The invention provides a micro-channel
semiconductor laser, which belongs to the field of
semiconductor optoelectronic technology, and includes a base, a first micro-channel
laser packaging module, a second micro-channel
laser packaging module, a light output window and a sealed housing, and the base is provided with a water inlet and a water outlet. And a circulating
cooling channel; the first micro-channel laser
package module includes a first micro-channel
heat sink and a first laser
chip packaged on the first micro-channel
heat sink; the second micro-channel laser
package module includes a second micro-channel
heat sink and The second laser
chip is packaged on the second
microchannel heat sink, the first laser
chip and the second laser chip are arranged at an
acute angle, and the
light beam emitted by the first laser chip overlaps with the
light beam emitted by the second laser chip. In the micro-channel
semiconductor laser provided by the present invention, two laser chips are arranged at an
acute angle, and the emitted light beams intersect and superimpose to realize the superposition of
optical power, improve the intensity and density of
optical power, and meet the requirements of industrial
processing.