64results about How to "Maintain electrical connection" patented technology

A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.

A bonding washer for making electrical connection between two metal pieces that are to be mechanically fastened together. The washer, to be interposed between the two metal pieces, is constructed so as to fasten to one of the pieces before the two pieces are joined. Teeth on the washer, positioned at right angles to the plane of the washer, are forced into each of the two metal pieces when the fastener is tightened, making electrical connection between the two metal pieces.

A process for detecting and terminating a fault in a photovoltaic device is provided that operates in the millisecond or faster timescale. A process includes measuring a current or voltage in each of a plurality of strings relative to a common rail. When the voltage or current from a string is outside a predetermined threshold, a flag is generated indicating the presence of a fault in the string. A control unit will detect the flag and disconnect the faulty string from the system through a switch. The use of continuously rolling averages of baseline currents and voltages as well as a series of measurements averaged to measure the difference of current or voltage at each step provides a process and a fault detection system that does not suffer from false fault detections thereby providing a reliable and efficient system for detecting and terminating faults in photovoltaic devices.

A lamp strip covering structure includes a first lead (10), a second lead (20) (10), an insulating body (30), LEDs (40), and a thermoplastic film (50). The insulating body (50) is provided with troughs corresponding to the first lead (10) and the second lead (20), thereby uncovering a first connecting section (11) of the first lead (10) and a second connecting section (21) of the second lead (20). The LEDs (40) are electrically connected to the first connecting section (11) and the second connecting section (21). The thermoplastic film (50) wraps the LEDs (40) and the insulating body (30) to cover the LEDs (40) and the insulating body (30) due to a thermal shrinkage. By this structure, the assembly and manufacturing of the lamp strip are simplified with a reduced cost. Further, the electrical connection between the LED (40) and the leads (10, 20) is maintained.

The present invention relates to a semiconductor device and a method for manufacturing the same that prevent deformation or cracking caused by a difference in coefficient of thermal expansion. Elastic contacts provided on upper and lower surfaces of an interposer are elastically biased against the relatively displaced electrodes. The interposer thus compensates for displacement caused by different coefficients of thermal expansion so that an electrical connection between the electrodes of the first electronic component and the electrodes of the second electronic component is constantly maintained. Accordingly, this prevents separation or cracking in electrode connection areas.

A lever connector includes a first connector portion including a first terminal housing with a plurality of first connecting terminals, a second connector portion including a second terminal housing with a plurality of second connecting terminals, a plurality of isolating plates, a connecting member to fix the first and second connecting terminals at the contacts therebetween, and a lever structure including a turn lever provided to hold both sides of either one of the first or second terminal housing. The lever structure includes a connecting member manipulating mechanism for turning the turn lever to manipulate the connecting member to apply a pressing force to each of the contacts or release the applying of that pressing force. The connecting member manipulating mechanism includes a contact holding means for maintaining the electrical connections between the first and second connecting terminals, respectively, even in the event of the absence of the turn lever.

A defrosting glass includes a glass substrate, at least one carbon nanotube composite wire, and at least one first electrode and at least one second electrode. The carbon nanotube composite wire is disposed on the surface of the glass substrate. A carbon nanotube composite wire includes a carbon nanotube wire and a metal coating layer. Each carbon nanotube composite wire includes a carbon nanotube wire and a metal coating layer on the surface of the carbon nanotube wire.

Positive and negative terminals formed on a top face of a unit cell and positive and negative terminals formed on a surface of a circuit board opposed to the unit cell are electrically connected to each other by connectors. The connectors each include an elastic body formed from an elastic material, and a conductor which is placed so as to be exposed on upper and lower surfaces of the elastic body and which serves for electrically connecting those exposed portions to each other. By elastic restoring force of the elastic body generated by elastic compression of the elastic body between the terminals, the upper and lower surfaces of the connectors are put into press contact between the opposing positive and negative terminals of the unit cell and the circuit board, by which their electrical connection is maintained.

A pick and place head for a pick and place machine includes a stationary frame; a first circuit board mounted on the stationary frame, the first circuit board including a first plurality of electric circuits; a rotating frame rotatably mounted to the stationary frame; a plurality of spindle assemblies mounted one the rotating frame, each of the plurality of spindle assemblies including a set of electric contacts; a second circuit board mounted on the rotating frame, the second circuit board including a second plurality of electric circuits; a slip ring assembly mounted between the first circuit board and the second circuit board; the slip ring assembly including a first portion and a second portion; the first portion of the slip ring assembly being rotatable relative to the second portion of the slip ring assembly, and the slip ring assembly further including a set of electrical connectors that enable the first plurality of electric circuits to maintain electrical connection with the second plurality of electric circuits while the first portion rotates relative to the second portion; the second circuit board further including a plurality of electric contacts, the plurality of electric contacts on the second circuit board engaged with respective ones of the contacts of the plurality of spindle assemblies; an electric bus connected to the first plurality of circuits so as to provide power and control signals to the pick and place head; and a motor to rotate the second circuit board.

A thin board-to-board connector with high density in which there is no connection between three-dimensional complex metal springs. The board-to-board connector (1) comprises a connector (4) having a bump (43) for electrical connection having an umbrella shape on a board (41) and connected to a circuit board (2) and a connector (5) having an elastic electrically conductive section (54) having a through hole (55) made in a conductive pattern (53) on an elastic insulating board (51) and connected to a circuit board (3) electrically connected to the elastic conductive section (54). When a bump (43) is inserted into the through hole (55), the elastic conductive section (54) is electrically connected to the bump (43), and the side surface of the through hole (55) is pressed against to the bump (43) and elastically deformed and dented. Consequently, the bump (43) is press-fit into the through hole (55). With this, the bump (43) can be inserted into the elastic conductive section (54) and engaged with it, and thereby electrical and mechanical connection between circuit boards can be simultaneously achieved in a two-dimensional manner, realizing a low-height connector.

By dividing a single chip area into individual sub-areas, a thermally induced stress in each of the sub-areas may be reduced during operation of complex integrated circuits, thereby enhancing the overall reliability of complex metallization systems comprising low-k dielectric materials or ULK material. Consequently, a high number of stacked metallization layers in combination with increased lateral dimensions of the semiconductor chip may be used compared to conventional strategies.

In an accommodation space formed by a rotator and a stator, a flat cable and a dummy cable are accommodated. A retainer placed in a bottom part of the accommodation space is provided with a press guide for allowing a reversed part of the dummy cable, at which a winding direction thereof is reversed, to be pressed thereon.

A coaxial cable connector includes: a pair of first crimp pieces; and a pair of second crimp pieces. Into the pair of first crimp pieces, an insulating inner sheath and at least a part of a braided wire, which are exposed from an insulating outer sheath, are inserted. The pair of second crimp pieces are located on outsides of the pair of first crimp pieces, and are crimped so as to surround the pair of first crimp pieces. Moreover, the pair of first crimp pieces are formed into a shape that is along inner walls of the pair of second crimp pieces.