A conductive paste for a thick film circuit, a thick film circuit board employing the same and a manufacturing method thereof relate to the field of thick film circuits. One of the purposes of the invention is to provide a conductive paste for a thick film circuit, which can replace a silver paste and low cost and high security. The conductive paste comprises the following components by mass percent: 72-77 percent of copper powder, 8-10 percent of inorganic adhesive, 4-6 percent of organic adhesive, 5-12 percent of organic solvent and 1-5 percent of additive. Another purpose of the invention is to provide a thick film circuit board employing the paste and adopting toughened glass as a baseplate. The third purpose of the invention is to provide a manufacturing method of the thick film circuit board. The manufacturing method comprises the steps of preparation of the conductive paste, a encapsulating paste and the baseplate, as well as the printing, encapsulating, sintering, performance test and packaging of a circuit diagram. The thick film circuit board has favorable sintering characteristic and aesthetic appearance, and can be widely used in the manufacturing field of electronic components.