40results about How to "Favorable improvement plan" patented technology

The invention presents a method for balancing states of charge of N individual battery cells of a battery, which method first of all comprises the step of determining the individual cell capacities Capn of all n=1 to N cells (S1). This is followed by the determination of a k-th cell having the smallest cell capacity Capk (S2) and the determination of the individual states of charge SOCn (S3). The depth of discharge DODn is then determined (S4). In a further step, a target depth of discharge DODtarget,n is then determined, where D0Dtarget,n = Capn / 2+DODk-Capk / 2 (S5). The target depth of discharge is used to determine the target state of charge SOCtarget,n from SOCtarget,n = 1-DODtarget,n / Capn (S6). The deviation of the state of charge SOCn of a cell from the target state of charge SOCtarget,n thereof is then determined from [delta]SOCtarget,n=SOCn-SOCtarget,n (S7). In a further step, the minimum deviation [delta]SOCmin of the state of charge SOCn of a cell from the target state of charge SOCtarget,n thereof is determined from [delta]SOCmin = min ([delta]SOCtarget,n) (S8). At least one of the n=1 to N cells, to which [delta]SOCtarget,n-[delta]SOCmin > X applies, where X is a parameter with X>=0, is discharged (S9). If [delta]SOCtarget,n-[delta]SOCmin<=X now applies to all cells, the method is ended (S10 / S11). However, if this does not apply to all cells, the method returns to the step of determining the individual states of charge (S3) and the following steps are repeated (S4-S9).

An apparatus and a method are provided for cutting, cutting-out and perforating web or sheet substrates (100). The apparatus (10) has a laser cutting device (1) disposed above or below a transport plane (E) for processing a substrate (100). The laser cutting device (1) includes at least one laser array (2) extending over the width of the substrate (100) and having individually drivable lasers. The laser array is composed, in particular, of a plurality of individual arrays (3). The lasers are, in particular, constructed as vertical-cavity surface-emitting lasers (VCSEL). In this way, processing of the substrate at high transport speeds is made possible.

The invention relates to a windshield wiping device (10), especially for a motor vehicle, which device comprises a plurality of parts (12, 14, 16, 18, 20), namely in particular a support tube (12) that carries at least one wiper bearing (14) which receives at least one wiper shaft (16). The windshield wiping device (10) is also provided with a transmission (20) that sets the wiper shaft (16) in radial motion by means of a drive (18). According to the invention, the device is provided with a deformation element (38, 42) which can be deformed by the impact of a defined axial force (F) on one of the parts (12, 14, 16, 18, 20) of the windshield wiping device (10).

The invention relates to a device (150) for punching labels (10) from a substrate web (1), wherein the substrate web (1) has a carrier layer (3) and a label layer (12), the device has A punching unit (11) for punching labels. According to the invention, the punching device (11) has a detachment device (2) for separating the label layer (12) from the carrier layer (3), a metallic non-suction rotary A cooperating punching belt (4) conveying the label layer (12) during the process, and a relamination device (7) for reconnecting the label layer (12) provided with punching to the carrier layer (3). The invention also relates to a method for punching a self-adhesive label (10). Thanks to the invention, a thin carrier layer (3) can be used and it is ensured that the carrier layer is not damaged during punching.