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75results about How to "Reduced in size and cost" patented technology

Electronic control apparatus

ActiveUS20080278918A1Reduce size and cost of productionLow costSolid-state devicesAutomatic steering controlMetal substrateEngineering
An electronic control apparatus can be reduced in size and cost by removing a metal substrate part. The apparatus includes a housing having a pair of opening portions at its opposite sides, a heat sink attached to one of the opening portions of the housing, a pair of semiconductor switching elements mounted on the heat sink, a circuit board arranged in opposition to the heat sink, a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other, and a plate spring urging the semiconductor switching elements against the heat sink. The plate spring has engagement portions press-fitted to and engaged with inner sides of holding portions which are formed on the housing, and the housing has engagement portions engaged with protruded portions of the heat sink.
Owner:MITSUBISHI ELECTRIC CORP

Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module

A power semiconductor module has a silicon nitride insulated substrate, a metal circuit plate made of Cu or a Cu alloy, which is disposed on one surface of the silicon nitride insulated substrate, a semiconductor chip mounted on the metal circuit plate, and a heat dissipating plate made of Cu or a Cu alloy, which is disposed on the other surface of the silicon nitride insulated substrate; a carbon fiber-metal composite made of carbon fiber and Cu or a Cu alloy is provided between the silicon nitride insulated substrate and the metal circuit plate; the thermal conductivity of the carbon fiber-metal composite in a direction in which carbon fiber of the carbon fiber-metal composite is oriented is 400 W / m·k or more. Accordingly, a power semiconductor module that has a low thermal resistance between the semiconductor chip and a heat dissipating mechanism and also has improved cooling capacity is provided.
Owner:HITACHI LTD

Resonator and dielectric filter

One pair of resonant electrodes is formed in a loop shape or a spiral shape in a substrate stacking direction symmetrically to each other. This allows a longitudinal space in substrate to be reduced. A first capacitor having an electrode connected to the grounding conductor layer, an electrode connected to an open-end side of the resonant electrode, and a dielectric layer is provided. A second capacitor having an electrode connected to the grounding conductor layer, an electrode connected to an open-end side of the resonant electrode, and a dielectric layer is also provided. This results in having a desired characteristic even if a length of the resonant electrode is short.
Owner:SONY CORP

Motor drive device and electric power steering device

A motor drive device includes a plurality of control systems that individually supply drive currents to a plurality of coil groups included in a motor. The motor drive device independently sets the current command values for the respective control systems. Based on the set current command values, drive instructions are supplied to drive circuits of inverters with respect to the respective control systems, thereby supplying drive currents from the inverters to the coil groups. The motor drive device detects a failure in any of the inverters and the coil groups with respect to each control system, and stops only the failed control system or causes only the failed control system to fall back. The motor drive device further includes a main computing device, and an auxiliary computing device. Consequently, if the auxiliary computing device is normal even in case the main computing device fails, driving of the motor can be continued using one or some of the control systems.
Owner:NIDEC CORP

Method of cutting laminate with laser and laminate

A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.
Owner:FUJITSU LTD
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