Fan-out packaging structure with electromagnetic shielding function and packaging method

Abstract

The invention relates to a fan-out packaging structure with an electromagnetic shielding function, which comprises a wafer, a cavity arranged on the wafer, and a metal shielding layer, a repassivation layer, a first rewiring layer, a metal bump arranged on the first rewiring layer, a chip and a metal bump arranged on the chip which are sequentially arranged on the surface of the wafer and the cavity, the cavity, the chip, the first rewiring layer, the metal bumps and the like form a plastic package body, the second rewiring layer, the PI protection layer, the UBM layer and the solder balls are sequentially arranged on the surface of the plastic package body, and the metal heat dissipation layer is arranged on the lower surface of the wafer. The invention further provides a packaging method of the fan-out type packaging structure with the electromagnetic shielding function. According to the fan-out type packaging structure and the packaging method, the packaging efficiency is high, the electromagnetic shielding effect is good, the structure is stable, and heat dissipation is easy.

Description

technical field [0001] The invention relates to the technical field of semiconductor fan-out packaging, in particular to a fan-out packaging structure and a packaging method with an electromagnetic shielding function. Background technique [0002] When electronic equipment is working, it does not want to be interfered by external electromagnetic waves, nor does it want to radiate electromagnetic waves to interfere with external equipment, so it is necessary to block the propagation path of electromagnetic waves, which is electromagnetic shielding. Electromagnetic shielding has always been a problem that needs attention in the production of semiconductor packaging structures, especially integrated circuit chips that are more sensitive to electromagnetic interference, such as radio frequency chips. These chips must be electromagnetically shielded before work, otherwise the chip is susceptible to electromagnetic interference and difficult to Do normal work. [0003] In the pri...

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Problems solved by technology

However, there are several problems in this process: 1. The overall frame of the package is a plastic encapsulant, and the process strength of the package is not enough due to the low strength of the plastic encapsulant; 2. Special magnetron sputtering equipment is required, and the process is complex and production High cost and low efficiency; 3. The non-grounding of the metal shielding layer affects the shielding effect; 4. It is difficult to guarantee the thickness and uniformity of the metal shielding layer on the side; 4. The heat dissipation of the plastic package is poor

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