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Bonding pad through hole packaging equipment for processing image sensing chip

A technology for sensing chips and packaging equipment, applied in radiation control devices, electrical components, electrical solid devices, etc. Good stability, good encapsulation state, and the effect of ensuring stability

Active Publication Date: 2020-12-29
ANHUI LONGXINWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a pad through-hole packaging equipment for image sensor chip processing, which solves the problem of easy displacement of the pad and poor stability of the pad during chip mounting. Technical issues with poor packaging status

Method used

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  • Bonding pad through hole packaging equipment for processing image sensing chip
  • Bonding pad through hole packaging equipment for processing image sensing chip
  • Bonding pad through hole packaging equipment for processing image sensing chip

Examples

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Embodiment approach

[0026] As an embodiment of the present invention, the positioning assembly 9 includes a positioning bar 91, a shut-off valve 92, a contraction spring 93, a limit bar 94, a contraction plate 95, a limit air bag 96, an extrusion plate 97 and an air storage bag 98, packaged The central position of the bottom plate 2 is provided with a storage tank, and the air storage bag 98 is arranged in the storage tank, and the positioning bars 91 are erected on the top side of the package base plate 2 respectively, and the space-limiting air bags 96 are respectively installed on the opposite surfaces of the two positioning bars 91 to limit A contraction plate 95 is pasted on the end inwall of the position air bag 96, and a contraction spring 93 is affixed between the contraction plate 95 and the sidewall of the positioning bar 91, and two limit strips 94 are pasted on the end face of the space limit air bag 96.

[0027] As an embodiment of the present invention, an extruding plate 97 is fixed...

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Abstract

The invention discloses bonding pad through hole packaging equipment for processing an image sensing chip, and the equipment comprises a packaging cover, a packaging bottom plate, a packaging bolt, aplugging assembly, a bonding pad, a sol layer, a grounding assembly, a positioning assembly, and a grounding piece, the packaging cover is disposed above the packaging bottom plate, and the packagingcover is cooperatively installed at the top side of the packaging bottom plate through the packaging bolt. The plugging assembly is arranged in the packaging bottom plate, and the positioning assemblyis installed on the top side of the packaging bottom plate. A bonding pad is placed on a supporting plate through the positioning assembly, and at the moment, under cooperation of a connecting rod, extrusion of an extrusion plate can be achieved, so that extrusion of a gas storage bag is achieved, gas in the gas storage bag can be input into a limiting gas bag, expansion of the limiting gas bag is achieved, after expansion, under cooperation of two limiting strips, the bonding pad can be clamped and limited, then a stop valve is closed, stable positioning of the bonding pad can be guaranteed,the stability of the bonding pad is guaranteed, and the packaging state is better.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to pad through-hole packaging equipment used for processing image sensing chips. Background technique [0002] An image sensor chip is a chip that can sense external light and convert it into an electrical signal. After the image sensor chip is manufactured, a series of packaging processes are performed on the image sensor chip to form a packaged image sensor. , to be used in various electronic devices such as digital cameras, digital video cameras, etc., in the prior art, the image sensor chip is composed of two parts, an image sensor unit and a signal processing unit, and the image sensor chip is set on the same chip at the same time A sensing unit and a signal processing unit, wherein the image sensing unit is used to receive an optical signal and convert it into an electrical signal, and the signal processing unit is used to process the electrical signal converted from the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
CPCH01L27/14618Y02P70/50
Inventor 黄晓波胡寻彬
Owner ANHUI LONGXINWEI TECH CO LTD
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