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Thermosetting resin composition

A resin composition, thermosetting technology, applied in the direction of epoxy resin glue, adhesive type, electric solid device, etc., can solve time-consuming problems

Inactive Publication Date: 2013-09-11
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, also in the method using an adhesive described in Document 1, an adhesive printing process needs to be performed separately, which is time-consuming and requires special equipment, so there is a problem in terms of production cost.

Method used

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  • Thermosetting resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0089] 40% by mass of epoxy resin A, 10% by mass of epoxy resin B, 10% by mass of epoxy resin C, 30% by mass of monofunctional glycidyl group-containing compound, 1% by mass of epoxy resin curing agent, and 2% by mass of thixotropic agent % by mass, 5% by mass of an organic acid, 1% by mass of a surfactant, and 1% by mass of an antifoaming agent were put into a container and mixed using a beater to obtain a thermosetting resin composition.

[0090] Then, the obtained thermosetting resin composition was coated on a support with a coater (for 100 μm) to obtain a resin composition film. The obtained resin composition film had a thickness of 0.2 mm.

[0091] Next, pick up a BGA package (size: 17mm×17mm, solder ball height: 0.3mm, solder ball pitch: 0.5mm, melting point of solder: 217 °C, solder composition: 96.5Sn / 3Ag / 0.5Cu), the solder balls of the BGA package were dipped in the obtained resin composition film, and the thermosetting resin composition was attached to the solder b...

Embodiment 2~4

[0094] A thermosetting resin composition was obtained in the same manner as in Example 1 except that each material was blended according to the composition shown in Table 1. Moreover, except having used the obtained thermosetting resin composition, it carried out similarly to Example 1, and bonded a BGA package and a mounting board|substrate.

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Abstract

The invention provides a thermosetting resin composition for a joining method of a packaging part. The thermosetting resin composition contains epoxy resin, organic acid and thixotropic agent, wherein the epoxy resin contains dimeric-dibasic-acid type epoxy resin. The joining method of the packaging part comprises a film forming process, a resin-composition adhesion process, a loading process and a reflow soldering process.

Description

technical field [0001] The present invention relates to a thermosetting resin composition used in a bonding method of package components having solder balls. Background technique [0002] Along with miniaturization and thinning of electronic devices, package components having solder balls (so-called ball grid array packages: BGA packages) are used. Further, such a BGA package is also required to have a fine-pitch BGA package, but when bonding the fine-pitch BGA package to a mounting substrate, there is a problem that the strength of the bonded portion is weak when bonding only with solder balls. Therefore, the bonding portion is generally reinforced by filling and curing an underfill between the BGA package and the mounting substrate. However, since it takes time to fill and cure the underfill material, there is a problem in terms of production cost. [0003] On the other hand, a method has been proposed in which an adhesive containing flux is printed in advance on a mount...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06
CPCH01L2224/10C08L63/00H01L23/488
Inventor 中林孝氏柿田俊彦青木淳石垣幸一杉泽义信
Owner TAMURA KK
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