124results about How to "High precision alignment" patented technology

To provide a technology, which enable carrying out an optical position alignment precisely and easily in apparatus and the like used in optical communication, a method of manufacturing an optical module includes forming a guide pin in either a transparent substrate or an optical transmission line support member; forming a guide hole, in which the guide pin is to be inserted, to the other one of the transparent substrate and the optical transmission line support member such that the diameter of the guide hole is made larger as compared with the diameter of the hole; arranging a jig having a protruding portion, of which diameter is substantially the same as the diameter of the guide pin, over the transparent substrate such that the protruding portion is being inserted into the guide hole; filling the gap between the protruding portion and the guide hole with a filler material, which is cured by carrying out a predetermined processing; adjusting a position of the jig; curing the filler material, which is filled in the gap between the protruding portion and the guide pin; and pulling out the protruding portion from the guide hole.

In a camera module (1) of the present invention, a lens member (20) is attached to a semiconductor package (10). The semiconductor package (10) includes: an image sensor (11) mounted on a wiring board (13); and a wire 15 through which the wiring board (13) is electrically connected to the image sensor (11). The image sensor (11) and the wire 15 are sealed with mold resin (14). A step (18) is formed around the perimeter of the surface of the mold resin (14), and the semiconductor package (10) and the lens member (20) are joined by fitting the step (18) and a projection (23) of a lens holder (22). With this arrangement, it is possible to realize a small semiconductor module that allows for highly precise alignment between the semiconductor package and a mounting component to which the semiconductor package is joined.

In a mold in which a pattern is formed of a fine concavo-convex shape, two or more of alignment marks for determining a relative positional relation between a substrate and a mold are formed concentrically. Moreover, a damaged mark is identified from the positional information and shape of the respective marks, and an alignment between the mold and the substrate to which a resin film is applied is carried out excluding the damaged mark.

Provided is a process for producing a surface emitting laser including a surface relief structure provided on laminated semiconductor layers, including the steps of transferring, to a first dielectric film, a first pattern for defining a mesa structure and a second pattern for defining the surface relief structure in the same process; and forming a second dielectric film on the first dielectric film and a surface of the laminated semiconductor layers to which the first pattern and the second pattern have been transferred. Accordingly, a center position of the surface relief structure can be aligned with a center position of a current confinement structure at high precision.

A pattern forming apparatus maintaining alignment between a mold and a substrate. The pattern forming apparatus includes a press pressing the mold against the substrate in a pressing direction, and a mechanism to maintain orientation of the mold and the substrate perpendicular to the pressing direction.

An aligning apparatus includes a moving member, a magnetic member arranged vertically above the moving member, a stator unit which is arranged vertically below the moving member and has a plurality of coreless coils, a first magnet unit which is provided to the moving member and generates a force with the magnetic member, and a second magnet unit which is provided to the moving member and generates a force with the stator unit. The aligning apparatus has no coils between the magnetic member and the moving member.

A mold capable of effecting alignment of the mold and the member to be processed with high accuracy even in such a state that a photocurable resin material is disposed between the mold and the member to be processed is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmittivities to light in a part of an ultraviolet wavelength range of the ultraviolet light. The second material has a refractive index of not less than 1.7.

The present invention provides a solar cell having a selective emitter structure on a doped silicon substrate. The silicon substrate is mono-crystalline or multi-crystalline. A plurality of trenches are formed at the illuminated side of the silicon substrate. After one-time diffusion doping, the silicon substrate is processed through selective etching. The region outside the trenches obtains a lower doping concentration, while the region of the trenches remains to be highly doped. Thus, a selective emitter structure is formed.

A probe unit to be fixed to a probe device for testing functions of a test body. The probe unit includes: a substrate; probe pins formed on the substrate by lithography, the probe pins having distal ends protruded from the substrate and being made in contact with electrodes of the test body; and a positioning member formed on the substrate by lithography at a predetermined position relative to the probe pins, the positioning means abutting upon a member for positioning the substrate relative to the probe device.

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

The present invention comprises a top plate 31 for placing a cylindrical phantom 100, an X-ray tube 22 that generates X-rays, an X-ray detector 23 that detects X-rays transmitted through the phantom 100 placed on a top plate 31, a supporting body drive part 25 that rotates the X-ray tube 22 and X-ray detector 23, a tomographic image data generating part 60 that generates tomographic image data on the phantom 100 based on a results of detecting X-rays by the X-ray detector 23, a calculation processing part 80 that calculates displacement of the cylinder axis J of the phantom 100 relative to the center of rotation (center of scan) by the supporting body drive part 25, based on the tomographic image data, and the angle of gradient of the cylinder axis J relative to the normal direction (direction of slice) of the rotation plane of said rotation, and a monitor 5 that displays the calculated results.

An optical semiconductor device includes a substrate and a plurality of optical parts mounted thereon. Guide grooves are formed in the substrate at the mounting positions of the optical parts. Each guide groove has first side surfaces, which are substantially orthogonal to the direction of the optical axis, second side surfaces, which are substantially parallel to the direction of the optical axis and substantially perpendicular to the surface of the substrate, and a bottom surface substantially parallel to the surface of the substrate. Each guide groove has a size and a depth that allow at least a bottom portion of the corresponding optical part to be received therein. The corresponding optical part is accommodated in each guide groove in abutting contact with the first side surfaces of the guide groove, whereby the optical parts are aligned with one another along the direction of the optical axis.

The invention discloses an automatic align device for integrated photon chip and arrayed fibers, wherein a bottom plate (100) is provided with a central platform (200) and is provided with two six-dimension high accuracy movable platforms symmetrically at the left and right of the central platform (200). The invention is provided with two six-dimension high accuracy movable platforms and a compact and reasonable structure, thus is suitable for abutting and packing various plane waveguides demanding high accuracy aligning and is easy to fit external devices as IR-CCD, machine vision, adhesive deposit device, UV solidifier and the like. The invention has simple operation, large motion range and high accuracy.