39results about "Other printed circuit details" patented technology

An intermediate connection layer interposed between a wiring substrate and an electronic part includes a rigid substrate and a flexible substrate. A plurality of conductor portions are formed on opposed principal surfaces of the respective flexible and rigid substrates. The rigid substrate is provided with an opening, and a fuse portion on the flexible substrate faces the opening. The flexible substrate and the rigid substrate are bonded together with solders. The respective rigid and flexible substrates are separately made, solder pastes are applied to the rigid substrate, both substrates are overlaid on each other, and the solder pastes are heated and solidified to make the intermediate connection layer.

The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.

[Problem] To provide a card capable of improving external appearance, and a card production method. [Solution] A card (1) is provided with: a module substrate (30); a lower layer (10) and an upper layer (50) arranged above and below the module substrate (30), the layers having an outline larger than the outline of the module substrate (30); and thickness adjustment layers (11, 51) for adjusting the thickness in a substrate outward region (S1), the thickness adjustment layers being provided between the lower layer (10) and the upper layer (50) and to the substrate outward region (S1) further outward than the outline of the module substrate (30), and being provided by printing to at least one layer among the layers that form the card (1).

Provided is a printed circuit board, including: a core substrate including an internal circuit pattern on an upper surface or a lower surface; electronic devices which are formed to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. Accordingly, in the embedded printed circuit board in which the electronic devices are embedded, when the electronic devices are mounted, because the insulating layer is formed regardless of a thickness of the electronic devices, the printed circuit board having a desired thickness regardless of the thickness of the electronic devices can be formed.

This invention relates to a method for producing an electrical system comprising a support (1) bearing on a first face at least one device; with the device comprising at least one electronic component (2) provided with at least one electrical connector (21, 22), with the method comprising: a step of setting in place of a cover (6) positioned above the component; said cover (6) comprising at least one passage (61, 62) according to a dimension in thickness of the cover (6) in such a way as to form an access space to the at least one electrical connector (21, 22), a step of forming a sealing seam (71) in such a way that the component is encapsulated in a sealed cavity (9) delimited by the first face of the support (1), the first face of the cover (6) and the sealing seam (7). The method comprises a step of filling with a conductive material of is at least one passage (61, 62) of the cover (6) in such a way as to establish an electrical continuity between the conductive material and the at least one electrical connector (21, 22), formant a tapping (81, 82) and in that the sealing seam (7) comprises a dielectric material.

A package substrate is provided, which includes a plurality of dielectric layers and a plurality of circuit layers alternately stacked with the dielectric layers. At least two of the circuit layers have a difference in thickness so as to prevent warpage of the substrate.

An intermediate connection layer interposed between a wiring substrate and an electronic part includes a rigid substrate and a flexible substrate. A plurality of conductor portions are formed on opposed principal surfaces of the respective flexible and rigid substrates. The rigid substrate is provided with an opening, and a fuse portion on the flexible substrate faces the opening. The flexible substrate and the rigid substrate are bonded together with solders. The respective rigid and flexible substrates are separately made, solder pastes are applied to the rigid substrate, both substrates are overlaid on each other, and the solder pastes are heated and solidified to make the intermediate connection layer.

An antenna module of the present disclosure includes a control substrate having a flat plate shape and configured to house or mount a semiconductor element; a frame substrate bonded to an upper surface of the control substrate via bonding members and exposing a center portion of the upper surface of the control substrate; and an antenna substrate having a flat plate shape, bonded to an upper surface of the frame substrate via the bonding members so as to face the control substrate, and provided with a plurality of antenna patterns disposed along a main surface of the antenna substrate. The frame substrate includes a frame main body and a crosspiece. Between the frame main body / the crosspiece and the control substrate as well as the antenna substrate, projecting portions that come into contact with the opposing control substrate, frame substrate, and antenna substrate are provided at a fixed height.

The invention discloses a circuit board. The circuit board comprises a first circuit board body and a second circuit board body. The portion between the first circuit board body and the second circuit board body is coated with a bonding layer, a positioning device is positioned and installed on the first circuit board body and the second circuit board body, and the first circuit board body is in contact with the second circuit board body to form a cut-off circuit with the positioning device. The positioning device comprises an external energizing terminal, an internal energizing terminal, connecting rods, positioning blocks, a communication wire, a current indicating gauge and a power source; the external energizing terminal and the internal energizing terminal are fixedly connected with the connecting rods and the positioning blocks to form two sections to be matched with a positioning module; the positioning blocks are connected with the current indicating gauge and the power source through the communication wire to form a circuit. According to the circuit board, the space position of the circuit board is accurately positioned through the positioning device, later positioning, welding and forming are easy, and therefore the production process and the cost are reduced.

A package substrate is provided, which includes a plurality of dielectric layers and a plurality of circuit layers alternately stacked with the dielectric layers. At least two of the circuit layers have a difference in thickness so as to prevent warpage of the substrate.

A liquid discharge head includes an element substrate to which an electric signal is supplied, an electrical wiring board that is connected to the element substrate and that is capable of supplying the electric signal to the element substrate, and a printed circuit board that includes a wiring line and an insulating layer covering the wiring line and that is capable of supplying the electric signal to the element substrate via the wiring line. A protruding structure that has a thickness approximately equal to a thickness of the wiring line and that is covered with the insulating layer is disposed along the wiring line on the printed circuit board, and a portion of the electrical wiring board is bonded to a portion of the insulating layer located on the wiring line disposed on the printed circuit board.

A vibration-proof material is obtained by foaming a rubber composition containing an ethylene-propylene-diene rubber. The content ratio of a sulfur atom calculated based on the measurement result of a fluorescent X-ray measurement, based on mass, is 1000 ppm or less and the vibration-proof material has a Young's modulus at 23° C. of 6.0×105 Pa or less.

The invention discloses a circuit board and a manufacturing method thereof. The circuit board comprises a first signal transmission layer and a second signal transmission layer. The circuit board also comprises a plurality of first signal transmission units arranged on the first signal transmission layer; a plurality of second signal transmission units arranged on the second signal transmission layer and corresponding to the plurality of first signal transmission units; and edge connection units corresponding to the first signal transmission units, wherein corresponding first signal transmission units and second signal transmission units form electric connection through corresponding connection units; the connection units are divided into at least two rows to form at least two connection layers; in directions parallel with the connection layers, adjacent connection layers form an offset; in the directions perpendicular to the connection layers in the first signal transmission layer, adjacent connection layers are overlapped partially. According to the invention, the signal transmission quality of the circuit board is improved.

The invention discloses an internal layer monitoring structure of a multilayer printed circuit board. The lengthways laminated structure of a working sheet of the multilayer printed circuit board comprises an external layer and multiple internal layers; the plane layout of the working sheet of the multilayer printed circuit board is that multiple circuit board single sheets are arranged; a plurality of sheet-cutting holes are formed in the edge of the working sheet; the sheet-cutting holes are through holes which run through the internal layers and the external layer; the inner surface of each sheet-cutting hole is covered with a copper sheet; the external layer of the working sheet, which is located at the periphery of the sheet-cutting holes, is provided with an external copper ring; the external copper ring is connected with the copper sheet located in each sheet-cutting hole; each internal layer of the working sheet, which is located at the periphery of the sheet-cutting holes, is provided with an internal copper ring; each internal copper ring is connected with the copper sheet in each sheet-cutting hole; the width of each internal copper ring is the maximum acceptable value of the deviation of the internal layers. When internal layer monitoring is needed, the sheet-cutting holes are taken off and cut off by using a sheet punching machine; besides the conventional internal lay data monitoring, whether the internal layers are in poor alignment can be judged through observing whether the sheet-cutting holes are located in the internal copper rings.

A printed circuit board and a display device are provided. The printed circuit board includes a plurality of insulation layers; at least one metal layer between the plurality of insulation layers; and a fixing member fixed to a surface of one of the at least one metal layer and passing through an outermost one of insulation layers to protrude to the outside.

This room-temperature-curable polyorganosiloxane composition contains, for every 100 parts by mass of a polyorganosiloxane (A) comprising (A1) 10-80 parts by mass of an alkoxysilyl group end-blocked polyorganosiloxane and (A2) 90-20 parts by mass of a partial hydrolysis condensate (having 10-200 Si atoms) of a silane compound represented by the general formula R4 bSi(OR5)4-b, (B) 0.1-15 parts by mass of a silane compound or partial hydrolysis condensate thereof (having at least 1 and less than 10 Si atoms) as a cross-linking agent, and (C) 0.1-15 parts by mass of an organic titanium compound as a curing catalyst. The present invention forms a cured coating film having low viscosity, favorable coating properties without a solvent, and superior scratch resistance.

The invention provides a fixing device for assisting butt joint of PCBs. The fixing device comprises a first transverse frame, a first vertical frame, a second transverse frame and a second vertical frame which are sequentially connected in a head-tail mode to form a sealed frame and are mutually detachable. One side, facing the inner part of the sealed frame, of the first transverse frame is provided with a first fixing part for fixing a PCB; one side, facing the inner part of the sealed frame, of the second transverse frame is provided with a second fixing part for fixing the other PCB; one side, facing the inner part of the sealed frame, of the first vertical frame is provided with at least one first sliding groove for supporting side edges of the PCBs; and one side, facing the inner part of the sealed frame, of the second vertical frame is provided with second sliding grooves with the same number as the first sliding grooves and positions of the first sliding grooves and the second sliding grooves are mutual corresponding. The frames in head-tail connection are adopted for fixing the PCBs, the size of the frame is controlled to enable two or more PCBs to be in accurate butt joint, each spare part is fixed by adopting a bolt, the device is simple to assemble, the structure is firm, and the application range is wide.

A method is provided for manufacturing an electrical connection assembly includes preparing a connector (CN) in which each terminal (20) has a conductor connection surface (27a) exposed from an insulating housing (30), bringing parts of conductors and the conductor connection surfaces (27a) corresponding thereto into contact and connecting both while tension is applied to a wiring material (10). The method further includes fixing the wiring material (10) to the insulating housing (30) by bringing the wiring material (10) and the insulating housing (30) into contact with each other at the fixing positions separated in the longitudinal direction of the wiring material (10) from the parts to be connected and solidifying the fixing portions (34) of the insulating housing (30) after melting the fixing portions at the fixing positions.

To provide a card capable of improving external appearance, and a card production method. A card (1) is provided with: a module substrate (30); a lower layer (10) and an upper layer (50) arranged above and below the module substrate (30), the layers having an outline larger than the outline of the module substrate (30); and thickness adjustment layers (11, 51) for adjusting the thickness in a substrate outward region (S1), the thickness adjustment layers being provided between the lower layer (10) and the upper layer (50) and to the substrate outward region (S1) further outward than the outline of the module substrate (30), and being provided by printing to at least one layer among the layers that form the card (1).

In an electro-optical device, a flexible first wiring substrate and a flexible second wiring substrate, which are respectively coupled to a first terminal region and a second terminal region, extend while overlapping with each other, and a first mold material is provided between the first wiring substrate and the second wiring substrate. The second wiring substrate includes a base film having transmissivity, a wiring line provided at the base film, and a protective layer that covers the wiring line and is less transmissive than the base film. In the second wiring substrate, a light-transmission window in which the wiring line and the protective layer are not present in part is provided in a region thereof overlapping with the first mold material.