125results about How to "High precision alignment" patented technology

To provide a technology, which enable carrying out an optical position alignment precisely and easily in apparatus and the like used in optical communication, a method of manufacturing an optical module includes forming a guide pin in either a transparent substrate or an optical transmission line support member; forming a guide hole, in which the guide pin is to be inserted, to the other one of the transparent substrate and the optical transmission line support member such that the diameter of the guide hole is made larger as compared with the diameter of the hole; arranging a jig having a protruding portion, of which diameter is substantially the same as the diameter of the guide pin, over the transparent substrate such that the protruding portion is being inserted into the guide hole; filling the gap between the protruding portion and the guide hole with a filler material, which is cured by carrying out a predetermined processing; adjusting a position of the jig; curing the filler material, which is filled in the gap between the protruding portion and the guide pin; and pulling out the protruding portion from the guide hole.

In a camera module (1) of the present invention, a lens member (20) is attached to a semiconductor package (10). The semiconductor package (10) includes: an image sensor (11) mounted on a wiring board (13); and a wire 15 through which the wiring board (13) is electrically connected to the image sensor (11). The image sensor (11) and the wire 15 are sealed with mold resin (14). A step (18) is formed around the perimeter of the surface of the mold resin (14), and the semiconductor package (10) and the lens member (20) are joined by fitting the step (18) and a projection (23) of a lens holder (22). With this arrangement, it is possible to realize a small semiconductor module that allows for highly precise alignment between the semiconductor package and a mounting component to which the semiconductor package is joined.

Provided is a MEMS device which is robust to the misalignment and does not require the double-side wafer processing in the manufacture of a MEMS device such as an angular velocity sensor, an acceleration sensor, a combined sensor or a micromirror. After preparing a substrate having a space therein, holes are formed in a device layer at positions where fixed components such as a fixing portion, a terminal portion and a base that are fixed to a supporting substrate are to be formed, and the holes are filled with a fixing material so that the fixing material reaches the supporting substrate, thereby fixing the device layer around the holes to the supporting substrate.

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

A MEMS fabrication process eliminates through-wafer etching, minimizes the thickness of silicon device layers and the required etch times, provides exceptionally precise layer to layer alignment, does not require a wet etch to release the moveable device structure, employs a supporting substrate having no device features on one side, and utilizes low-temperature metal-metal bonding which is relatively insensitive to environmental particulates. This process provided almost 100% yield of scanning micromirror devices exhibiting scanning over a 12° optical range and a mechanical angle of ±3° at a high resonant frequency of 2.5 kHz with an operating voltage of only 20 VDC.

The optical fiber fixing member made of glass, especially optical fiber guide block, is conventionally produced by a mechanical processing. However, the mechanical processing has problems that a production cost becomes high and mass-production is difficult. The problems above can be solved by the present invention providing a method for producing an optical fiber fixing member comprising: disposing a glass shaping preform whose plane view resembles to the plane view of the molded article and whose faces to be positioned in the pressurizing direction during press-molding assumes planes or outwardly convex curved surfaces, in a mold having a cavity of a given shape; and heating the glass shaping preform up to a temperature at which the glass shaping preform can be mold-shaping and thereby press-molding it into a molded article having at least one edge formed of a free surface.

A rotor shaft of a first electric motor is connected to a crankshaft of the engine by being fit to a transmitting member that is coupled to the crankshaft. The stator and rotor shaft of the first electric motor are supported by a case housing the first electric motor.

A light beam scanning display for displaying an image on a drawing screen by modulating laser beams from three primary color light sources, the three primary color light sources being arranged in close vicinity to each other, based on image data respectively and then scanning the laser beams, the light beam scanning display comprising: a parallelizing section that parallelizes respective laser beams; wherein the laser beams being parallelized by the parallelizing section to form one pixel of a drawn image on the drawing screen via different optical paths such that optical axes of the laser beams do not overlap with each other.

The invention provides a light-emitting device which is capable of applying light to a display panel with uniformity in brightness and can be made lower in profile. A light-emitting device (11) includes an LED chip (111a), a base support (111b) which supports the LED chip (111a), and a lens (112) disposed in contact with the LED chip (111a) so as to cover the LED chip (111a) and the base support (111b). The lens (112) has first curved sections (1122) which reflect light that has reached a top surface (112a) so that the reflected light is emitted from a side surface (112b), and second curved sections (1123) which refract light that has reached the top surface (112a) to outside so that the refracted light is emitted from the top surface (112a).

Disclosed are a semiconductor wafer, a semiconductor device, and a method of manufacturing the semiconductor device, which are capable of easily carrying out an alignment between a semiconductor substrate and an electron beam exposure apparatus. There is provided a method including steps of: forming an interlayer insulating film 25 on a gate electrode 17a and a conductive film 17, as well as in a first opening 17b; forming in the interlayer insulating film 25 a second opening 25a including the first opening 17b; forming a hole 14a in an element isolation insulating film 14 under the first opening 17b; by use of the first opening 17b and the hole 14a as an alignment mark 27 used for the alignment in a state where a resist 28 is applied, measuring an intensity of a reflected electron EBref from the alignment mark 27, thus aligning the electron beam exposure apparatus with the semiconductor substrate 10; exposing with an electron beam EB the resist 28 existing in a hole formation region of a first region I; and developing the resist 28 to make a resist pattern 28e.

A method of manufacturing a flexible wiring substrate of the present invention includes the steps of preparing a tape-like substrate composed of a resin layer and a reinforcing metal layer provided on its lower surface, then forming a via hole whose depth reaches the reinforcing metal layer by processing the resin layer of the tape-like substrate by the laser, and then forming a wiring pattern which is connected to the reinforcing metal layer through the via hole on the resin layer by the semi-additive process, wherein the reinforcing metal layer is patterned to constitute a connection pad connected to the wiring pattern or is removed.

An imprint apparatus, comprising a first holder for holding a mold having an imprint pattern; a second holder for holding a workpiece to which the imprint pattern is transferred; a first illumination system for irradiating a mark for determining a position of the mold and a mark for determining a position of the workpiece with light; a first and second optical systems for imaging the marks for the mold and workpiece at a first and second observation points respectively; an imaging optical system; a first and second image pick-up devices for observing the marks for the mold and workpiece respectively; and at least one of a first drive mechanism for moving the first image pick-up device while following movement of the first observation point and a second drive mechanism for moving the second image pick-up device while following movement of the second observation point.

A female connector (10) has a lever (40) in the form of a single plate. The lever (40) is locked at an initial position by a resilient lock (46) before a connecting operation with a male connector (50). An unlocking rib (55) projects from the ceiling surface of a receptacle (53) of the male housing (50) near one side for canceling the locked state of the resilient lock (46) during the connecting operation. An insertion preventing rib (56) projects from the inner surface of the receptacle (53) at a side opposite the unlocking rib (55), and an escape groove (47) for receiving the insertion preventing rib (56) is formed in the upper surface of the lever (40). Thus, the female connector (10) can be prevented from being inserted in a wrong posture.

Provided is an apparatus for generating dental data for manufacturing an aligner, the apparatus including: a dental-data generation unit, in which the dental-data generation unit includes a preprocessing module includes a first module that receives data on a current state of the teeth of the patient from a scanner that scans the current state of the teeth of the patient, a second module that generates a state of the teeth of the patient and the vicinity of the teeth as 3D data, based on the data received from the scanner, a third module that sets a central point for dental movement in the 3D data, a fourth module that sets each central reference for a crown, a buccal surface, and a lingual surface of the tooth in the 3D data, and a fifth module that sets a reference for a dental root point in the 3D data.

An aligning apparatus includes a moving member, a magnetic member arranged vertically above the moving member, a stator unit which is arranged vertically below the moving member and has a plurality of coreless coils, a first magnet unit which is provided to the moving member and generates a force with the magnetic member, and a second magnet unit which is provided to the moving member and generates a force with the stator unit. The aligning apparatus has no coils between the magnetic member and the moving member.

There is provided an inexpensive stage which is equipped with an alignment function and is capable of easily performing high-accuracy alignment especially in a θ direction even in case an object to be processed is large in weight. The stage equipped with an alignment function has a stage main body for holding a substrate while leaving a processing surface thereof open to access. The stage is provided with: a suction means capable of sucking that surface of the substrate which lies opposite to the processing surface; a gas supply means for supplying a gas to such a region of the substrate as is other than a portion sucked by the suction means; and a drive means to give a rotating force to the suction means so that the substrate can be rotated on the same plane by causing the suction means to serve as the center of rotation.

An optical element and an optical transmission member are fixedly secured onto a substrate so as to be coupled to each other. In this substrate, a through hole is formed between an optical element secured portion and an optical transmission member secured portion. In an attempt to assemble these optical transmission member and optical element so as to make the coupling at an optimal position, first, the position of the optical transmission member is adjusted to an optimal position, and after measuring the position by a laser micrometer, the optical transmission member is fixedly secured thereto by using a soldering material. Thus, measurements are again carried out by the laser micrometer to detect an amount of deviation from the measured value before the securing process, and the secured portion is again fused so that the optical transmission member is shifted based on the amount of deviation, and again fixedly secured thereon.

Provided is a process for producing a surface emitting laser including a surface relief structure provided on laminated semiconductor layers, including the steps of transferring, to a first dielectric film, a first pattern for defining a mesa structure and a second pattern for defining the surface relief structure in the same process; and forming a second dielectric film on the first dielectric film and a surface of the laminated semiconductor layers to which the first pattern and the second pattern have been transferred. Accordingly, a center position of the surface relief structure can be aligned with a center position of a current confinement structure at high precision.

An ink jet head in which a multi-nozzle structure is attained, and highly accurate alignment of ink jet head chips is realized, a method for manufacturing the ink jet head, and a recording apparatus on which the ink jet head is mounted. Guide protrusions (141) for alignment of ink jet head chips (41) are formed in an ink jet head chip bonded surface (134) of a nozzle plate (133), the ink jet head chips (41) are aligned by inserting the guide protrusions (141) of the nozzle plate (133) into guide grooves (51) of nozzle surfaces (42) of the ink jet head chips (41), and the nozzle plate (133) and the respective ink jet head chips (41) are bonded with each other by a bonding agent.

Disclosed are a semiconductor wafer, a semiconductor device, and a method of manufacturing the semiconductor device, which are capable of easily carrying out an alignment between a semiconductor substrate and an electron beam exposure apparatus. There is provided a method including steps of: forming an interlayer insulating film 25 on a gate electrode 17a and a conductive film 17, as well as in a first opening 17b; forming in the interlayer insulating film 25 a second opening 25a including the first opening 17b; forming a hole 14a in an element isolation insulating film 14 under the first opening 17b; by use of the first opening 17b and the hole 14a as an alignment mark 27 used for the alignment in a state where a resist 28 is applied, measuring an intensity of a reflected electron EBref from the alignment mark 27, thus aligning the electron beam exposure apparatus with the semiconductor substrate 10; exposing with an electron beam EB the resist 28 existing in a hole formation region of a first region I; and developing the resist 28 to make a resist pattern 28e.

A method of manufacturing an optical sensor module which eliminates the need for the operation of alignment between a core in an optical waveguide section and an optical element in a substrate section and which achieves improvement in alignment accuracy and reduction in costs, and an optical sensor module obtained thereby. An optical waveguide section W2 including protruding portions 4 for the positioning of a substrate section and groove portions 3b for fitting engagement with the substrate section, and a substrate section E2 including positioning plate portions 5a to be positioned in the protruding portions 4 and fitting plate portions 5b for fitting engagement with the groove portions 3b are individually produced.

A probe unit to be fixed to a probe device for testing functions of a test body. The probe unit includes: a substrate; probe pins formed on the substrate by lithography, the probe pins having distal ends protruded from the substrate and being made in contact with electrodes of the test body; and a positioning member formed on the substrate by lithography at a predetermined position relative to the probe pins, the positioning means abutting upon a member for positioning the substrate relative to the probe device.

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

The present invention comprises a top plate 31 for placing a cylindrical phantom 100, an X-ray tube 22 that generates X-rays, an X-ray detector 23 that detects X-rays transmitted through the phantom 100 placed on a top plate 31, a supporting body drive part 25 that rotates the X-ray tube 22 and X-ray detector 23, a tomographic image data generating part 60 that generates tomographic image data on the phantom 100 based on a results of detecting X-rays by the X-ray detector 23, a calculation processing part 80 that calculates displacement of the cylinder axis J of the phantom 100 relative to the center of rotation (center of scan) by the supporting body drive part 25, based on the tomographic image data, and the angle of gradient of the cylinder axis J relative to the normal direction (direction of slice) of the rotation plane of said rotation, and a monitor 5 that displays the calculated results.

An optical semiconductor device includes a substrate and a plurality of optical parts mounted thereon. Guide grooves are formed in the substrate at the mounting positions of the optical parts. Each guide groove has first side surfaces, which are substantially orthogonal to the direction of the optical axis, second side surfaces, which are substantially parallel to the direction of the optical axis and substantially perpendicular to the surface of the substrate, and a bottom surface substantially parallel to the surface of the substrate. Each guide groove has a size and a depth that allow at least a bottom portion of the corresponding optical part to be received therein. The corresponding optical part is accommodated in each guide groove in abutting contact with the first side surfaces of the guide groove, whereby the optical parts are aligned with one another along the direction of the optical axis.