The invention discloses a packaging structure and a forming method thereof, wherein the forming method of the packaging structure is that the first surface of a
chip layer is provided with a protective layer and a
welding pad layer, and the second surface of the
chip layer is provided with a plurality of grooves exposed out of the protective layer; a first
insulation layer is formed at each of the second surface of the
chip layer, and the surfaces of the side walls and the bottoms of the grooves; the thicknesses of the first insulation
layers positioned at the bottoms of the grooves are thinner than the thickness of the first
insulation layer positioned at the second surface of the chip layer; through holes penetrating through the first insulation
layers, the protective layer and the
welding pad layer are formed in the bottoms of the grooves; parts of the first insulation
layers around the through holes are removed and are exposed out of the bottoms of the grooves; afterwards, conductive layers are formed at the surfaces of the first insulation layers, the surfaces of the bottoms of the grooves, and the surfaces of the side walls and the bottoms of the through holes. The
electrical performance and the stability of the formed packaging structure are improved.