Circuit board and manufacturing method thereof

Abstract

The invention discloses a circuit board and a manufacturing method thereof. The circuit board comprises a first signal transmission layer and a second signal transmission layer. The circuit board also comprises a plurality of first signal transmission units arranged on the first signal transmission layer; a plurality of second signal transmission units arranged on the second signal transmission layer and corresponding to the plurality of first signal transmission units; and edge connection units corresponding to the first signal transmission units, wherein corresponding first signal transmission units and second signal transmission units form electric connection through corresponding connection units; the connection units are divided into at least two rows to form at least two connection layers; in directions parallel with the connection layers, adjacent connection layers form an offset; in the directions perpendicular to the connection layers in the first signal transmission layer, adjacent connection layers are overlapped partially. According to the invention, the signal transmission quality of the circuit board is improved.

Description

technical field [0001] The present disclosure relates to the field of circuit board design, in particular to a circuit board and a manufacturing method thereof. Background technique [0002] The demand for products in the display field in the contemporary market is further developing towards large size, high speed and ultra-high definition. This will inevitably require higher density, higher speed printed circuit boards. [0003] The transmission quality of the signal on the printed circuit board directly affects the performance of the printed circuit board product. In high-speed printed circuit boards, many signals need to be transmitted in multiple signal transmission layers. When signals need to be transmitted in multiple signal transmission layers, vias need to be provided between different signal transmission layers, and signal transmission units located in different signal transmission layers are connected through the vias to continuously transmit signals. [0004] ...

AI Technical Summary

Problems solved by technology

[0004] In low-frequency circuits, vias have no effect on signal transmission, but in radio-frequency circuits, high-speed circuits, and power circuits, vias will have many adverse effects

First of all, the current technology still cannot accurately control the impedance of the via hole. The via hole will form a discontinuous breakpoint on the trace, causing signal reflection. In addition, the via hole with the same length has greater loss than the microstrip line. Holes have an inevitable impact on high-frequency signals; secondly, the parasitic capacitance generated by vias will affect the rise time of signals, reduce the speed of the circuit, and greatly reduce the signal quality in high-speed circuits; finally, the parasitic inductance will offset the bypass The role of the circuit capacitor, weakening the effect of the power filter circuit

Images