The invention provides micro-nano compound silver-
copper alloy welding paste used for low-temperature
sintering and
interconnection and a production method. The production method comprises the following steps: evenly mixing an
organic solvent, a thickener, a dispersant, a
coupling agent and a
defoamer according to a certain ratio to produce an organic carrier of the micro-nano compound silver-
copper alloy welding paste; and then evenly mixing silver-
copper nano-
alloy particles and silver microparticles which are produced through a
chemical reduction method, and a certain amount of the organic carrier to obtain the micro-nano compound silver-
copper alloy welding paste used for low-temperature
sintering and
interconnection. According to the micro-nano compound silver-
copper alloy welding paste used for low-temperature
sintering and
interconnection and the production method, by adopting a
solid solution alloy principle to dope a silver phase with copper atoms, the single-phase silver-
copper alloy particles are obtained; the problem of oxidation of copper is solved, meanwhile, due to
doping of the copper atoms, the atom
diffusion rate is reduced, the problem of massive volume shrinkage of pure nanometer welding paste in sintering processes is solved, and meanwhile, cost reduction and yield raising are facilitated, so that the micro-nano compound silver-copper alloy welding paste used for low-temperature sintering and interconnection and the production method are suitable for
mass production; and the micro-nano compound silver-copper alloy welding paste can be substituted for traditional Sn-based solder and pure nano-Ag paste in low-temperature connection of third-generation semiconductors, and has higher reliability.