Liquid metal pulse heat pipe

Abstract

The invention relates to the technical field of heat pipes, and discloses a liquid metal pulse heat pipe. The liquid metal pulse heat pipe comprises a pipe body, a rising pipeline and a returning pipeline; a heating chamber and a heat dissipation chamber which are independent mutually are sequentially constructed in the pipe body from bottom to top, and a low-boiling-point working medium and liquid metal are arranged in the heating chamber from top to bottom in a layered mode; the rising pipeline is arranged in the pipe body and penetrates through the heating chamber and the heat dissipation chamber; the returning pipeline is arranged in the pipe body and penetrates through the heating chamber and the heat dissipation chamber; and the returning pipeline and the rising pipeline are arrangedin a spaced mode. By heating the heating chamber, the low-boiling-point working medium is heated and evaporated into a gaseous work medium, and under the effect of the gas pressure, the liquid metaland the gaseous work medium are alternately conveyed from the heating chamber to the heat dissipation chamber along the rising pipeline in a segmented mode, and then conveyed from the heat dissipationchamber back to the heating chamber along the return pipeline; and the liquid metal pulse heat pipe has the advantages of high heat transfer efficiency and large heat transfer limit.

Description

technical field [0001] The invention relates to the technical field of heat pipes, in particular to a liquid metal pulse heat pipe. Background technique [0002] The 21st century has entered the era of portability and miniaturization, but the integration of electronic processing chips is getting higher and higher, but the volume is getting smaller and smaller. The high frequency and high speed of electronic devices and the density and miniaturization of integrated circuits have caused a sharp increase in the heating power and power density of electronic devices. The cooling technology of electronic devices has become the key to the development of microelectronics technology, requiring features such as compactness, reliability, flexibility and high heat dissipation efficiency. [0003] A heat pipe is a heat transfer element that relies on the phase change of its internal working liquid to transfer heat. It can transfer a large amount of heat through a small cross-sectional a...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a liquid metal pulse heat pipe to solve the problem that the heat pipe in the prior art only transmits the heat exchange working medium from the near end to the far end of the heat pipe through the liquid-absorbing wick, but the heat pipe in the prior art The heat transfer efficiency is low, so that the heat transfer limit of the heat pipe is low, and there will be technical problems of poor heat dissipation for electronic devices with large heat generation and high power consumption

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