65results about How to "Maintain electrical connection" patented technology

A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.

A bonding washer for making electrical connection between two metal pieces that are to be mechanically fastened together. The washer, to be interposed between the two metal pieces, is constructed so as to fasten to one of the pieces before the two pieces are joined. Teeth on the washer, positioned at right angles to the plane of the washer, are forced into each of the two metal pieces when the fastener is tightened, making electrical connection between the two metal pieces.

An auxiliary battery pack for use with rechargeable battery powered portable electronic audio devices. The battery pack includes a housing, a portable direct current power source which is contained in the housing, and means for electrical interconnection of the portable direct current power source to the rechargeable battery of the audio device. The battery pack further includes a USB port for charging the auxiliary and rechargeable batteries of the battery pack and audio device. An audio jack connection is provided in the battery pack housing to permit audio output from the audio device when the battery pack is in use.

A water resistant and electromagnetically shielded turret assembly, suitable for attachment to the undersurface of an unmanned surveillance aircraft. The turret, in its several variations, may contain one or more cameras, and may contain an internal positioning motor, which can be easily accessible for servicing.

A process for detecting and terminating a fault in a photovoltaic device is provided that operates in the millisecond or faster timescale. A process includes measuring a current or voltage in each of a plurality of strings relative to a common rail. When the voltage or current from a string is outside a predetermined threshold, a flag is generated indicating the presence of a fault in the string. A control unit will detect the flag and disconnect the faulty string from the system through a switch. The use of continuously rolling averages of baseline currents and voltages as well as a series of measurements averaged to measure the difference of current or voltage at each step provides a process and a fault detection system that does not suffer from false fault detections thereby providing a reliable and efficient system for detecting and terminating faults in photovoltaic devices.

There are provided an antenna integrally formed with a case and a method of manufacturing the same. An antenna integrally formed with a case according to an aspect of the invention includes: a case unit formed of a dielectric material; a radiator integrally formed with the case unit and having terminal units extending from a radiation unit tightly contacting the surface of the case unit; vertical ribs each having an internal connection portion contacting an upper end of the terminal unit and extending downward from an inner surface of the case unit by a predetermined length; and outer connection portions provided on a board disposed adjacent to the case unit and electrically connected to individual lower ends of the internal connection portions.

A lamp strip covering structure includes a first lead (10), a second lead (20) (10), an insulating body (30), LEDs (40), and a thermoplastic film (50). The insulating body (50) is provided with troughs corresponding to the first lead (10) and the second lead (20), thereby uncovering a first connecting section (11) of the first lead (10) and a second connecting section (21) of the second lead (20). The LEDs (40) are electrically connected to the first connecting section (11) and the second connecting section (21). The thermoplastic film (50) wraps the LEDs (40) and the insulating body (30) to cover the LEDs (40) and the insulating body (30) due to a thermal shrinkage. By this structure, the assembly and manufacturing of the lamp strip are simplified with a reduced cost. Further, the electrical connection between the LED (40) and the leads (10, 20) is maintained.

The present invention relates to a semiconductor device and a method for manufacturing the same that prevent deformation or cracking caused by a difference in coefficient of thermal expansion. Elastic contacts provided on upper and lower surfaces of an interposer are elastically biased against the relatively displaced electrodes. The interposer thus compensates for displacement caused by different coefficients of thermal expansion so that an electrical connection between the electrodes of the first electronic component and the electrodes of the second electronic component is constantly maintained. Accordingly, this prevents separation or cracking in electrode connection areas.

A defrosting glass includes a glass substrate, at least one carbon nanotube composite wire, and at least one first electrode and at least one second electrode. The carbon nanotube composite wire is disposed on the surface of the glass substrate. A carbon nanotube composite wire includes a carbon nanotube wire and a metal coating layer. Each carbon nanotube composite wire includes a carbon nanotube wire and a metal coating layer on the surface of the carbon nanotube wire.

A medical electrode which mechanically isolates a conductive interface between the electrode and a patient's skin from forces applied to the lead wires or a lead wire connector is described.

An electrical connector comprising a housing (11) provided with an opening (12) through which a flat circuit device (40) is inserted into the housing (11), a plurality of conductive contacts (13) arranged on the housing (11) for contacting with connecting terminals (41) on the flat circuit device (40) in the housing (11), and a shell member (14) mounted on the housing (11) and provided therein with a holding portion (26; 28) for holding the flat circuit device (40) in the housing (11) and a manipulatable releasing portion (15) for releasing the flat circuit device (40) from holding by the holding portion (26; 28), characterized in that the holding portion (26; 28) is constituted to extend from a portion (14a; 14b) of the shell member (14) provided for covering one of opposite plate-shaped portions (11a,11b) of the housing (11) into an inside of the housing (11) and to have an engaging projection (25; 27) formed thereon for engaging with and disengaging from the flat circuit device (40) selectively, and the manipulatable releasing portion (15) is constituted with the portion of the shell member (14) provided for covering the plate-shaped portion (11c) of the housing (11) for moving with the holding portion (26; 28) in a direction intersecting a contact-arrangement direction.

Positive and negative terminals formed on a top face of a unit cell and positive and negative terminals formed on a surface of a circuit board opposed to the unit cell are electrically connected to each other by connectors. The connectors each include an elastic body formed from an elastic material, and a conductor which is placed so as to be exposed on upper and lower surfaces of the elastic body and which serves for electrically connecting those exposed portions to each other. By elastic restoring force of the elastic body generated by elastic compression of the elastic body between the terminals, the upper and lower surfaces of the connectors are put into press contact between the opposing positive and negative terminals of the unit cell and the circuit board, by which their electrical connection is maintained.

In a printed board having a wiring pattern and an NSMD type land, the present invention prevents disconnection between the land and the wiring pattern and separation of the land from the printed board. The printed circuit board has a main wiring pattern, a protective film covering the main wiring pattern and having an opening formed therein, and a land located inside of the opening of the protective film so that the land is spaced from a circumferential edge of the opening of the protective film. The printed circuit board also has an auxiliary wiring pattern including a first auxiliary wiring portion located under the protective film so as to surround the land and second auxiliary wiring portions radially extending from the land to the first auxiliary wiring portion.

A touch panel comprises a substrate and a touch sensing electrode formed on at least one surface of the substrate. The touch sensing electrode includes a first sensing pattern formed in a first direction, a second sensing pattern formed in a second direction, a first relay pattern formed at an inside of the first sensing pattern in an island form, a second relay pattern formed between the first sensing pattern and the second sensing pattern, and a connection pattern which electrically connect separated unit patterns of the second sensing pattern via the first relay pattern and the second relay pattern. The connection pattern includes a first connection pattern which connects the first relay pattern and the second relay pattern, and a second connection pattern which connects the second relay pattern and the unit pattern of the second sensing pattern.

A pick and place head for a pick and place machine includes a stationary frame; a first circuit board mounted on the stationary frame, the first circuit board including a first plurality of electric circuits; a rotating frame rotatably mounted to the stationary frame; a plurality of spindle assemblies mounted one the rotating frame, each of the plurality of spindle assemblies including a set of electric contacts; a second circuit board mounted on the rotating frame, the second circuit board including a second plurality of electric circuits; a slip ring assembly mounted between the first circuit board and the second circuit board; the slip ring assembly including a first portion and a second portion; the first portion of the slip ring assembly being rotatable relative to the second portion of the slip ring assembly, and the slip ring assembly further including a set of electrical connectors that enable the first plurality of electric circuits to maintain electrical connection with the second plurality of electric circuits while the first portion rotates relative to the second portion; the second circuit board further including a plurality of electric contacts, the plurality of electric contacts on the second circuit board engaged with respective ones of the contacts of the plurality of spindle assemblies; an electric bus connected to the first plurality of circuits so as to provide power and control signals to the pick and place head; and a motor to rotate the second circuit board.

A thin board-to-board connector with high density in which there is no connection between three-dimensional complex metal springs. The board-to-board connector (1) comprises a connector (4) having a bump (43) for electrical connection having an umbrella shape on a board (41) and connected to a circuit board (2) and a connector (5) having an elastic electrically conductive section (54) having a through hole (55) made in a conductive pattern (53) on an elastic insulating board (51) and connected to a circuit board (3) electrically connected to the elastic conductive section (54). When a bump (43) is inserted into the through hole (55), the elastic conductive section (54) is electrically connected to the bump (43), and the side surface of the through hole (55) is pressed against to the bump (43) and elastically deformed and dented. Consequently, the bump (43) is press-fit into the through hole (55). With this, the bump (43) can be inserted into the elastic conductive section (54) and engaged with it, and thereby electrical and mechanical connection between circuit boards can be simultaneously achieved in a two-dimensional manner, realizing a low-height connector.

A socket terminal includes a front connection portion that comes into contact with a plug terminal, in which a recess having an inner wall is formed in a contact surface that comes into contact with the front connection portion. The front connection portion is locked on the inner wall by coming into contact with the inner wall when moving in a direction in which the plug terminal is pulled out from the socket terminal. The front connection portion also includes a contact edge that wipes impurities off the contact surface. An electrical connection between the socket terminal and the plug terminal can be maintained by locking the socket terminal on the inner wall even with an application of vibrations in directions in which the plug terminal is inserted and pulled out. Since the contact edge can remove the impurities, the electrical connection between the terminals can be stabilized.

The present invention provides a sensor capable of maintaining an electrical connection between the lead frame and an electrode terminal section of the detection element even when an inadequate external force is applied to a lead frame and a sensor production method capable of preventing the lead frame from buckling and being deformed into an inadequate shape. The lead frame (second lead frame) can inhibit movement of a second frame main body section axially toward a rear end side through engagement of a third locking surface of a second locking section with a second locking groove and can inhibit the second frame main body section from going apart from an inner surface of an insertion hole through engagement of a fourth locking surface of the second frame locking section, which faces an element engagement section side. Namely, even when an external force is applied to the lead frame, movement of the lead frame main body section (second lead frame main body section) can be inhibited and a variation in the relative positions of the lead frame and the detection element can be prevented.

By dividing a single chip area into individual sub-areas, a thermally induced stress in each of the sub-areas may be reduced during operation of complex integrated circuits, thereby enhancing the overall reliability of complex metallization systems comprising low-k dielectric materials or ULK material. Consequently, a high number of stacked metallization layers in combination with increased lateral dimensions of the semiconductor chip may be used compared to conventional strategies.

In an accommodation space formed by a rotator and a stator, a flat cable and a dummy cable are accommodated. A retainer placed in a bottom part of the accommodation space is provided with a press guide for allowing a reversed part of the dummy cable, at which a winding direction thereof is reversed, to be pressed thereon.

A coaxial cable connector includes: a pair of first crimp pieces; and a pair of second crimp pieces. Into the pair of first crimp pieces, an insulating inner sheath and at least a part of a braided wire, which are exposed from an insulating outer sheath, are inserted. The pair of second crimp pieces are located on outsides of the pair of first crimp pieces, and are crimped so as to surround the pair of first crimp pieces. Moreover, the pair of first crimp pieces are formed into a shape that is along inner walls of the pair of second crimp pieces.