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Hot fin

A technology of hot fins and side panels, applied to hot fins. It can solve the problems of long distance and low heat transfer limit value of vapor chamber, and achieve the effect of wide reflow width, which is conducive to divergence and condensation, and improves the heat transfer limit

Inactive Publication Date: 2017-06-13
张跃
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the longer distance from the center of the vapor chamber evaporation area to the edge of the evaporation area, the center of the evaporation area of ​​the vapor chamber will evaporate earlier, resulting in a lower heat transfer limit of the vapor chamber

Method used

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Embodiment Construction

[0037] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that the present invention is not limited to the following specific embodiments, and those skilled in the art should understand the present invention from the spirit embodied in the following embodiments, and each technical term can be made the broadest based on the spirit of the present invention. understanding. The same or similar components in the figures are denoted by the same reference numerals.

[0038] figure 2 , image 3 The first embodiment of the present invention is shown, as shown in the figure, the heat fin of the present invention includes two side panels 21 forming a hollow plate-shaped casing 2 and frames 22, 23 connecting the two side panels 21, tightly The capillary structure layer 12 attached to...

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Abstract

The invention discloses a hot fin, comprising two side panels, a side frame for connecting the side panels so as to form a hollow thin panel shaped shell body, a capillary structure layer closed to the inner wall of the shell body, and a phase change working medium sealed in the shell body, wherein a part of the side frame is used as an evaporation zone and contacted with the surface of the hot source; the rest part of the shell body is used as a condensing zone. The hot fin adds the steam transmission channel area, the backflow width of a liquid working medium and the direct radiating area of the condensing zone, shortens the distance from the center of the evaporation zone to the edge of the evaporation zone, greatly improves the heat transfer limit so as to acquire higher hot flow density.

Description

[0001] This application is a divisional application of a Chinese invention patent application with an application date of January 18, 2012, an application number of 201210016284.4, and an invention title of Hot Fin. technical field [0002] The invention relates to a phase change heat transfer device, in particular to a heat-wing. Background technique [0003] Compared with solid metals with high thermal conductivity, phase change heat transfer devices have higher equivalent thermal conductivity and better heat dissipation performance. It relies on the phase change of its internal liquid working medium to conduct heat, and has high thermal conductivity and excellent isothermal properties. And other advantages, are widely used in industry. At present, heat pipes and vapor chambers are more commonly used heat dissipation devices in phase change heat transfer devices. [0004] see figure 1 A typical heat pipe consists of a tube shell 11, a capillary structure 12 and a phase-c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04
CPCF28D15/04
Inventor 张跃
Owner 张跃
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