288results about How to "Curb bending" patented technology

The invention aims to provide a direct fluid type writing implement which has no possibility of the ink in an ink tank leaking from the penpoint side, get ready for writing in a short time by a quick change of air and the ink at the initial discharge of the ink, and moreover can simplify the structure. The direct fluid type writing implement comprises the penpoint, an ink occluding body connected to the rear end of the penpoint, the ink tank disposed in the rear of the ink occluding body and storing the ink directly and communication pipes connecting the ink tank with the ink occluding body. The communication pipes are provided in a plurality. The respective front ends of the communication pipes are opened. The ink occluding body has a high-density part and a low-density part connected to the high-density part in the rear of this part. The respective front ends of the communication pipes and the rear end of the penpoint are connected to the high-density part.

A corrosion resistant electrical connection structure has an electrically conductive cable with an electrically conductive core and an insulative outer cover. An electrically conductive terminal is electrically connected to a lead of the core that extends beyond the insulative outer cover. A molded hot melt seal seals the lead of the core and the terminal interface section from ambient electrolytes. In an exemplary embodiment, the core is made from aluminum or an aluminum alloy and the terminal is made from a copper alloy.

The aim of the invention is to guide wire for medical treatment capable of being easily introduced into a blood vessel from a blood vessel guide port at a femoral, a brachium, or a radial, easily meandered in the blood vessel, and hard to be erroneously advanced into the blood vessel at a branched part, comprising a metal core covered with a resin having a tip part bent in a smooth curved shape, characterized in that the diameter of the guide wire including a resin layer is 0.46 to 1.02 mm, an angle formed by the extension line of the tip part of the guide wire relative to a wire base line is 40 to 70 DEG , and the width dimension of the curved part is 2 mm or longer to less than 10 mm.

A substrate for a semiconductor device is provided, including: a substrate; a transistor, formed on the substrate, that includes a semiconductor layer, and a gate electrode disposed so as to be opposed to the semiconductor layer with a gate insulating film interposed therebetween; and an underlying film disposed below the semiconductor layer, as an underlayer of the transistor, and formed in an island shape so as to at least partially overlap the semiconductor layer, in a plan view of the substrate.

The invention provides a bonding device capable of shortening a bonding time and performing high speed and accurate mounting by irradiating a laser to an anisotropic conductive film (ACF) which is a mounting adhesive. Laser generated from a laser generator is reflected by a laser mirror, passes through an array substrate (glass substrate) through a backup glass, and then, directly irradiated to an ACF in a pinpoint manner. The laser from the laser generator is set to have a wavelength whose transmittance of transmitting the TCP and the array substrate having the ACF inserted therebetween is higher than that of the other wavelength. The ACF is welded by this laser irradiation, so that the TCP and the array substrate are bonded to each other.

Provided is a run-flat tire that achieves high levels of both run-flat durability and ride comfort, and minimizes weight increase. In a sidewall-reinforced run-flat tire, the minimum thickness section being positioned between the belt layer end section and the tire cross-sectional height (SH) 70% position, the relationship between the thickness (Gmin) of the minimum-thickness section and the thickness (Gmax) of the maximum thickness section (17) is defined as 0.5 × Gmax ≤ Gmin ≤ 0.8 × Gmax; the relationship between the length (Lmin) of the thin region and the tire cross-sectional height (SH) is defined as 0.18 × SH ≤ Lmin ≤ 0.26 × SH; the relationship between the weight (Wr) of the sidewall-reinforcement layer, the tire total weight (Wt), and the tire oblateness (R) is defined as 0.08 × Wt × (1 - 0.2 × (1 - R / 50)) ≤ Wr ≤ 0.18 × Wt × (1 - 0.2 × (1 - R / 50)); the relationship between the thickness (Ga) at the rim-check line of the outer-side rubber portion outward of the carcass layer, and the maximum thickness (Gb) thereof, is defined as 0.8 × Gb ≤ Ga ≤ 1.0 × Gb; and the relationship between the thickness (Gc) at the rim-check line of the inner-side rubber portion inward of the carcass layer and the thickness (Ga) is defined as 0.7 × Ga ≤ Gc ≤ 1.0 × Ga.

The invention relates to a secondary cell which has an electrode group (5) fabricated by winding positive and negative electrode sheets (1, 2) each comprising a current collector (1) and mix layers (8, 9) formed on the current collector and containing active materials and a separator (3) interposed between the electrode sheet. Grooves (30) are formed in the surface of the mix layers (8, 9) of at least one of the positive and negative electrode sheets (1, 2). Each groove (30) has curvatures at the end portions (30b) of the side surfaces and the central portion (30a) of the bottom surface. The grooves (30) are continuously formed in the surfaces of the mix layers (8, 9) for on both sides of the electrode sheet (1) at intervals of 200 [mu]m or less along the length direction of the electrode sheet (1). The phases of the grooves(30) are shifted from one another.

The invention relates to a yarn splicing device for pneumatically joining yarns, especially elastic yarns, with a splicing body having a vacuum-loadable splicing channel which can be operated by means of a The covering element is closed and, moreover, a support is arranged in the region of the splicing channel, which supports the fixing of the yarn ends. According to the invention, it is provided that the supporting element consists of a spring wire (36) and a cover element (23), wherein the spring wire (36) is positioned in an opposite position in the spliced ​​body (19). In the groove (35) that moves angularly in the splicing channel (20), that is, the yarn ends (31, 32) to be spliced ​​are clamped between the covering element (23) and the spring wire ( 36) Between.

An apparatus for supporting a worker's body part, for example a surgeon's arm, is provided. The body part is supported by a base movably supported by a support. The apparatus has a free mode and a limitation mode, which are switchable. When it is determined that the body part is attempting to move the base or a fastening member, the operating mode is switched to the free mode. When it is determined that the body part is not attempting to move the base or the fastening member, the operating mode is switched to the limitation mode. The free mode allows the fastening member to fasten the body part on the base and allows a brake to release limitations to the motions of the base. The limitation mode allows the fastening member to release the body part from being fastened and allows the brake to limit the motions of the base.

Disclosed are a production apparatus and a production process in which a thick and high-quality single crystal film can be formed on both sides of a colored substrate. Both single crystal growth surfaces of a colored substrate which has been fixed through a substrate holder within a reactor are substantially evenly heated by at least one pair of infrared irradiation devices each comprising an infrared generating source and a reflecting mirror to produce a single crystal.

The present invention provides an electronic parts installation apparatus, capable of stably and accurately recognizing hold mode of the electronic parts. The apparatus includes a substrate holding part; a member supply part for supplying the electronic parts; a loading head having an adsorption nozzle; a loading head shifting mechanism capable of locating the loading head arbitrarily; a filming unit arranged on the loading head to film the electronic part absorbed by the adsorption nozzle; a filming reflection mirror extended between the member supply part and the substrate holding part and having only one reflecting plane; and an image processing device for judging the position and angle of the absorbed electronic part relative to the absorption nozzle according to the filming image of the electronic part obtained through reflection of the filming reflection mirror, wherein the reflecting plane of the filming reflection mirror is an inclined plane which adopts a bisecting line between a central line of the adsorption nozzle and the line of sight of the filming unit as its perpendicular line.

An endoscopically inserting surgical tool is composed of an elongated flexible cord to be passed through a tool guide channel on an endoscope, and a tool action mechanism mounted on a fore distal end of the flexible cord to be projected out of the tool guide channel. The flexible cord has such a length that, when the tool action mechanism is projected out of a tool exit opening at the end of the tool guide channel, a proximal end portion of the flexible cord still remains outside and rearward of a tool entrance way which is provided on a manipulating head grip of the endoscope as an approach to the tool guide channel. A proximal end portion of the flexible cord is gripped in a rotary tool adjustor which is manipulable to turn the tool action mechanism clockwise or counterclockwise together with the flexible cord in the tool guide channel of the endoscope.

The invention provides an upsetting forming method of an ultra-large height-diameter ratio metal blank. The method comprises the following steps that (1), according to the initial blank size, the mold interior upsetting blank diameter increasing rate and the free upsetting blank height-diameter ratio, the mold interior upsetting pass is determined to plan the upsetting technological process; (2), according to the target size of an upsetting forming part, the free upsetting blank height-diameter ratio and the mold interior upsetting blank diameter increasing rate, the upsetting ratios of all upsetting passes are determined; (3), an annular mold with the demolding slope is adopted for mold interior upsetting, the main working size can be determined by means of the method that the upsetting blank sizes of all the passes are calculated according to the upsetting ratios of all the passes; and (4), upsetting forming is conducted, specifically, upsetting of all the passes is sequentially conducted through a press machine and a mold according to the planned upsetting process, and finally the needed upsetting forming part is obtained. According to the upsetting forming method of the ultra-large height-diameter ratio metal blank, the phenomenon of upsetting instability of the ultra-large height-diameter ratio blank can be effectively avoided, upsetting bending of the blank is avoided, upsetting deformation uniformity can be adjusted and controlled, and the upsetting capacity is lowered, so that the effects of upsetting quality improving, upsetting energy consumption reducing and device upsetting size range enlarging are achieved.

The invention provides an engagement chain type driving device which can realize the advance and retreat drive without the auxiliary guide mechanism, and can realize the reduction in size and light, and ensure the high free degree for the design of other parts, the arrangement position of the devices, and the like, and can make the maintenance easy and reduce the coveying load of the workpieces, at the same time, when the suepension or suspension arm supporting is adopted, the auxiliary guide mechanism is also not required. The invention relates to an engagement chain type driving device including a pair of driving sprockets, a pair of engagement chains, and a driving source, wherein the inner tooth plates and outer tooth plates being brought opposite to each other and into contact with each other when the engagement chains are integrated by the pair of driving sprockets, such that the flat surfaces hold the chain engagement position.

A secondary battery, which has no raw material injection spot and a burr on a lower surface of the insulating member. The sidewalls are formed on the opposite side to the side on which bending stress is applied, and the sidewalls act as a structural resistor, which result in preventing the plate from bending. The insulating member inserted into the container has an inversely stepped part to keep the insulating member from escaping from the container. A fabrication method of the secondary battery whereby an insulating member is prepared by inserting a raw material from the side on which the sidewall is to be formed into a mold and solidifying the inserted raw material, the insulating member is positioned over the electrode assembly inserted into a container, and a cap is coupled to an opening of the container with the insulating member positioned over the electrode assembly.

A semiconductor device includes a semiconductor chip, a plurality of bonding pads which are formed on a main surface of the semiconductor chip and include first power source bonding pads, second power source bonding pads and a plurality of signal bonding pads, a plurality of leads which are arranged around the semiconductor chip and include first power source leads and a plurality of signal leads, a plurality of bonding wires which include first bonding wires for connecting the first power source bonding pads with the first power source leads, second bonding wires for connecting the first bonding pads with second bonding pads and third bonding wires for connecting the plurality of signal bonding pads with the plurality of signal leads, and a sealing body which seals the semiconductor chip, the plurality of bonding wires and some of the plurality of leads.

The invention discloses a bending processing method of a heat exchanger. According to the method, the heat exchanger can be bent only by holding a position of a holding part of the heat exchanger and enabling the holding part to bend according to a ruled track through controlling gestures of the holding part without using a bending mould. At this moment, a contact position of a free part of the heat exchanger which is not held and a guide part is determined by a reacting force generated during the bending process, and no limitation force is generated by the free part which is not held, so that buckling generated by the heat exchanger during the bending process can be avoided. The bending processing method of the heat exchanger, disclosed by the invention, can suppress deformation and buckling of heat transfer fins.

A nozzle for holding a substrate may include a nozzle head and a nozzle body. The nozzle head may provide the substrate with compressed air. The nozzle body may be connected to the nozzle head. The nozzle body may be arranged facing the semiconductor substrate. The nozzle body may have a substantially flat supporting surface which provides a uniform gap between the substrate and the nozzle body. The nozzle body may have a first passageway which allows the compressed air to pass through toward the substrate to form a vacuum between the substantially flat supporting surface and the substrate.