Various reactions, including combustion and steam reforming, can be conducted over electroless catalyst coatings.

The invention discloses a manufacturing method of a circuit board taking a boss as a bonding pad. The manufacturing method comprises the following steps of cutting and reducing copper; drilling a hole; carrying out copper deposition; pressing a film; exposing and developing; carrying out circuit electroplating; pressing the film; exposing and developing; electroplating the bonding pad; demouldingand removing copper; laminating an insulating layer; and grinding: grinding a surface of the insulating layer till that the bonding pad is exposed, and forming a top layer / bottom layer bonding pad through windowing. A thermosetting insulating material is adopted, cost is low, silk-screen is not needed, green and environmental protection performance is achieved, and simultaneously, a manufacturingprocess is simple, operation is easy, the bonding pad is directly manufactured through grinding, the bonding pad with a small area and a large density can be conveniently manufactured, a manufacturedcircuit board is smooth in surface, precise packaging is facilitated, circuit attachment is firm, and quality is good.

The invention discloses a mobile phone coating film prepared by sputtering a high-entropy liquid metal alloy target material on a mobile phone. The mobile phone coating film has high hardness, strongcorrosion resistance and oxidation resistance, good adhesion to a substrate, ultra-high plating rate, high productivity and high yield.

A section of piping for use in transporting abrasive slurries which has improved abrasion resistance is shown. The piping has a tubular metal body with an exposed exterior surface and a generally cylindrical internal surface. The internal surface of the tubular metal body is uniformly plated with a deposit of chromium to give the section of piping a hard chromium case which resists abrasion. The deposit of chromium is applied by exposing the internal surface of the tubular metal body to an aqueous electrolyte solution at a current density and at a plating temperature sufficient to form a chromium deposit of desired thickness on the internal surface.

Provided is an electroless copper plating solution that forms a highly adhesive conductive film regardless of the degree of roughness of the resin surface and also has a fast deposition rate. The electroless copper plating solution of the present invention is characterized in that it contains guanosine. The electroless copper plating solution of the present invention preferably also contains copper ion, reducing agent, copper ion complexing agent, and pH adjuster.

Novel methods of electroless plating are described. Catalyst coatings can be applied within microchannel apparatus. Various reactions, including combustion and steam reforming, can be conducted over electroless catalyst coatings.

A section of piping for a concrete pump delivery system which has improved abrasion resistance and ease of cleaning is shown. The piping has a tubular metal body with an exposed exterior surface and a generally cylindrical internal surface. The internal surface of the tubular metal body is plated with a deposit of chromium to give the section of piping a hard chromium case which resists abrasion. The deposit of chromium is applied by exposing the internal surface of the tubular metal body to an aqueous electrolyte solution at a current density and at a plating temperature sufficient to form a chromium deposit of desired thickness on the internal surface.

The invention provides an electroplating PC / ABS (polycarbonate / acrylonitrile-butadiene-styrene) alloy material and a preparation method thereof. The electroplating PC / ABS alloy material comprises the following components in parts by weight: 30-70 parts of PC, 40-60 parts of ABS, 5-30 parts of styrene-acrylonitrile copolymer, 5-30 parts of butadiene graft rubber, 1-3 parts of compatilizer, 1-10 parts of heat-resistance modifier and 0.5-1 part of processing assistant. The alloy material provided by the invention has the advantages of favorable electroplating properties, excellent mechanical properties and favorable heat resistance, and can be used for designing automobile internal and external ornaments, including heat dissipation grids, door grips, vehicle logos, instrument panel decorating strips and the like.

Electroplating apparatus agitates electrolyte to provide high velocity fluid flows at the surface of a wafer. The apparatus includes a paddle which provides uniform high mass transfer over the entire wafer, even with a relatively large gap between the paddle and the wafer. Consequently, the processor may have an electric field shield positioned between the paddle and the wafer for effective shielding at the edges of the wafer. The influence of the paddle on the electric field across the wafer is reduced as the paddle is spaced relatively farther from the wafer.

The invention relates to the technical field of chemical plating, in particular to an activator, a preparation method and a preparation method of carbon fiber composite material. The activator is prepared from the following components of a dispersing agent, sodium citrate, nickel salt and a boron-containing compound, wherein the boron-containing compound is potassium borohydride or sodium borohydride, and the PH value of the activator is 9-11. The dispersing agent in the activator can prevent aggregation of carbon fibers in water solution and re-aggregation after the carbon fibers are activated and washed, the activator has a procedure integrated function, the carbon fibers are only needed to be placed in the activator, the procedures of dispersing, sensitizing and activating of the carbonfibers can be completed, so that traditional complicated steps of dispersion, sensitization and activation are simplified. The activator exists in an alkaline condition and is relatively high in stability, so that the activating effect is good, the chemical plating rate is high, and the practicability is good. In addition, the activator uses cheap and easily available nickel instead of noble metal palladium or silver, so that the activation cost is saved.

Novel methods of electroless plating are described. Catalyst coatings can be applied within microchannel apparatus. Various reactions, including combustion and steam reforming, can be conducted over electroless catalyst coatings.

A plating apparatus includes a plating tank for storing a plating liquid, and applies a magnetic alloy plating to a shaft-shaped member immersed in the plating liquid by using the shaft-shaped member as a cathode. The plating apparatus further includes a rotable member configured to rotate the shaft-shaped member as a rotary shaft; annular shielding tools mounted on the outer peripheral surface of the shaft-shaped member; a plating liquid discharge nozzle including plating liquid discharge ports which are provided to face the shaft-shaped member so as to avoid the shielding tools; and an anode provided around the shaft-shaped member and the plating liquid discharge nozzle.

Stable electroless copper plating baths include di-cation viologen compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.