30results about How to "Increase heat transfer limit" patented technology

The invention discloses a phase change heat dissipation device which comprises a phase change component, wherein a phase change heat exchange medium is arranged in the phase change component, when thephase change heat exchange medium arranged in the phase change component is configured to a work state of the phase change heat dissipation device, the atmospheric pressure in the phase change component is more than 0.15MPa. When the phase change heat dissipation device is at work, the work temperature range is 30-80 DEG C, internal pressure is far larger than a standard atmospheric pressure, under a positive pressure non-vacuum environment, heat-flow density of a heating source is large, absolute pressure of a phase change component evaporation part is high, relative pressure difference of different parts of the phase change component under the same temperature difference condition is large, and more phase change mediums can be driven by the pressure difference so as to reinforce the heat exchange ability. With adoption of the phase change heat dissipation device, the mobility of the internal phase change heat exchange medium is improved, the heat-flow density of heat transfer is improved, and efficient heat dissipation is easily realized.

The invention discloses a phase change heat dissipation device which comprises a phase change component, wherein a phase change heat exchange medium is internally arranged in the phase change component, the phase change component comprises an evaporation part and a condensation part; an evaporation cavity is formed in the evaporation part, a condensation cavity is formed in the condensation part,and the evaporation cavity communicates with the condensation cavity; a heating source is directly contacted with the evaporation cavity, the phase change heat exchange medium in the evaporation cavity can absorb heat of the heating source and moves toward the condensation cavity; and the condensation cavity can outward dissipate heat to cool the heating source. In the phase change heat dissipation device, the phase change component is directly contacted with the heating source, without increasing a transitional thermal conductive plate, an appearance of the evaporation part is adapted to thatof the heating source, the phase change component can fully contact with the heating source, a heat transfer area is big, and a temperature difference between the heating source and the phase changeheat exchange medium is minimum.

The invention relates to an ultra-thin flat heat pipe and a manufacturing method thereof. A wick comprises a porous medium bottom layer and a plurality of porous medium filaments arranged side by side; the porous medium filaments make contact with the top of a tube shell; the wick inside the heat pipe, a sharp angled area between the porous medium filaments and the upper surface of the tube shell, and a sharp angled area between the porous medium filaments and the porous medium bottom layer provide liquid return capillary driving force which is large enough in a limited space; spaces formed between the porous medium filaments provide steam flow channels, and the steam flow channels communicate with one another; and reasonable matching of vapor-liquid phase distribution is achieved, and steam and condensed liquid can flow easily. According to the ultra-thin flat heat pipe, efficient operation can be maintained at various angles, the performance of anti-gravity operation is excellent, the heat flux which can be borne by the heat pipe is high, and the heat transfer performance of the heat pipe is remarkably improved after further modification treatment.

The present invention relates to the technical field of heat dissipation devices, and more specifically relates to an ultra-thin flat heat pipe and its manufacturing process, including a bottom plate and a cover plate snap-fitted and packaged, and the bottom plate is provided with concave holes with several capillary structures arranged in parallel. In the cavity, a gas flow channel for the flow of the working fluid of the heat pipe is formed between adjacent capillary structures, and the capillary structure includes several liquid flow channels arranged in parallel. The gas working medium flows in the gas flow channel, and the liquid working medium flows in the capillary structure, so as to realize the gas-liquid separation of the working medium, reduce the flow resistance, and improve the heat transfer limit of the heat pipe; and the invention has simple structure and simple manufacture, and can It realizes industrial assembly line production, and has strong heat transfer capacity. The thickness of the heat pipe is small, which can meet the heat dissipation of electronic devices in narrow spaces, and meet the needs of integration and miniaturization of electronic components. It has good practicability and applicability. .

The invention discloses a vapor chamber, which comprises a bottom plate and a cover plate, wherein the bottom plate and the cover plate are hermetically connected to construct a hollow enclosed cavity; the bottom plate is provided with a super-hydrophobic surface which is taken as the condensing area of the vapor chamber; the cover plate is provided with a super-hydrophilic surface which is taken as the evaporating area of the vapor chamber; foam copper is buried in the enclosed cavity by pressing; one end of the foam copper is connected with the cover plate, and the other end of the foam copper is connected with the bottom plate, thereby facilitating return of a working medium from the condensing area to the evaporating area. According to the vapor chamber, the heat exchange performance of the evaporating area and the condensing area of the vapor chamber is enhanced, the heat exchange capability of the vapor chamber is enhanced by using circular flow of the working medium in the evaporating area and the condensing area, and the heat exchange limit of the vapor chamber is increased.

The invention discloses a heat pipe and a manufacturing method of the heat pipe. The heat pipe and the manufacturing method of the heat pipe can achieve cooling of electronic devices and a device. According to the heat pipe, a pipe shell is arranged on the outermost portion, a steam chamber is formed in the innermost portion, the steam chamber is divided into an evaporation segment, a thermal insulation segment and a condensation segment in the axial direction of the steam chamber, the thermal insulation segment is arranged in the middle, the evaporation segment and the condensation segment are arranged at the two ends respectively, a cylindrical capillary liquid absorption core layer formed by a multi-hole foamy copper liquid absorption core is closely attached to the inner wall of the pipe shell, holes in the multi-hole foamy copper liquid absorption core are different in hole diameter, a silk screen supporting frame is closely attached to the inner wall of the capillary liquid absorption core layer, the steam chamber is filled with a metal oxide water-based nanofluid working medium, the volume of the nanofluid working medium is 40% to 60% that of the evaporation segment, and metal oxide is aluminum oxide or copper oxide or silicon dioxide. According to the heat pipe and the manufacturing method of the heat pipe, nanofluid and multi-hole foamy copper are combined in the heat pipe, and the heat transfer efficiency of the heat pipe is improved.

The invention belongs to the technical field of heat transfer, and particularly relates to a composite liquid-cooling heat pipe radiator. The composite liquid-cooling heat pipe radiator comprises a flat plate heat pipe, wherein heat generated by a heating component is transferred to a bottom plate of the flat plate heat pipe, a top plate of the flat plate heat pipe is provided with protrusions perpendicular to the bottom plate of the flat plate heat pipe, the protrusions form a tubular heat pipe, and an inner cavity of the flat plate heat pipe is communicated with an inner cavity of the tubular heat pipe. The composite liquid-cooling heat pipe radiator further comprises a shell. The flat plate heat pipe and the tubular heat pipe are both located in the shell, and the bottom plate of the flat heat pipe is attached to the bottom surface of the shell in a sealed mode; an area defined by the outer surface of the flat plate heat pipe, the outer surface of the tubular heat pipe and the innerwall of the shell forms a cooling liquid channel; and the shell is provided with a cooling liquid inlet and a cooling liquid outlet. According to the radiator, the tubular heat pipe is combined withthe flat plate heat pipe, so that the radiator can be attached to a flat surface of the heating component and has a good radiating effect; and meanwhile, heat released by a refrigerant of a condensation section is taken away through liquid cooling, and compared with air convection heat dissipation, the heat exchange capacity of the composite heat pipe with the outside is improved.

The invention discloses a hot fin, comprising two side panels, a side frame for connecting the side panels so as to form a hollow thin panel shaped shell body, a capillary structure layer closed to the inner wall of the shell body, and a phase change working medium sealed in the shell body, wherein a part of the side frame is used as an evaporation zone and contacted with the surface of the hot source; the rest part of the shell body is used as a condensing zone. The hot fin adds the steam transmission channel area, the backflow width of a liquid working medium and the direct radiating area of the condensing zone, shortens the distance from the center of the evaporation zone to the edge of the evaporation zone, greatly improves the heat transfer limit so as to acquire higher hot flow density.

A heat dissipation device for high-power LED lamps, belonging to the technical field of LED heat dissipation, comprising an upper lampshade, a circuit board, a heat dissipation fan, a finned shell, a gas-liquid pulsation phase change heat pipe, a mounting base, an LED bead integrated board, a lower lampshade, and a glass The device consists of a gas-liquid pulsation phase change heat pipe as the core heat transfer component, which efficiently transmits the heat generated by the high-power LED lamp bead array at the bottom to the three-dimensional space and quickly dissipates it; the self-wetting fluid working fluid filled in the tube It can automatically wet the evaporation section of the heat pipe, which can effectively improve the "dry-out" limit of the heat pipe; the capillary suction force generated by the micro-grooves on the inner wall of the heat pipe can also enhance the wettability of the working medium to the inner wall of the entire pipe, thereby further improving its Uniform temperature and heat transfer limit; compared with existing metal fin LED lighting cooling devices and traditional heat pipe LED lighting cooling devices such as capillary heat pipes and gravity heat pipes, this device has better heat transfer performance, higher Heat transfer limit and better work adaptability.

The invention discloses a secondary core evaporator and application thereof. The secondary core evaporator comprises an upper body, a lower end cover, a main capillary core and a secondary core, wherein the upper body is connected with the lower end cover, and is provided with an inlet and an outlet; the inlet is connected with a liquid pipeline provided with multiple holes in the tail end; the main capillary core and the secondary core are accommodated in a closed space, and are respectively and tightly contacted with the lower end cover and the upper body; the secondary core has an annular structure; a straight rib for dividing the secondary core into two cavities is radially distributed along the annular structure in the secondary core; the cavities serve as compensation cavities for storing working mediums; a hole way is formed in the straight rib; the tail end of the liquid pipeline is directly inserted into the hole way; a steam groove way is formed in the main capillary core; and a space surrounded by the periphery of the steam groove way, the upper body and the lower end cover serves as a steam collecting cavity for collecting steam. The secondary core evaporator reduces the backflow resistance, the contact heat resistance and the back heat conduction of supercooling liquid, lowers the temperature of the compensation cavities, improves the system power, and improves the heat transfer limitation.