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Device and method for cutting with laser array

A laser array and laser cutting technology, applied in auxiliary devices, laser welding equipment, welding/cutting auxiliary equipment, etc., can solve problems such as difficult matching of different tape widths or sheet specifications, and achieve reduced cost, high reliability and durability. sexual effect

Active Publication Date: 2014-05-21
GALLUS DRUCKMASCHINEN GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A further disadvantage is that incident laser systems whose mirrors are deflected by motors have a limited working area due to the limited projection area and are difficult to adapt to different web widths or sheet formats of the substrate

Method used

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  • Device and method for cutting with laser array
  • Device and method for cutting with laser array
  • Device and method for cutting with laser array

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Experimental program
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Embodiment Construction

[0023] figure 1 A cutting device 10 is shown for processing strip-shaped substrates 100 . The cutting device 10 has a laser cutting device 1 , a conveying device 5 and a machine control device 6 . The strip-shaped substrate 100 is moved along the transport direction T alongside the laser cutting device 1 by the transport device 15 . In this case, the substrate 100 can be processed by the laser cutting device 1 in the transport plane E, for example by ablation, plunging, contouring or engraving. In this case, the processing is carried out by the laser array 2 of the laser cutting device 1 . The cutting data required for controlling the laser array 2 can be stored in the machine control 6 , can be entered into the machine control, or can be obtained from the machine control via corresponding workflow connections.

[0024] exist Figure 2a , 2b The structure of the laser cutting device 1 is further shown in and 2c. The laser array 2 is formed from a plurality of individual ...

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PUM

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Abstract

An apparatus and a method are provided for cutting, cutting-out and perforating web or sheet substrates (100). The apparatus (10) has a laser cutting device (1) disposed above or below a transport plane (E) for processing a substrate (100). The laser cutting device (1) includes at least one laser array (2) extending over the width of the substrate (100) and having individually drivable lasers. The laser array is composed, in particular, of a plurality of individual arrays (3). The lasers are, in particular, constructed as vertical-cavity surface-emitting lasers (VCSEL). In this way, processing of the substrate at high transport speeds is made possible.

Description

technical field [0001] The invention relates to a device for cutting, resection and perforation according to the preamble of claim 1 and a method for cutting, resection and perforation according to claim 10 . Background technique [0002] It is known in the production of folding boxes or labels that individual folding boxes or labels are die-cut from a web-shaped or sheet-shaped substrate. Mechanical die-cutters, such as rotary die-cutters or flat-bed die-cutters, are used for this purpose. Alternatively, it is also disclosed that the cutting is carried out with a laser. Thus, WO 02 / 14069 Al discloses a method for die-cutting self-adhesive labels by means of a laser. Here, a plurality of laser-generated holes in the substrate interact to form cutting lines. [0003] WO 99 / 29496 A1 discloses a device and a method for producing folding boxes, in which, by means of a laser, creases are introduced into the respective folding box, which are followed by the folding edges of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B31B50/25
CPCB23K26/0604B23K26/0846B23K26/0869B23K26/38B23K37/0235B31F1/08B23K26/382B31B50/14B31B50/16B31B50/25B31B2100/00B23K2101/16B23K2103/38B23K2103/50B31D1/02B31D1/026
Inventor D·班格尔
Owner GALLUS DRUCKMASCHINEN GMBH
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