Solder alloy, solder ball and solder joint using same

A technology of solder joints and solder alloys, applied in the field of solder balls, solder joints, and solder alloys, can solve problems such as damage to joint strength, and achieve the effects of maintaining joint strength, maintaining connection reliability, and high connection reliability

Inactive Publication Date: 2009-02-25
HITACHI METALS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the solder joints exposed to high temperature environment for a long time of more than 500 hours, significant growth of Cu-Ni-Sn compounds occurs, and the grown compounds cannot make the fixing effect effective, so the joint strength will be damaged

Method used

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  • Solder alloy, solder ball and solder joint using same
  • Solder alloy, solder ball and solder joint using same
  • Solder alloy, solder ball and solder joint using same

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Embodiment Construction

[0045] As mentioned above, the important feature of the solder alloy of the present invention is to optimize the addition amount of Ag and Ni so as not to hinder the impact resistance of the Sn—Cu alloy. Needless to say, the Cu electrode, even if it is applied to the Ni In the case of electrodes, the growth of (Cu, Ni) and Sn compounds formed at the joint interface can also be suppressed, and as long as possible, by forming only (Cu, Ni) 6 sn 5 compound, it is possible to maintain sufficient joint strength.

[0046] According to the research of the present inventors, in the Sn-Cu-Ag-Ni alloy, when the addition amount of Ni is too much, in a high-temperature environment, (Cu, Ni) tends to form on the joint interface. 6 sn 5 and (Ni, Cu) 3 sn 4 This two story compound. When the joint strength test is carried out on this solder joint, it can be seen that in (Cu, Ni) 6 sn 5 and (Ni, Cu) 3 sn 4 Delamination occurs at the interface, which will damage the bonding strength. ...

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Abstract

Disclosed is a Pb-free solder alloy consisting of, in mass%, 0.1-1.5% of Ag, 0.5-0.75% of Cu, Ni in an amount satisfying 12.5 = Cu / Ni = 100, and the balance of Sn and unavoidable impurities. The solder alloy preferably contains, in mass%, 0.3-1.2% of Ag and 0.01-0.04% of Ni. Also disclosed is a solder ball obtained by spheroidizing the solder alloy. In addition, the solder alloy is suitable for a solder joint onto an Ni electrode. The solder alloy has excellent drop impact resistance, while being suppressed in decrease of joining strength under high temperature conditions for a long time.

Description

technical field [0001] The present invention relates to a solder alloy, a solder ball, and a solder joint used for soldering of electronic components and the like. Background technique [0002] In recent years, as the mounting area of ​​mobile office equipment such as mobile phones has decreased, semiconductor packages have also tended to be miniaturized, and the mounting method of connecting semiconductor packages on the motherboard has changed from the current peripheral terminal type using lead wires to grid-like formation. Type evolution of electrode terminals. A representative electrode terminal is BGA (Ball Grid Array), and its electrodes are connected to the mother board using solder (ie, solder balls) shaped into balls. [0003] Various external forces are applied to a semiconductor package, and a drop impact can be cited as an external force unique to mobile office equipment. Sometimes it may fall off due to carelessness when moving while using a mobile office dev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C13/00H05K3/34
CPCB23K35/0261H05K3/244H01L2924/01004H01L2924/01079H05K3/3463B23K35/3033H01L24/13H01L2924/01063B23K35/262C22C13/00H01L2924/01327B23K35/26H01L2924/01078H01L2924/01322H01L2924/00H05K3/34
Inventor 藤吉优伊达正芳
Owner HITACHI METALS LTD
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