37results about How to "High frequency performance" patented technology

An integrated circuit (IC) package for an IC device, and a method of making the same. The IC package includes an interconnect assembly with at least one printed compliant layer, a plurality of first contact members located along a first major surface, a plurality of second contact members located along a second major surface, and a plurality of printed conductive traces electrically coupling a plurality of the first and second contact members. The compliant layer is positioned to bias at least the first contact members against terminals on the IC device. Packaging substantially surrounds the IC device and the interconnect assembly. The second contact members are accessible from outside the packaging.

A test socket that provides a temporary interconnect between terminals on an integrated circuit (IC) device and contact pads on a test printed circuit board (PCB). The test socket includes a compliant printed circuit and a socket housing. The compliant printed circuit includes at least one compliant layer, a plurality of first contact members located along a first major surface, a plurality of second contact members located along a second major surface, and a plurality of conductive traces electrically coupling the first and second contact members. The compliant layer is positioned to bias the first contact members against the terminals on the IC device and the second contact members against contact pads on the test PCB. The socket housing is coupled to the compliant printed circuit so the first contact members are positioned in a recess of the socket housing sized to receive the IC device.

A probe assembly that acts as a temporary interconnect between terminals on an IC device and a test station. The probe assembly includes a plurality of stud bumps arranged on a first surface of a substrate in a configuration corresponding to the terminal on the IC device. The stud bumps include a shape adapted to temporarily couple with the terminals on the IC device. A plurality of conductive traces on the substrate electrically couple the stud bumps with the test station.

A system and methods are provided for testing anode integrity during vehicle operation. In one example described, the system and methods allow for anode leak tests during vehicle operation based on a flow of hydrogen into a fuel cell, the flow of hydrogen into the fuel cell maintaining the vehicle power while the leak test is performed. The methods further allow for operational adjustments responsive to the leak test, which may include controlling the vehicle power to manage vehicle operations in the presence of a hydrogen leak in some instances.

The invention relates to a noise-suppressing earphone, which comprises an earphone body, a loudspeaker, a microphone and a signal processor, wherein the earphone body has a chamber and a sound-transmitting tube; the loudspeaker and the microphone are both arranged in the chamber; sound signals are provided by the loudspeaker and outputted by the sound-transmitting tube; the microphone is positioned beside the loudspeaker and receives the sound signals in the chamber; the signal processor is electrically connected with the loudspeaker and the microphone at the same time; the signal processor provides electric signals for the loudspeaker so as to be converted into the sound signals; the microphone converted the received sound signals into the electric signals so as to be transmitted to the signal processor; and aiming at the part of the sound signals which is defined as noise, the signal processor outputs reverse-phase signals added to the loudspeaker.

A structure of an optical device with the surface emitting type and a method to form the optical device are disclosed, where the optical device is able to operate in high frequencies. The device provides a lower DBR structure, an active layer, a current injection layer, a current blocking layer, and an upper DBR structure on a GaAs substrate. The current blocking layer, horizontally putting the current injection layer therebetween, are an un-doped GaInP grown at a temperature between 500 to 600° C. and an un-doped AlGaInP grown at a temperature between 500 to 650° C. Because the un-doped current blocking layer shows the high resistivity for both electrons and holes, the parasitic capacitance in the current blocking layer becomes small.

An improved HEMT formed from a GaN material system is disclosed which has reduced gate leakage current relative to known GaN based HEMTs and eliminates the problem of current constrictions resulting from deposition of the gate metal over the step discontinuities formed over the gate mesa. The HEMT device is formed from a GaN material system. One or more GaN based materials are layered and etched to form a gate mesa with step discontinuities defining source and drain regions. In order to reduce the leakage current, the step discontinuities are back-filled with an insulating material, such as silicon nitride (SiN), forming a flat surface relative to the source and drain regions, to enable to the gate metal to lay flat. By back-filling the source and drain regions with an insulating material, leakage currents between the gate and source and the gate and drain are greatly reduced. In addition, current constrictions resulting from the deposition of the gate metal over a step discontinuity are virtually eliminated.

An electronic tag testing device and method includes a feeding mechanism, a retaining mechanism and an R/W system. The feeding mechanism has a belt conveyer, the retaining mechanism has moving-guiding boards, guiding board-fixing bases and guiding board-adjusters, wherein one end of the moving-guiding board is connected to the guiding board-adjuster for adjusting the position of the moving-guiding board, one end of the guiding board-adjuster is connected to the guiding board-fixing base, the guiding board-fixing base is fixed under the belt conveyer for fixing the moving-guiding board, and the moving-guiding board is mounted on the belt conveyer of the feeding mechanism, and the R/W system includes a reader and an electronic tag, wherein the electronic tag is attached to an object to be measured, the reader is mounted on the conveyer mechanism for reading the data radiated from the electronic tag, thereby a signal strength from the electronic tag as located at each portion on the outer surface of the object to be tested is detected to find a best attaching position for the electronic tag.