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51results about How to "Excellent high-frequency characteristic" patented technology
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Common mode noise filter and production method therefor
ActiveUS20140191838A1Excellent high-frequency characteristicHigh yieldTransformers/inductances coils/windings/connectionsCoilsElectrical conductorInorganic filler
A common mode noise filter includes a first insulating layer, a first coil conductor on an upper surface of the first insulating layer, a second coil conductor on a lower surface of the first insulating layer, a second insulating layer on the upper surface of the first insulating layer to cover the first coil conductor, a third insulating layer on a lower surface of the second insulating layer to cover the second coil conductor. The first insulating layer contains glass and inorganic filler, and contains pores dispersed therein. The second insulating layer covers the first coil conductor, contains glass and inorganic filler, and contains pores dispersed therein. The third insulating layer covers the second coil conductor, contains glass and inorganic filler, and contains pores dispersed therein. This common mode noise filter has excellent high-frequency characteristics at a high yield rate.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
Electronic device and manufacturing method therefor
ActiveUS20110284912A1Improve performanceExcellent high-frequency characteristicSemiconductor/solid-state device detailsSolid-state devicesElectrical conductorRoom temperature
An electronic device includes a semiconductor substrate, an insulating material-filled layer and a vertical conductor. The semiconductor substrate has a vertical hole extending in a thickness direction thereof. The insulating material-filled layer is a ring-shaped layer filled in the vertical hole for covering an inner periphery thereof and includes an organic insulating material or an inorganic insulating material mainly of a glass and a nanocomposite ceramic. The nanocomposite ceramic has a specific resistance of greater than 1014 Ω·cm at room temperature and a relative permittivity of 4 to 9. The vertical conductor is a solidified metal body filled in an area surrounded by the insulating material-filled layer.
Owner:NAPRA
Perpendicular magnetic recording head for high frequency drive
InactiveUS7646564B2Excellent high-frequency characteristicNarrow widthConstruction of head windingsHeads using thin filmsHigh resistanceElectrical conductor
Embodiments of the invention provide a perpendicular magnetic head with a narrow track and excellent high frequency characteristics. In one embodiment, a recording magnetic head includes coil conductors and magnetic pole pieces putting the same therebetween, in which a main magnetic pole piece is formed into a planar structure and a magnetic film connected with the main magnetic pole piece in a magnetic coupling relation is curved in the direction of the film thickness. Further, a shield material disposed near the main magnetic pole piece is made of a material of higher resistance than that of the material for the read shield.
Owner:WESTERN DIGITAL TECH INC
Relay
InactiveUS7872551B2Excellent high-frequency characteristicHigh positioning accuracyContact mechanismsElectromagnetic relay detailsMechanical engineeringPlunger
A relay includes a contact point block having a support shaft with both ends spanning a contact point base, a plunger having a movable contact at a lower end thereof, and a movable iron piece configured to drive the plunger and to have a plate spring. The relay also includes an electromagnetic unit and a base block having a fixed contact point at a position opposite to the movable contact point. The movable iron piece is supported on the supporting shaft. The plunger is inserted through an operation hole of the contact point base. Upper and lower surfaces of the contact point block are held by the electromagnetic unit and the base block. The electromagnetic unit directly fixes the iron core to an upper surface of the contact point base.
Owner:ORMON CORP
Electrical connector with improved contact arrangement
InactiveUS7435110B2Excellent high-frequency characteristicBalanced transmissionFixed connectionsCoupling protective earth/shielding arrangementsGround contactElectrical connector
An electrical connector (100) has a first end for fitting with another connector and a second end for connecting to a board. The connector comprises an insulative housing (1), a number of contacts (2) and a metal shield (3) enclosing the insulative housing. The insulative housing includes a tongue plate (11) with a number of passageways (110) defined therein for receiving the contacts. The contacts are arranged side by side in the first end and arranged in three parallel rows in the second end. The contacts include signal contact pairs (21) and grounding contacts (22) disposed adjacent to and separating the signal contact pairs. Each signal contact pair includes a first signal contact and a second signal contact being substantially in equal length of the first signal contact. The signal contact pairs have matched impedance for transmitting high-speed signals, thereby canceling any cross talk therebetween.
Owner:HON HAI PRECISION IND CO LTD
High frequency circuit module
ActiveUS20140133117A1Small sizePrevent degradationCross-talk/noise/interference reductionHigh frequency circuit adaptationsElectrical conductorEngineering
A multilayer circuit substrate has a high frequency switch embedded therein. In the multilayer circuit substrate, a first conductive layer that faces a main surface of the high frequency switch through an insulating layer has circuit patterns formed therein so as to be connected to input / output terminals through via conductors. The first conductive layer has an opening pattern in which a ground conductor is not present in a region that faces the main surface of the high frequency switch and that is outside of the circuit patterns. In a third conductive layer disposed outer side of the first conductive layer with respect to the high frequency switch, a ground conductor is formed at least in a region where the main surface of the high frequency switch is projected in the thickness direction.
Owner:TAIYO YUDEN KK
Perpendicular magnetic recording head for high frequency drive
InactiveUS20060203384A1Excellent high-frequency characteristicNarrow track widthConstruction of head windingsRecord information storageHigh resistanceElectrical conductor
Embodiments of the invention provide a perpendicular magnetic head with a narrow track and excellent high frequency characteristics. In one embodiment, a recording magnetic head includes coil conductors and magnetic pole pieces putting the same therebetween, in which a main magnetic pole piece is formed into a planar structure and a magnetic film connected with the main magnetic pole piece in a magnetic coupling relation is curved in the direction of the film thickness. Further, a shield material disposed near the main magnetic pole piece is made of a material of higher resistance than that of the material for the read shield.
Owner:WESTERN DIGITAL TECH INC
High frequency circuit module
ActiveUS20140308906A1Increasing the thicknessImprove shielding effectSemiconductor/solid-state device detailsSolid-state devicesElectronic componentEmbedded electronics
A high frequency circuit module is provided with: a multilayer circuit substrate; a first high frequency switch that switches connection of an antenna; a transmission filter; and reception filters. Either the transmission filter or the reception filters, or both, and the first high frequency switch are embedded in the multilayer circuit substrate, and ground conductors are formed in a conductive layer facing embedded electronic components.
Owner:TAIYO YUDEN KK
Optical transmission module
InactiveUS6927655B2Avoid excessive radiationExcellent high-frequency characteristicMultiple-port networksPrinted circuit assemblingElectrical conductorCoaxial cable
There is provided a thin and small size connector-less optical transmission module M which assures excellent high frequency characteristic. This optical transmission module comprises transmission line substrates and a coaxial cable for connecting these transmission line substrates and is connected to the transmission line substrate via a contact sleeve which is provided with projections fixed to the external conductor of the coaxial cable and projected in the extending direction of the coaxial cable. Since an electromagnetic field mode alleviating portion formed of a dielectric material is provided to the core wire of the coaxial cable, the thin and small size optical transmission module M can assure less amount of radiation of an interference electromagnetic wave, high frequency characteristic through connection with the coaxial cable.
Owner:LUMENTUM JAPAN INC
Semiconductor device and method for fabricating the same
InactiveUS20070117355A1Excellent pinch-off characteristicImprove controllabilitySemiconductor/solid-state device manufacturingSemiconductor devicesDevice materialNitride semiconductors
A semiconductor device includes: a first nitride semiconductor layer having at least one projection on an upper surface thereof; a second nitride semiconductor layer formed on a top surface of the projection of the first nitride semiconductor layer and having a higher carrier concentration than the first nitride semiconductor layer; a first electrode formed on the second nitride semiconductor layer so as to overhang like a canopy and functioning as one of a source and a drain; and a second electrode formed to the side of the projection on the first nitride semiconductor layer and functioning as a gate.
Owner:PANASONIC CORP
Electroacoustic transducer
ActiveUS20160157021A1Improve sound qualityImprove functional propertiesTransducers for sound channels pluralityHeadphones for stereophonic communicationTransducerEngineering
An electroacoustic transducer has a housing, piezoelectric speaker, dynamic speaker, and support member. The piezoelectric speaker includes a vibration plate having a first surface and a second surface on the opposite side of the first surface, as well as a piezoelectric element joined to at least one of the first surface and second surface, and divides the interior of the housing into a first space facing the first surface and a second space facing the second surface. The dynamic speaker is placed in the first space. The support member is constituted by a part of the housing or by a member different from the housing, has a supporting part facing the first surface or second surface, and supports the periphery of the first surface or second surface with the supporting part.
Owner:TAIYO YUDEN KK
Surface joined multi-substrate liquid metal switching device
InactiveUS6872903B2Simplified hermetic sealingDrag minimizationContact surface shape/structureElectrothermal relaysElectrical conductorMain channel
A device and manufacturing method are provided comprising first and second substrates comprising a main channel provided in at least one of the substrates and a first connecting channel provided in at least one of the substrates and in fluid communication with the main channel. The main channel comprising spaced apart electrodes and filling the main channel at least partially with liquid metal. The method further comprising a first heater substrate comprising a first suspended heater element in fluid communication with the first connecting channel with the first suspended heater element operable to cause a fluid non-conductor to separate the liquid metal and selectively interconnect the electrodes and surface joining the first, second, and first heater substrates.
Owner:AGILENT TECH INC
Composition for insulating ceramics and insulating ceramics using the same
InactiveUS20040029701A1Excellent high-frequency characteristicHigh strengthFixed capacitor dielectricSemiconductor/solid-state device detailsSilicon oxideCeramic
An insulating ceramic composition includes a mixture of a ceramic powder containing MgAl2O4 and a glass powder containing 30-60% by mole of silicon oxide on the basis of SiO2 and 20-55% by mole of magnesium oxide on the basis of MgO, and the ceramic powder further includes Mg2SiO4 and TiO2. The insulating ceramic composition can be fired at 1000° C. and co-sintered with Ag and Cu. An insulating ceramic obtained by sintering the insulating ceramic composition has a high Q-factor and is therefore suitable for ceramic multilayer substrates used at high frequencies.
Owner:MURATA MFG CO LTD
Semiconductor package, method and mold for producing same, input and output terminals of semiconductor package
ActiveUS20140077345A1Excellent high-frequency characteristicFirmly groundedSemiconductor/solid-state device detailsSolid-state devicesElectricitySemiconductor package
A semiconductor package according to the present invention includes: a semiconductor element where a high frequency signal is input or output; a planar lead terminal having an end electrically connected to an input terminal or an output terminal of the semiconductor element; an encapsulation resin for encapsulating the lead terminal and the semiconductor element, the lead terminal having another end exposed from the resin; and a ground enhancing metal body encapsulated in the encapsulation resin, having a first main surface facing the lead terminal and a second main surface exposed from the encapsulation resin, wherein the ground enhancing metal body has a shape with a cross section parallel to the second main surface and having a smaller area than an area of the first main surface.
Owner:PANASONIC SEMICON SOLUTIONS CO LTD
ESD protection device
ActiveUS20130168837A1Small parasitic capacitanceExcellent high frequency characteristicSemiconductor/solid-state device detailsSolid-state devicesPhysicsHemt circuits
An ESD protection device includes a semiconductor substrate including input / output electrodes and a rewiring layer located on the top surface of the semiconductor substrate. An ESD protection circuit is provided in the top layer of the semiconductor substrate, and the input / output electrodes are connected to the ESD protection circuit. The rewiring layer includes interlayer wiring lines, in-plane wiring lines, and post-shaped electrodes. First ends of the interlayer wiring lines provided in the thickness direction are connected to the input / output electrodes provided on the top surface of the semiconductor substrate and the second ends are connected to first ends of the in-plane wiring lines extending in the plane direction. The distance between the centers of the first and second post-shaped electrodes is larger than the distance between the centers of the first and second input / output electrodes.
Owner:MURATA MFG CO LTD
Thermosetting resin composition having heat resistance and low dielectric loss characteristics, prepreg using same, and copper clad laminate
ActiveUS20160297967A1High glass transition temperatureReduction factorPrinted circuits stress/warp reductionCircuit susbtrate materialsCross-linkThermal expansion
The present disclosure provides: a thermosetting resin composition comprising: (a) bisphenol M-type epoxy resin; (b) bisphenol M-type cyanate ester resin; (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or oligomers thereof; and (d) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The printed circuit board simultaneously has an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.
Owner:DOOSAN CORP
Fluorine-containing resin composition for parts of electronic and electrical equipment and same parts
InactiveUS6245845B1Low dielectric constantImprove heat resistancePlastic/resin/waxes insulatorsCoatingsThermoplasticHeat resistance
To provide a fluorine-containing resin composition useful as a molding material for parts of electronic and electrical equipment which assures well-balanced enhancement of dielectric property, heat resistance, mold-processability (precise processability) and mechanical properties and the parts of electronic and electrical equipment. The fluorine-containing resin composition for parts of electronic and electrical equipment comprises 70 to 95% by weight of (I) fluorine-containing resin mixture comprising (a) a fluorine-containing resin containing polytetrafluoroethylene not to be fibrillated and (b) a thermoplastic resin other than the fluorine-containing resin and 5 to 30% by weight of (II) a metal compound whisker having a single bond strength of not less than 190 KJ / mol calculated from a dissociation energy of bond between a metal element and oxygen. The parts of electronic and electrical equipment which are obtained from the composition have a dielectric constant of not more than 3.5.
Owner:DAIKIN IND LTD
Transmission method and transmitter circuit
InactiveUS7466965B2Reduce power consumptionHigh bandwidthTelevision system detailsResonant long antennasAudio power amplifierFrequency conversion
An amplitude component of a modulating signal is detected, band-divided by first and second frequency selecting circuits, and an amplitude component of a high-frequency band is down-converted by a first frequency conversion circuit. An amplitude component selected by the first frequency selecting circuit and an amplitude component selected by the first frequency conversion circuit are amplified by first and second operational amplifiers, and a signal amplified by the second operational amplifier is up-converted by a second frequency conversion circuit to be restored to the initial frequency band. Output amplitudes of the first operational amplifier and a second frequency converter are added up by an adder to be direct-current converted. The amplitudes after the direct-current conversion are band-divided by third and fourth frequency selecting circuits, respectively, feedback amounts thereof are adjusted, and then fed back to the first and second operational amplifiers.
Owner:PANASONIC CORP
Resin encapsulated semiconductor device and method for manufacturing the same
InactiveUS8193091B2Prevent penetrationStable electrical characteristicsSemiconductor/solid-state device detailsSolid-state devicesSemiconductor chipMetal
The present invention includes a die pad; signal leads, ground connection leads connected to the die pad; a semiconductor chip including electrode pads for grounding; metal thin wires, and an encapsulating resin for encapsulating the die pad and the semiconductor chip and encapsulating the signal leads and the ground connection lead such that lower portions of the signal leads and the ground connection lead are exposed as external terminals. The ground connection lead is connected to the electrode pad for grounding, so that the resin-encapsulated semiconductor device is electrically stabilized. Furthermore, interference between high frequency signals passing through the signal leads can be suppressed by the die pad and the ground connection leads.
Owner:TESSERA ADVANCED TECH
High efficiency power amplifier
ActiveUS20140225671A1Improve power efficiencyImprove featuresPower amplifiersRF amplifierAudio power amplifierPower processing
A high efficiency power amplifier of the present invention includes a transistor and an output power processing circuit section. The output power processing circuit section includes an output matching circuit section and an output harmonic processing circuit section. The output matching circuit section carries out impedance matching to the fundamental wave component of the output power. The output harmonic processing circuit section carries out a reactive power control to a reactive power of a plurality of harmonic power components respectively having a plurality of harmonic angular frequencies which are integral multiples of the base angular frequency of the output power. The output harmonic processing circuit section is formed to realize the reactive power control to at least one of the plurality of harmonic power components by orthogonalizing the phases of the current and voltage in the reactive power.
Owner:UNIVERSITY OF ELECTRO-COMMUNICATIONS
Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein
InactiveUS20070170578A1Improve reliabilityHigh-frequency characteristicSemiconductor/solid-state device detailsPrinted circuit aspectsEngineeringMetal
A semiconductor device has upper electrodes and external terminals which are protruding above the both surfaces of a substrate for semiconductor device and connected to each other by penetrating electrodes, a first insulating film covering at least a metal pattern except for the portions of the first insulating film corresponding to the upper electrodes, a second insulating film covering at least another metal pattern except for the portions of the second insulating film corresponding to the external terminals, and a semiconductor element connected to the upper electrodes and placed on the substrate for semiconductor device. The solder-connected surface of the external terminal is positioned to have a height larger than that of a surface of the second insulating film. The semiconductor element is placed on the first insulating film and covered, together with the upper electrodes, with a mold resin.
Owner:PANASONIC CORP
Electroacoustic transducer
ActiveUS20160155926A1Improve functional propertiesReducing sound pressure peak of soundTransducers for sound channels pluralityPiezoelectric/electrostrictive resonant transducersTransducerEngineering
In an embodiment, an electroacoustic transducer has a piezoelectric speaker 20, housing, and support member 23. The piezoelectric speaker 20 has a vibration plate 11 with a periphery 111, and a piezoelectric element 12 joined to the vibration plate 11. The housing houses the piezoelectric speaker 20. The support member 23 is constituted by a part of the housing or by a separate member, and supports the vibration plate 11 in multiple areas along the periphery 111. The electroacoustic transducer can offer excellent high-frequency characteristics.
Owner:TAIYO YUDEN KK
Multi-broad band antenna and electronic device thereof
InactiveUS20080180343A1Minimized volumeExcellent high-frequency characteristicSimultaneous aerial operationsRadiating elements structural formsIntermediate frequencyGround plate
A multi-broad band antenna including a first radiating body, a second radiating body, a third radiating body, a grounding plate and many short-circuit elements is provided. The first radiating body excites a first resonant mode, such that the multi-broad band antenna has a high frequency wide bandwidth. The second radiating body excites a second resonant mode, such that the multi-broad band antenna has a middle frequency wide bandwidth. The third radiating body excites a third resonant mode, such that the multi-broad band antenna has a low frequency wide bandwidth. A number of short-circuit elements connect the first radiating body, the second radiating body and the third radiating body to the grounding plate respectively. The radiation patterns of the first resonant mode, the second resonant mode and the third resonant mode do not disturb each other.
Owner:QUANTA COMPUTER INC
Electroacoustic transducer
InactiveUS20160157020A1Good sound qualityImproved functional characteristicTransducers for sound channels pluralityPiezoelectric/electrostrictive resonant transducersLoudspeakerEngineering
In an embodiment, an electroacoustic transducer has a piezoelectric speaker 20, housing, support member 73, and elastically deformable adhesive layer 74. The piezoelectric speaker 20 has a vibration plate 11 with a periphery 111, and a piezoelectric element 12 joined to the vibration plate 11. The housing houses the piezoelectric speaker 20. The support member 73 is constituted by a part of the housing or by a separate member, and supports the periphery 111. The adhesive layer 74 is provided between the periphery 111 and support member 73. The electroacoustic transducer can offer excellent high-frequency characteristics.
Owner:TAIYO YUDEN KK
High frequency circuit module in which high frequency circuits are embedded in a multilayer circuit substrate
ActiveUS9866265B2Excellent high-frequency characteristicSmall sizeSemiconductor/solid-state device detailsSolid-state devicesElectronic componentEmbedded electronics
A high frequency circuit module is provided with: a multilayer circuit substrate; a first high frequency switch that switches connection of an antenna; a transmission filter; and reception filters. Either the transmission filter or the reception filters, or both, and the first high frequency switch are embedded in the multilayer circuit substrate, and ground conductors are formed in a conductive layer facing embedded electronic components.
Owner:TAIYO YUDEN KK
Common mode filter
ActiveUS20190228901A1Good symmetryExcellent high-frequency characteristicTransformers/reacts mounting/support/suspensionMultiple-port networksEngineeringConductor Coil
Owner:TDK CORPARATION
Electroacoustic transducer
ActiveUS9654881B2Improve functional propertiesReducing sound pressure peak of soundTransducers for sound channels pluralityHeadphones for stereophonic communicationTransducerEngineering
An electroacoustic transducer has a housing, piezoelectric speaker, dynamic speaker, and support member. The piezoelectric speaker includes a vibration plate having a first surface and a second surface on the opposite side of the first surface, as well as a piezoelectric element joined to at least one of the first surface and second surface, and divides the interior of the housing into a first space facing the first surface and a second space facing the second surface. The dynamic speaker is placed in the first space. The support member is constituted by a part of the housing or by a member different from the housing, has a supporting part facing the first surface or second surface, and supports the periphery of the first surface or second surface with the supporting part.
Owner:TAIYO YUDEN KK
Multi-substrate liquid metal high-frequency switching device
InactiveUS6927350B2Simple structureExcellent high-frequency characteristicElectrothermal relaysContactsElectrical conductorMain channel
A device and manufacturing method are provided that comprises forming first and second substrates joined together and comprising a main channel provided in at least one of the substrates and a connecting channel provided in at least one of the substrates, the connecting channel connected to the main channel, and the main channel having spaced apart electrodes and at least partially filled with liquid metal. The method further comprises forming a heater substrate comprising a suspended heater element in fluid communication with the connecting channel, the suspended heater element operable to cause a fluid non-conductor to separate the liquid metal and selectively interconnect the electrodes, and providing a high-frequency signal loss reduction structure between the main channel and the heater substrate.
Owner:AGILENT TECH INC
Electroacoustic transducer
ActiveUS9601682B2Improve functional propertiesReducing sound pressure peak of soundTransducers for sound channels pluralityPiezoelectric/electrostrictive resonant transducersTransducerEngineering
In an embodiment, an electroacoustic transducer has a piezoelectric speaker 20, housing, and support member 23. The piezoelectric speaker 20 has a vibration plate 11 with a periphery 111, and a piezoelectric element 12 joined to the vibration plate 11. The housing houses the piezoelectric speaker 20. The support member 23 is constituted by a part of the housing or by a separate member, and supports the vibration plate 11 in multiple areas along the periphery 111. The electroacoustic transducer can offer excellent high-frequency characteristics.
Owner:TAIYO YUDEN KK
RF tag and method for producing same
InactiveUS20110121947A1Raise the possibilityLow dielectric constantPrinted circuit aspectsSynthetic resin layered productsMetallic foilPolymer science
An RF tag which comprises a prepreg plate having a first dielectric layer (20a), and prepreg layers (30a, 30b) respectively arranged on the two major surfaces of the first dielectric layer (20a). The first dielectric layer (20a) is composed of a graft copolymer which is obtained by polymerizing 15-40 parts by mass of an aromatic vinyl monomer (b), which contains 70-95% by mass of a monofunctional aromatic vinyl monomer (b1) and 5-30% by mass of a bifunctional aromatic vinyl monomer (b2), onto 60-85 parts by mass of a polymer (a), which is obtained from an α-olefin monomer or a chain conjugated diene monomer. Each of the prepreg layers (30a, 30b) is composed of a glass fabric base impregnated with an epoxy resin. An antenna circuit (10) and a metal foil layer (40) are respectively bonded to the prepreg layers (30a, 30b) of the prepreg plate by thermal compression bonding.
Owner:NOF CORP
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