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High temperature platinum resistor assembling method

An assembly method and platinum resistance technology, applied in the direction of using electrical devices, thermometers, measuring devices, etc., can solve the problems of unstable measurement accuracy and weak connection, and achieve the effect of durable measurement accuracy and good connection.

Inactive Publication Date: 2018-12-21
重庆切普电子技术有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a high-temperature platinum resistor assembly method, which can effectively overcome the defects of weak connection and unstable measurement accuracy caused by traditional assembly methods.

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Embodiment Construction

[0024] The specific implementation manner and working principle of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0025] Such as figure 1 As shown, a high-temperature platinum resistor assembly method, the specific steps are as follows:

[0026] Step 1: Use platinum paste to flip-chip-bond the platinum resistance chip 1 on the ceramic substrate 2 (flip-chip bonding is a conventional technique in this field, and will not be described in detail here), and put it into a high-temperature furnace with a temperature of 800-900°C Sintering and solidification inside the sintering solidification, and nitrogen gas is filled for protection during sintering and solidification (of course, the protection gas can also be other inert gases of the same family), and the semi-finished product after sintering and solidification for 1 hour is as follows: figure 2 As shown, the product is then cooled to ambient temperature through ...

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Abstract

The invention discloses a high temperature platinum resistor assembling method, which comprises the following steps of: flip-chip bonding a platinum resistor chip to a ceramic substrate by platinum paste, and performing sintering and curing; coating a high temperature resistant medium slurry on the platinum resistor chip, putting the platinum resistor chip into a high temperature furnace for curing, slowly cooling to 50 DEG C after the curing is finished, and taking the platinum resistor chip out; and connecting a lead wire of the ceramic substrate and an external connecting wire using a roller pinning method to form a high temperature platinum resistor structure. The high temperature platinum resistor assembling method has the advantages that the platinum resistor is guaranteed to meet the requirements of high temperature resistance, good connection, durability and high measurement accuracy in a high temperature environment by using the roller pinning method which is used to connect and fix the lead wire of the ceramic substrate to the external connecting wire, and overcomes the defect that a traditional soldering iron heating method and sintering curing method and the like cannotallow the platinum resistor to work at the high temperature environment.

Description

technical field [0001] The invention relates to the technical field of platinum resistance-based sensor manufacturing, in particular to a high-temperature platinum resistance assembly method. Background technique [0002] In traditional technology, thermocouples are usually used for temperature measurement in high temperature environments. Thermocouples measure temperature through the hot spot effect, and their disadvantages are poor stability and accuracy. The resistance value of platinum resistance will change with the change of temperature, and the measurement accuracy is high. It is widely used in medical, electrical, industrial, satellite, meteorological and other fields. [0003] However, due to the traditional packaging method in the high temperature environment, it is easy to cause poor contact of the platinum resistance connecting wire, which affects the measurement accuracy, so that the platinum resistance can only be generally used in the high temperature environ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/18
CPCG01K7/18
Inventor 牟维清韦柳青唐勇戴祖斌叶青松
Owner 重庆切普电子技术有限公司
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