91results about How to "Ensure joint strength" patented technology

In a frame having a closed-section portion which is formed by joining a first member having a U-shaped section and a second member having a flat-plate shape, a bulkhead is provided in the closed-section portion as a reinforcing member, flanges of the bulkhead and the first and second members are joined with a rigid joint portion where they are joined by a spot welding and a flexible joint portion where they are joined via a damping member. Thereby, transmission of vibrations can be properly restrained, improving the rigidity of the portion having the closed-section portion.

The invention provides a thermosetting resin composition for a joining method of a packaging part. The thermosetting resin composition contains epoxy resin, organic acid and thixotropic agent, wherein the epoxy resin contains dimeric-dibasic-acid type epoxy resin. The joining method of the packaging part comprises a film forming process, a resin-composition adhesion process, a loading process and a reflow soldering process.

In a frame having a closed-section portion which is formed by joining a first member having a U-shaped section and a second member having a flat-plate shape, a bulkhead is provided in the closed-section portion as a reinforcing member, flanges of the bulkhead and the first and second members are joined with a rigid joint portion where they are joined by a spot welding and a flexible joint portion where they are joined via a damping member. Thereby, transmission of vibrations can be properly restrained, improving the rigidity of the portion having the closed-section portion.

The present invention provides a chip engagement device and a chip engagement method which can reduce voids in a solder engagement portion and poor interface engagement. A chip engagement machine which engages a semiconductor chip on a lead frame or a substrate by the solder comprises a conveying unit for conveying the above lead frame or the substrate, a solder supply unit for supplying the solder to the above lead frame or the substrate, and a carrying unit for carrying and engaging the above semiconductor chip onto the above lead frame or the substrate. The chip engagement machine also has a surface clean unit. The surface clean unit removes an oxide film on the solder surface melt in a furnace after the solder is supplied to the lead frame or the substrate. Chip engagement quality can be increased by the above chip engagement device.

An electrically operated valve comprises a sealed housing in which the bottom is fixed on a valve body provided with a valve chamber and a throttling hole; a step motor installed inside the sealed housing comprises a stator coil and an rotor in opposite configuration; a valve needle approaches to or leaves away from the throttling hole according to the driving of the step motor; the inner part of the sealed housing is provided with a stop mechanism for stopping the rotation of the rotor; the stopping mechanism limits the up and down movement of the valve needle so as to control the flow rate of the fluid passing in and out of the valve chamber; the sealed housing comprises a cylindrical wall part, a bent part, an arc part, and a cover-shaped shield component; the cover-shaped shield component comprises a short cylindrical wall part formed on the inner periphery surface of the head part connected through spot welding on the arc part; the cover-shaped shield component comprises a bent part and a top part which are integrally formed; the short cylindrical wall part, the bent part and the top part are respectively formed into the external periphery shapes of the short cylindrical wall part, the bent part, and the top part along the sealed housing; and simultaneously, the cover-shaped shield component is provided with the stop mechanism.

There is provided a method of hermetically sealing electronic parts, comprising the step of bonding a base having semiconductor devices mounted thereon and a cap together via a solder. The solder is composed, by weight, of 78% or more but less than 79.5% Au, and the balance Sn. It is particularly preferred that the bonding is performed with the use of a solder composition composed, by weight, of 78% or more but 79% or less Au, and the balance Sn as the solder and furthermore through plating the cap with gold.

Provided are a vehicle body front portion structure that enables an increase in vehicle body rigidity and strength while suppressing an increase in weight and a decrease in layout freedom, and a vehicle body assembly method. A vehicle body front portion structure (1) is provided with: a first weld portion (11) where a shield lower flange (4a) of a windshield lower member (4) is abutted on a closed cross section of a front pillar (2), and where the shield lower flange (4a), an inner front flange (21a), and a rear end portion (5a) are spot-welded; and a second weld portion (12) where a general portion (5b) of a side member (5), a stiffener front flange (22a), and an outer front flange (3a) are spot-welded at a position forwardly of the first weld portion (11).

Disclosed is a hermetically sealed battery comprising an electrode group (4) which is formed by coiling or laminating a positive electrode plate (1) and a negative electrode plate (2) with a separator (3) interposed therebetween and which is accommodated in a battery casing (5), the battery casing (5) including an opening which is sealed with a sealing plate (10). A lead (11) which leads out from either of the electrode plates in the electrode group (4) is laser-welded to the sealing plate (10), and a weld (14) between the lead (11) and the sealing plate (10) is formed as a line extending across at least the end of the lead (11).

A panel joint structure including: a first panel; a second panel that forms a space between itself and the first panel; a joint portion; a seal member that seals a gap between a distal end portion of the joint flange portion and the second panel; and a first panel bead portion that is formed in a region of the joint flange portion adjacent to the joint portion in the lengthwise direction of the first panel, that projects in a direction away from the second panel, that extends from a distal end to a base end of the joint flange portion, that forms with the second panel an air vent hole communicated with the space, and that slopes in a direction away from the second panel heading toward the base end side of the joint flange portion as seen from the lengthwise direction of the first panel.

A method and a device for friction sir welding capable of achieving sufficient welding strength of a product. [MEANS FOR SOLVING PROBLEMS] Thermal expansion of each tool (2, 3) is prevented because each tool (2, 3) is cooled by air jetted from each air nozzle (4, 5), and this appropriately maintains a gap between an upper tool (2) and a lower tool (3). As a result, a friction stir-welded portion having a residual base plate thickness with an appropriate thickness between an outer panel (6a) and an inner panel (6b) is formed, achieving sufficient welding strength of an engine hood. Air cooled by an extreme low temperature air producer (16) is jetted from each air nozzle (4, 5) to cool each tool (2, 3), and each tool (2, 3) is effectively cooled. The structure above enables thermal expansion of each tool (2, 3) to be constrained to a minimum level to produce a friction stir-welded portion with a residual base plate thickness having a more stable thickness, and as a result, welding strength of the engine hood is sufficiently achieved.

The present invention provides a chip bonding device which can reduce unqualified bonding of gaps and interfaces in bonding parts, a chip bonding method using the same, and chip bonding quality evaluation equipment. Through the chip bonding device, chip bonding quality can be enhanced, and the chip bonding device can utilize soldering tin to bond a semiconductor chip on a lead frame or a substrate. The device is characterized in that the device is provided with a conveying part for conveying the above lead frame or the substrate; a soldering tin supplying part for providing soldering tin for the lead frame or the substrate; a lapping part for lapping and bonding the semiconductor chip to the soldering tin of the lead frame or the substrate; and a surface purification unit for erasing oxidation film of the surface of the soldering tin before the soldering tin is provided to the lead frame or the substrate.

With this copper wire joining method, a rubbed portion on which a coating remains between an electrode and a core wire is formed on the electrode. Then, after a capillary is moved away from the rubbed portion, and a ball is formed by melting a copper wire at a tip end of the capillary. Next, the ball is joined to the rubbed portion by pressing the ball against the rubbed portion.

The present invention relates to a cylinder device and the making method, which will not lead to substantial increase of the manufacturing cost or the reduction of the jointing strength and can increase the tolerance of the cover body to the vibration. In the hydraulic bumper of the connecting rod (2) which is formed by butt-jointing the connecting rod main body (10) extending from the cylinder body (1) and the installing component (12) with a front end becoming the bolt shape part (11), and the connecting rod extends telescopically from the cylinder (1), a flaunching part (13) forms integratedly at the end side of the installing component (12) butt-jointing to the connecting rod main body (10), a flat part (16) which is used to install the cover body (14) of the protecting cover (4) is superposed on the flaunching part (13), the flaunching part and the flat part is jointed by projection welding. The torque moment which functions on the casing (14) in the swing rotating direction is borne by the wide flat surface of the cover body (14), therefore, the stress produced on the casing (14) is dispersed with a wide range, and the result is that fatigue cracking is hard to generate on the cover body even if at the condition that the RV vehicle, etc. function a furious vibration on the cover body (14).

The objective of the present invention is to provide a joint component and a method of manufacturing the same, with which it is possible to protect a linking site between a first flow path and a second flow path, to prevent leakage of fluid from the first flow path and the second flow path, and to ensure the strength of a joint between a first metal piece and a second metal piece. In a joint component (1), a first flow path (3A) of an outside metal piece (2A) and a second flow path (3B) of an inside metal piece (2B) are linked together at a specific site (P) on a joining surface (4). A small bead portion (51) having a weld penetration depth that does not reach a linking site (30) is provided in a first region (R1) of the joining surface (4), including the specific site (P). A large bead portion (52) having a weld penetration depth that is greater than the weld penetration depth of the small bead portion (51) is provided in a second region (R2) excluding the first region (R1).