A kind of ultra-thin flat heat pipe and its manufacturing process

Abstract

The present invention relates to the technical field of heat dissipation devices, and more specifically relates to an ultra-thin flat heat pipe and its manufacturing process, including a bottom plate and a cover plate snap-fitted and packaged, and the bottom plate is provided with concave holes with several capillary structures arranged in parallel. In the cavity, a gas flow channel for the flow of the working fluid of the heat pipe is formed between adjacent capillary structures, and the capillary structure includes several liquid flow channels arranged in parallel. The gas working medium flows in the gas flow channel, and the liquid working medium flows in the capillary structure, so as to realize the gas-liquid separation of the working medium, reduce the flow resistance, and improve the heat transfer limit of the heat pipe; and the invention has simple structure and simple manufacture, and can It realizes industrial assembly line production, and has strong heat transfer capacity. The thickness of the heat pipe is small, which can meet the heat dissipation of electronic devices in narrow spaces, and meet the needs of integration and miniaturization of electronic components. It has good practicability and applicability. .

Description

technical field [0001] The present invention relates to the technical field of heat dissipation devices, and more particularly relates to an ultra-thin flat heat pipe and a manufacturing process thereof. Background technique [0002] Since entering the 21st century, electronic technology and information industry have developed rapidly. The miniaturization and integration of electronic devices has become the development trend of electronic technology. The high integration, high packaging density and high operating frequency of electronic chips make the temperature of the chip rise rapidly. . Studies have shown that the damage rate of electronic components is positively correlated with the operating temperature. When electronic components are under high-temperature operating conditions for a long time, their reliability will decrease significantly. According to statistics, about 55% of the failures of electronic devices are caused by overheating. The normal operating tempera...

AI Technical Summary

Problems solved by technology

However, cylindrical heat pipes, pulsating heat pipes, and loop heat pipes occupy a large volume, which cannot meet the needs of electronic device integration and miniaturization; flat-plate heat pipes are generally divided into two forms: cylindrical heat pipe flattening and upper and lower plate welding in the actual production process. The application of the former is limited due to the flattening width. Although the latter can be flexibly designed and manufactured according to actual application conditions, its relative thickness is relatively large, and the structure with small thickness is difficult to realize industrialization.

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