In accordance with the present invention, there is provided a method for manufacturing a
semiconductor package. The method comprises the initial step of applying first and second
photoresist layers to respective ones of opposed first and second surfaces of a
metal plate which includes a die
paddle and a plurality of leads extending at least partially about the die
paddle in spaced relation thereto. The first and second
photoresist layers are then patterned to
expose the die
paddle and prescribed portions of each of the leads. Thereafter, first and second conductive
layers are applied to portions of respective ones of the first and second surfaces which are not covered by the first and second
photoresist layers. The first and second photoresist layers are then removed to facilitate the creation of an exposed area in each of leads which is not covered by the first and second conductive layers. Next, a
semiconductor die is attached to a portion of the first conductive layer covering the die paddle and electrically connected to portions of the first conductive layer covering the leads. The
semiconductor die, the die paddle, the leads and the first and second conductive layers are then encapsulated with a
package body such that portions of the second conductive layer covering the die paddle and the leads, and the exposed area of each of the leads are exposed in a common surface of the
package body. Finally, the exposed area of each of the leads is etched to facilitate the division of the leads into an inner set extending at least partially about the die paddle and an outer set extending at least partially about the inner set.