150results about How to "Reduce signal crosstalk" patented technology

The invention provides a multi-line scanning laser radar device, which comprises a moving part and a fixed part which are connected by a rotary support, wherein a laser emitting optical system and a laser receiving optical system are arranged inside the moving part in parallel; a driving motor is arranged inside the fixed part and is fixedly connected with the rotary support through a rotating shaft; and the laser emitting optical system, the laser receiving optical system and the driving motor are electrically connected with a driving control system respectively. The aim of performing multi-line three-dimensional scanning on an imaging target is fulfilled, and the imaging speed and the imaging quality are improved.

A system for reducing signal crosstalk in a flexible trace interconnect array includes a flexible dielectric material base, and a plurality of conductors longitudinally arranged as pairs in a signal layer array on the base. At least one of the pairs of conductors comprises a twisted pair.

A multi-line laser radar comprises a first radar assembly, and the first radar assembly comprises n laser devices, an optical alignment unit, a scanning rotating mirror and a detector, wherein n is larger than 1. Each laser device is used for emitting one way of laser beam to the optical alignment unit; the optical alignment unit is used for aligning the n ways of laser beams, and the aligned n ways of laser beams are shot towards target reflection mirrors of the scanning rotating mirror; the scanning rotating mirror comprises the m reflection mirrors rotating around a rotary shaft, and the rotating plane of the rotary shaft is perpendicular to the arrangement direction of the aligned n ways of laser beams, wherein m is larger than 1; the target reflection mirrors are used for reflecting the received aligned n ways of laser beams to a detection area of the first radar assembly; and the detector is used for receiving reflected echo signals of the n ways of laser beams in the detection area. The multi-line laser radar is of a multi-emit and one-receive structure, signal crosstalk among different detectors is avoided, the working performance is improved, and the cost is lowered.

The embodiment of the invention discloses a signal connector. The signal connector comprises a first plug-in connector and a second plug-in connector, wherein the first plug-in connector comprises a signal transmission unit comprising a signal transmission part, a first shielding component and a second shielding component, and a first matched fixing end for containing the signal transmission unit; the second plug-in connector comprises a second matched fixing end for containing a second signal terminal pair and a third shielding component; and when the first plug-in connector is in plug-in connection with the second plug-in connector, a first signal terminal pair and the second signal terminal pair are arranged in a connection way, the third shielding component and a first clamping joint of the signal transmission unit are arranged in a clamping way, the third shielding component is connected with the first shielding component and the second shielding component in a clamping way so as to form an O-shaped shielding cavity structure coating the first signal terminal pair and the second signal terminal pair, and the O-shaped shielding cavity structure is used for shielding the signals transmitted by the first signal terminal pair and the second signal terminal pair. By the embodiment, the signal crosstalk problem of the signal connector in a high-speed system can be solved.

The invention comprises: a group of grid lines formed on the array baseboard; a group of data lines formed on the array baseboard; a shared electrode formed on the color film baseboard; a grid line short-circuit ring formed on the array baseboard; a data line short circuit ring formed on the array baseboard; a group of connection grid lines and a first static discharge protection component; a group of connection data line and a second static discharge protection component of the data line short circuit ring; a group of connection grid line short circuit rings and a third static discharge protection component of the data line short circuit ring. The grid line short circuit ring is connected to the shared electrode through silver gel and color film baseboard.

The invention discloses a preparation method for a high-density interposer for microelectronic system-in-package. The preparation method comprises the following steps of: 1, preparing a drectionally growing carbon nanotube bundle array, wherein the diameter of each carbon nanotube bundle is 0.5 to 30 microns, the gap of the carbon nanotube bundle is 0.8 to 100 microns, and the carbon nanotube bundle is 40 to 500 microns long; 2, depositing metal tungsten on the surface of the drectionally growing carbon nanotube bundle so as to form a conductor array; 3, melting borosilicate glass and compounding the melted borosilicate glass with the conductor array so as to form a compound body; and 4, grinding the upper surface and the lower surface of the formed compound body so as to expose the end of the carbon nanotube bundle deposited with the metal tungsten, and obtaining the high-density interposer for the system-in-package. The material adopted by the preparation method has low thermal expansivity and the process method is low in time consumption, so the prepared high-density interposer has the advantages of high density, high reliability and low cost.

The invention discloses a high sensitive biochemical sensor based on a resonance oscillation type micro cantilever beam structure. The biochemical sensor comprises a resonance oscillation chamber, a cantilever beam and a Whist bridge type detection circuit, wherein a micro column structure (3), a liquid storage tank (4) and a liquid leakage hole (5) through which biochemical solution flows are etched at the free end of the cantilever beam; the support end of the cantilever beam is connected with the Whist bridge type detection circuit; the Whist bridge type detection circuit is composed four U-shaped piezoresistance bars (1), three input electrodes (8, 9, 10) and two output electrodes (7, 11); and the four piezoresistance bars (1) are connected with the input electrodes (8, 9, 10) and the output electrodes (7, 11) through a signal transmission line (2). With the adoption of the biochemical sensor, micro biochemical molecules can be sensed with a high sensitivity by detecting the frequency change after an object to be tested is absorbed; biochemical molecules with micromass can be detected; and the biochemical sensor can be widely used in engineering fields such as medicine and chemistry.

The invention discloses a display panel and a display device. A substrate of the display panel includes a device setting area, a first non-display area, a display area and a second non-display area, wherein the first non-display area surrounds the device setting area, and the display area surrounds the first non-display area; a plurality of data lines formed on the substrate; and a first metal layer, a second metal layer and a third metal layer formed on the substrate, all data lines include first trace parts which are located in the second metal layer; part of the data lines passing through the first non-display area also include first jumper parts, all of which are located in the third metal layer; or all first jumper parts are located in the first metal layer; or part of the first jumper parts are located in the third metal layer and other first jumper parts are located in the first metal layer. The display panel has the advantage that devices of large sizes can be normally installed and used when ensuring relatively high display panel screen ratio.

The present invention discloses an optical module. The optical module includes a printed circuit board, a light emitting element, a light receiving element and an optic fiber port corresponding to the light emitting element and the light receiving element; the printed circuit board comprises a first surface and a second surface which are arranged oppositely; the light receiving element is mounted on the second surface of the printed circuit board; and the light emitting element is mounted on the first surface of the printed circuit board or is adjacent to an end surface of the printed circuit board. According to the optical module of the invention, the light emitting element and the light receiving element are arranged at the two sides of the printed circuit board, and therefore, the signal crosstalk of the light-emitting element and the light-receiving element can be effectively reduced, and the performance of the optical module can be improved; and a shielding component is not required, and therefore, the problem of space occupation caused by the shielding component can be avoided.

An improved electronic receptacle connector with portions thereof formed from an electrically conductive polymer is disclosed. A conductive polymer front face enables improved device aesthetics and can discharge electrostatic energy from a plug before it is mated with the connector. A conductive polymer housing with internal ground structures may provide electromagnetic interference shielding and improved data transfer speed.

The invention discloses an ultrasonic receiving transducer based on a Helmholtz resonant cavity. The ultrasonic receiving transducer based on the Helmholtz resonant cavity comprises the Helmholtz resonant cavity and an MEMS piezoelectric ultrasonic transducer which are combined through bonding, wherein the MEMS piezoelectric ultrasonic transducer is composed of a piezoelectric laminated structureand a silicon substrate with a cavity body, the Helmholtz resonant cavity is composed of a silicon structure with a cavity body and an upper opening, the silicon structure is located above the piezoelectric laminated structure, a Helmholtz resonant cavity hole is formed in the upper opening, and air in the Helmholtz resonant cavity hole forms an air column of the Helmholtz resonant cavity; the middle part of the silicon substrate structure with the cavity body and at the bottom is etched to form a bulged silicon substrate strut, an annular groove is etched in the piezoelectric laminated structure around the silicon substrate strut, a plurality of radial grooves are etched in the piezoelectric laminated structure by taking the silicon substrate strut as a center, and the piezoelectric laminated structure is partitioned into a plurality of fan-shaped structures or a plurality of trapezoidal structures; and the plurality of fan-shaped structures or the plurality of trapezoidal structuresform a cantilever beam, one end, making contact with the silicon substrate strut, of the cantilever beam, forms a fixed end, and one end, away from the silicon substrate strut, of the cantilever beam,forms a free end. The performance of the ultrasonic receiving transducer can be improved.

The invention relates to an electric connector comprising an insulation body, two terminal module groups and a metal housing. The insulation body comprises a main body part and a plate-shaped abutted-connection part extending forward from the main body part. The abutted-connection part comprises an upper surface and a lower surface which are opposite and a front end surface and two side surfaces positioned between the upper surface and the lower surface. Each terminal module group comprises an insulation block and a row of conductive terminals fixed on the insulation block. Each conductive terminal comprises a grounding terminal and several differential signal terminals. Each conductive terminal comprises contact parts arranged on the upper surface and the lower surface. The metal housing circles around the outer sides of the terminal module groups. The electric connector is also provided with a metal shielding sheet positioned between the upper surface and the lower surface of the abutted-connection part. The shielding sheet is provided with at least one through hole and an elastic arm extending upwards or downwards in a projection mode from the inner edge of each through hole. Each insulation block is provided with at least one groove used for accommodating the elastic arm. The contacts parts of the grounding terminal are exposed outside of the groove to make contact with the elastic arm. The electric connector of the invention can reduce signal crosstalk.

The invention discloses a display panel and a display device. The display panel includes a plurality of touch electrodes, a plurality of touch traces, and a driving chip arranged on a first substrate;at least part of the touch traces include bent portions, and vertical projections of bent portions of touch traces on the first substrate are located in vertical projections of touch electrodes electrically connected to touch traces on the first substrate. The plurality of touch electrodes include a first touch electrode and a second touch electrode, and the distance from the first touch electrode to the driving chip is shorter than the distance from the second touch electrode to the driving chip. The plurality of touch traces include a first touch trace electrically connected to the first touch electrode and a second touch trace electrically connected to the second touch electrode, and the total length of portions of the first touch trace is longer than the total length of bent portionsof the second touch trace. According to the display panel and the display device, the touch uniformity, the display uniformity and the touch accuracy of the display panel are improved.

The invention discloses a high-density type parallel transmission optical device which is applicable to a CXP encapsulating and plug type optical device and a CXP active optical cable (AOC), wherein the CXP encapsulating and plug type optical device and the CXP AOC are applied to data communication currently. The high-density type parallel transmission optical device comprises a transmitting PCB, a receiving PCB, a multi-path transmitting chip, a multi-path receiving chip, a transmission driving chip, a receiving amplifying chip, multi-path lens arrays, sealing cover plates and a connecting line, wherein the number of the multi-path lens arrays is two, and the number of the sealing cover plates is two. The high-density type parallel transmission optical device is characterized in that the parallel transmission optical device further comprises a changeover array optical fiber jumper assembly. The high-density type parallel transmission optical device is capable of effectively reducing the surface-mounting accuracy requirements of the multi-path transmitting chip and the multi-path receiving chip to further reduce encapsulating difficulty, effectively solving the signal crosstalk problem and the radiating problem, and improving the performance stability.

A touch display panel includes: a common electrode; a first switching element connected between a voltage line and the common electrode; a data line transmitting a data signal during a display period and a touch sensing signal during a touch period; a pixel electrode; a second switching element connected between the data line and the pixel electrode; and a third switching element connected between the data line and the common electrode. During the display period, the first switching element and the second switching element are turned on and the third switching element is turned off. During the touch period, the first switching element and the second switching element are turned off and the third switching element is turned on.

The present invention provides an array substrate and a liquid crystal display panel. Wherein, in the array substrate, each pixel unit comprises a first pixel electrode, a second pixel electrode, and a third pixel electrode. And each pixel unit comprises a first control circuit and a second control circuit. The first control circuit affects the first pixel electrode, so that the first pixel electrode is under the state of displaying the image corresponding to the black screen in the 3D display mode. The second control circuit affects the second pixel electrode and the third pixel electrode to change the voltage difference between the second pixel electrode and the third pixel electrode. By the above way, the present invention can minimize the color difference in wide viewing angle, improve the opening ratio in the 2D display mode, and reduce the crosstalk of the two eyes signal in the 3D display mode. Furthermore, it can reduce the amount of the data drivers and reduce the costs.

A package for reducing signal cross talk between wire bonds of semiconductor packages. The package includes a semiconductor die having a plurality of bond pads formed thereon. The bond pads arranged in a first subset of bond pads and a second subset of bond pads. The package also includes a substrate having a plurality of contact points, the plurality of contact points are arranged in a first subset of contact points and a second subset of contact points. To reduce signal cross talk, the wire bonds are arranged such that a first subset of wire bonds are electrically coupled between the first subset of bond pads and the first subset of the contact points. The first subset of wire bonds have ball bonds formed on the first subset of bond pads and stitch bonds formed on the first subset of contact points respectively. A second subset of wire bonds are electrically coupled between the second subset of bond pads and the second subset of the contact points. The second subset of wire bonds have stitch bonds formed on the first subset of bond pads and ball bonds formed on the first subset of contact points respectively. The different height profiles of the first set and the second set of wire bonds tends to reduce signal cross talk between the wires.

The invention provides a low-crosstalk, rapid and active-passive compatible type piezoelectric channel switching system, which belongs to the technical field of structural health monitoring for an active-passive Lamb wave and a piezoelectric array sensor. The piezoelectric channel switching system comprises a channel control central processor module, an active-passive work mode switch array, a passive switching control module, an active switching control module, a passive switch array, an active switch array and a system power supply conversion module. The system integrates the function of channel switching required by active and passive structural heal monitoring technology. Under the active working mode, the channel switching system can realize the activation of single piezoelectric sensor and low-crosstalk and rapid channel switching and scanning of synchronous response of a plurality of piezoelectric sensors; and under the passive work mode, the channel swtiching system can realize the gating of an acoustic emission response channel of any piezoelectric sensor.

An integrated circuit (12) that supports digital circuits (4), analog circuits(6), and RF circuits (8) on a single IC. Digital CMOS circuitry lies on a low resistivity layer (16) that provides good latch-up qualities and allows for dense PAD I / O. Analog CMOS circuitry rests on an isolated well region (20) on a highly resistive layer (14) in order to minimize signal crosstalk through the substrate. Analog BJT devices also sit on a highly resistive region (14) within its own well structure (20) in order to minimize parasitic capacitances and provide for high frequency device switching. RF passive elements, such as inductors and capacitors, rest on a highly resistive region (14) in order to minimize signal losses that especially occur at high frequencies. RF active components rest on a highly resistive region to maximize device performance.

An embodiment of the invention discloses a display panel, a making method thereof and a display device. The display panel comprises a first substrate, a second substrate, a signal line array arrangedon the first substrate and a first black matrix layer arranged on the first substrate or the second substrate, the first substrate and the second substrate are arranged oppositely, and the signal linearray comprises clock signal lines and common electrode feedback signal lines; the display panel further comprises a first area configured with the common electrode feedback signal lines and a secondarea configured with the clock signal lines; the first black matrix layer comprises a blank area, and orthographic projection of at least one of the first area and the second area on the first substrate and that of the blank area on the first substrate have overlapped area. Forming of coupling capacitance between the clock signal lines and the common electrode feedback signal lines is avoided, and the problem that horizontal cross grains frequently appear is solved.

The circuit consists of two pieces of predriver, resistance string in use for voltage division, two load capacitances in use for lowering slew rate of input clock, and clock reshapping drive connected each other through circuit. Number of resistance in string, number of reshapping drive is equal to number of phase interpolation. The two load capacitances are connected between two pieces of predriver and two ends of resistance string respectively. Reshapping drives are connected to each resistance in parallel. Thus, flatten out edge is adjusted back to original shape; and circuit in next stage is driven. Advantages are: reduced chip area and weakened interference of power supply and signal crosstalk.

The present disclosure provides a touch panel which at least comprises a sensing area, a conductive wire area, and earthing lines. The conductive wire area surrounds the sensing area and is electrically connected to the sensing area, and the conductive wire area comprises a first conductive wire area and a second conductive wire area. The earthing lines are set between the first conductive wire area and the second conductive wire area. The touch panel can efficiently shield signal crosstalk between the first conductive wire area and the second conductive wire area by setting the earthing lines between the first conductive wire area and the second conductive wire area, thereby reducing the influence of signal crosstalk on efficiency of the touch panel.

A capacitive touch screen is provided. Return-loop electrodes of touch signals are established on the capacitive touch screen or a product where the capacitive touch screen is applied, and touch detection electrodes for detecting changes of the touch signals and the touch return-loop electrodes are respectively connected to different output ends of a touch excitation source, so that a closed touch loop is formed by the touch excitation source, the touch detection electrodes, the touch return-loop electrodes, and coupling capacitances between the touch detection electrodes and the touch return-loop electrodes, and the touch signals flowing into the touch detection electrodes from the touch excitation source again flows back to the touch excitation source from the touch return-loop electrodes. Then, the touch system is isolated from other systems. Touch information is acquired by detecting the change of the current in the touch signals having specific frequencies or other specific characteristics.

The invention relates to the technical field of semiconductor manufacturing, in particular to a method for forming isolation grooves among pixels of a CMOS (complementary metal oxide semiconductor) image sensor. According to the method, a blocking layer covers the surface of a bonded wafer, in addition, a lithography process and a first wet process etching process are adopted for etching a plurality of pattern windows in the blocking layer, in addition, the blocking layer is used as a mask for carrying out second wet process etching process processing on the wafer for replacing the traditional dry process etching process, a plurality of isolation grooves are formed, and subsequent oxide injection is carried out. According to the technical scheme, the problem of great electricity leakage current of a semiconductor device due to substrate damage caused by high-energy ion bombardment in the process of the traditional dry process etching process can be avoided, so the signal cross talk among the pixels of the CMOS image sensor can be reduced, and the photoelectric characteristics of the CMOS image sensor are enhanced.

The invention discloses a circuit board capable of reducing signal crosstalk. At least two pairs of differential pairs are parallelly arranged on the circuit board; each differential pair comprises a positive differential signal line and a negative differential signal line; the circuit board comprises an air discharger; the air discharger comprises a grounding end, a first connection end, and a second connection end; the grounding end is grounded; the first connection end is connected with the positive differential signal line; and the second connection end is connected with the negative differential signal line.

The invention provides an array substrate and manufacturing method thereof and display device, relates to the technical field of display, and can solve the problem of low light transmissivity when an array substrate of a comb-shaped electrode structure is adopted. The manufacturing method of the array substrate includes the steps of: forming a first conductive thin film and a passivation layer thin film on a lining substrate in sequence; adopting a one-time composition process, removing the passivation layer thin film and the first conductive thin film except a to-be-formed first electrode area, and forming a graph of a passivation layer and a graph of a first electrode; forming a second conductive thin film on the lining substrate having the graph of the passivation layer and the graph of the first electrode; and adopting the one-time picture composition process, removing the second conductive thin film except a to-be-form second electrode area, and forming a graph of a second electrode. The manufacturing method of the abovementioned array substrate is used for manufacturing the array substrate.

The invention discloses an electrical connector assembly. The electrical connector assembly comprises a first connector, an intermediate shielding sheet arranged on a first insulating body and locatedbetween two rows of first terminal groups, a second connector, an intermediate iron sheet arranged on a second insulating body and located between two rows of second terminal groups, wherein the intermediate iron sheet comprises a main body part, and at least one elastic abutting joint portion and at least one abutting portion are bent and extended from the main body portion in a vertical direction; the elastic abutting portion is located in front of the abutting portion, and the abutting portion abuts against the second ground terminal to form a ground loop, and enhance the grounding effectof the electrical connector assembly; when the second connector is in butt joint with the first connector, the second ground terminal is in contact with a first ground terminal, the elastic abutting joint portion elastically abuts against the intermediate shielding sheet or the first grounding terminal in the vertical direction, so that resonance generated by the intermediate shielding sheet and the intermediate iron sheet is effectively eliminated, the signal transmission efficiency and quality of the electrical connector assembly are improved, and safety guarantee is provided for the use ofthe electrical connector assembly and electrical equipment thereof.