The invention relates to a fan-out packaging structure with an
electromagnetic shielding function, which comprises a
wafer, a cavity arranged on the
wafer, and a
metal shielding layer, a repassivation layer, a first rewiring layer, a
metal bump arranged on the first rewiring layer, a
chip and a
metal bump arranged on the
chip which are sequentially arranged on the surface of the
wafer and the cavity, the cavity, the
chip, the first rewiring layer, the metal bumps and the like form a plastic
package body, the second rewiring layer, the PI
protection layer, the UBM layer and the solder balls are sequentially arranged on the surface of the plastic
package body, and the metal heat dissipation layer is arranged on the lower surface of the wafer. The invention further provides a packaging method of the fan-out type packaging structure with the
electromagnetic shielding function. According to the fan-out type packaging structure and the packaging method, the packaging efficiency is high, the
electromagnetic shielding effect is good, the structure is stable, and heat dissipation is easy.