The invention relates to a
wafer scribing
machine for
chip processing, which comprises a bottom plate, a scribing device, a
workbench, a cooling mechanism and two cleaning mechanisms, wherein each cleaning mechanism comprises a fixed box, a fixed column, an air cylinder, a
piston, an air inlet
pipe, an air outlet
pipe, a filter screen, an oiling
assembly, a fixed block, a driving block, a connecting
rope and two air cylinders; wherein the oiling
assembly comprises an oiling box, a driving plate, a driving rod, a power rod, two first springs and two oiling units, the cooling mechanism comprisesa water tank, a water inlet
pipe, a water spraying pipe, a supporting box, two water squeezing assemblies and two supporting rods, and each water squeezing
assembly comprises a moving plate and two limiting units. According to the
wafer scribing
machine, through the cleaning mechanisms, the
impurity removing function is achieved, the
friction force between the scribing device and the
wafer is prevented from being increased due to adhesion of chippings, so that the scribing work is prevented from being influenced, the scribing quality is improved, the function of cooling the scribing device isachieved through the cooling mechanism, and the scribing device is prevented from being damaged due to overheating.