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Multilayer printed wiring board and integrated circuit using the same

A multi-layer printing and circuit board technology, applied in printed circuits, printed circuits, printed circuit manufacturing, etc., can solve problems such as ratio reduction, and achieve the effects of noise suppression, EMI improvement, and stable grounding

Inactive Publication Date: 2004-12-01
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the contrary, the ratio of the area occupied by the signal transmission path 602 and the signal transmission line 604 in the multilayer printed wiring board 601 decreases.

Method used

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  • Multilayer printed wiring board and integrated circuit using the same
  • Multilayer printed wiring board and integrated circuit using the same
  • Multilayer printed wiring board and integrated circuit using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Figures 1A to 1D A multilayer printed wiring board of this embodiment is shown. Figure 1A It is a schematic perspective view of the principle. Figure 1B is along Figure 1A The cross-sectional view taken by the line Y-Y'. Figure 1D is another cross-sectional view. Figure 1C It is a schematic perspective view for explaining the internal structure of the multilayer printed wiring board and the impedance control structure.

[0046] Such as Figure 1A , 1B As shown in and 1D, the multilayer printed wiring board 101 includes a plurality of electrical insulating layers 103, a plurality of wiring layers 114 alternately arranged with the electrical insulating layers 103, and passes through each electrical insulating layer 103 along the thickness direction of the electrical insulating layer 103, A plurality of conductors 115 for electrically connecting the wiring layer 114 . Each wiring layer 114 includes ground lines 106 and signal transmission lines 104 . The conduct...

Embodiment 2

[0062] Figures 2A to 2C A multilayer printed wiring board of this embodiment is shown. Figure 2A is a cross-sectional view. Figure 2C is another cross-sectional view. FIG. 2B is a schematic perspective view for explaining an internal structural portion of the multilayer printed wiring board and an impedance control structure. The multilayer printed wiring board of this embodiment has the same effect as that of the multilayer printed wiring board of the first embodiment.

[0063] Such as Figure 2A and 2C As shown, the multilayer printed wiring board 209 includes a plurality of electrical insulation layers 203, a plurality of wiring layers 214 alternately arranged with the electrical insulation layers 203, passing through each electrical insulation layer 203 along the thickness direction of the electrical insulation layer 203, for electrical The plurality of conductors 215 connecting the wiring layer 214 and the circuit elements 208 buried in any electrical insulating l...

Embodiment 3

[0075] Figure 3A and 3B A sectional view showing the multilayer printed wiring board of this embodiment. Figure 3A The multilayer printed wiring board 309 in is the same as that of Embodiment 2, except that it further includes a material layer 311. Figure 3B The multilayer printed wiring board 309 in is the same as that of Embodiment 2, except that it also includes an electromagnetic shielding layer 312. The multilayer printed wiring board of this embodiment has effects comparable to those of the multilayer printed wiring boards of Embodiments 1 and 2.

[0076] Such as Figure 3A and 3B As shown, the multilayer printed wiring board 309 includes a plurality of electrical insulation layers 303, a plurality of wiring layers 314 alternately arranged with the electrical insulation layers 303, and a wire for passing through each electrical insulation layer 303 along the thickness direction of the electrical insulation layer 303. The plurality of conductors 315 of the wiring ...

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PUM

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Abstract

A multilayer printed wiring board of the present invention includes, e.g., an electrical insulating layer (103), a plurality of wiring layers (114) arranged alternately with the electrical insulating layer (103), and a plurality of conductors (115) passing through the electrical insulating layer (103) in its thickness direction for electrically connecting the wiring layers (114). A plating layer (107) is formed so as to cover the side of the electrical insulating layer (103) and electrically connected to ground wiring (106). The impedance of a signal transmission conductor (102a) arranged in the edge portion of the electrical insulating layer (103) is controlled by a ground conductor (105a) arranged opposite to the plating layer (107) with this signal transmission conductor (102a) sandwiched between them and the plating layer (107).

Description

field of invention [0001] The present invention relates to a multilayer printed wiring board comprising at least two wiring layers and used in electronic equipment such as information processors or wireless communication equipment. In particular, the present invention relates to characteristic impedance control of internal vias, vias, etc. for interlayer connections. Background technique [0002] In recent years, with the development of high-density and high-speed processing electronic devices, there is a need to increase the signal transmission speed. The design of multilayer printed wiring boards includes impedance matching of signal transmission lines, vias or internal vias for interlayer interconnection. This is because such impedance matching suppresses noise due to reflections or oscillations that increase as signal transmission speed increases, thereby ensuring transmission signal quality. In order to achieve impedance matching, for example, a guasi-stripline struct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18H05K3/40H05K3/46
CPCH05K3/403H05K1/186H05K1/0233H05K1/0203H05K2201/086H05K3/4614H05K1/0218H05K1/187H05K3/4069H01L2224/16225H01L2924/00014H01L2224/0401
Inventor 田仪裕佳中谷诚一齐藤义行中山武司
Owner PANASONIC CORP
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