Room-temperature-curable polyorganosiloxane composition and electric/electronic apparatus

A polyorganosiloxane, room temperature curing technology, applied in the field of electrical and electronic devices, can solve the problems of insufficient scratch resistance, scratch strength, deterioration of operating environment, corrosion of circuit substrates, etc., and achieves good coatability and scratch resistance. Excellent traceability

Inactive Publication Date: 2015-04-01
MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, for a coating material composed of a low-viscosity room-temperature-curable polyorganosiloxane composition, the obtained cured product (film) is brittle and has low hardness, and scratch strength such as scratch resistance is insufficient.
[0005] In addition, in solvent-type coating materials containing silicone resin, the solvent needs to be removed by heating during curing, and the volatilization of the solvent may cause deterioration of the operating environment or corrosion or deterioration of electrical and electronic parts and circuit boards on which they are mounted. Concern
In addition, in order to improve the operating environment, if it is desired to recover the solvent without releasing it into the atmosphere, a high investment is required

Method used

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  • Room-temperature-curable polyorganosiloxane composition and electric/electronic apparatus
  • Room-temperature-curable polyorganosiloxane composition and electric/electronic apparatus
  • Room-temperature-curable polyorganosiloxane composition and electric/electronic apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] In 50 parts of (A1-1) polydimethylsiloxane (viscosity of 0.013Pa·s, number of Si in the molecule is 10) with both ends of the molecular chain blocked with methyldimethoxysilyl groups , respectively blending 50 parts of (A2-1) with the formula: (CH 3 )Si(OCH 3 ) 3 The partial hydrolysis condensate of the silane compound indicated (Si number is 120), 5 parts of (B-1) methyltrimethoxysilane, 2 parts of (C-1) diisopropoxybis (ethyl acetoacetate) ) titanium and 0.2 parts of (E) 1,3,5-tris(N-trimethoxysilylpropyl) isocyanurate, uniformly mixed under moisture-proof conditions to obtain polyorganosiloxane combination.

Embodiment 2

[0088] In 40 parts of (A1-1) polydimethylsiloxane (viscosity of 0.013Pa·s, number of Si in the molecule is 10) with both ends of the molecular chain blocked with methyldimethoxysilyl groups , respectively blending 60 parts of (A2-2) with the formula: (CH 3 )Si(OCH 3 ) 3 The partial hydrolysis condensate of the silane compound represented (Si number is 70), 30 parts of (D-1) polydimethylsiloxane (viscosity 0.09Pa·s, the number of Si in the molecule is 80), 6 parts of (B-1) methyltrimethoxysilane, 2 parts of (C-1) diisopropoxybis (ethyl acetoacetate) Titanium and 0.2 parts of (E) 1,3,5-tris(N-trimethoxysilylpropyl)isocyanurate were mixed in the same manner as in Example 1 to obtain a polyorganosiloxane composition.

Embodiment 3

[0090] In 60 parts of (A1-1) polydimethylsiloxane (viscosity of 0.013Pa·s, number of Si in the molecule is 10) with both ends of the molecular chain blocked with methyldimethoxysilyl groups , respectively blending 40 parts of (A2-3) with the formula: (CH 3 )Si(OCH 3 ) 3 The partial hydrolysis condensate of the silane compound represented (Si number is 30), 30 parts of (D-1) polydimethylsiloxane (viscosity 0.09Pa·s, the number of Si in the molecule is 80), 5 parts of (B-1) methyltrimethoxysilane and 2 parts of (C-1) diisopropoxy bis (ethyl acetoacetate) Titanium was mixed in the same manner as in Example 1 to obtain a polyorganosiloxane composition.

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Abstract

This room-temperature-curable polyorganosiloxane composition contains, for every 100 parts by mass of a polyorganosiloxane (A) comprising (A1) 10-80 parts by mass of an alkoxysilyl group end-blocked polyorganosiloxane and (A2) 90-20 parts by mass of a partial hydrolysis condensate (having 10-200 Si atoms) of a silane compound represented by the general formula R4 bSi(OR5)4-b, (B) 0.1-15 parts by mass of a silane compound or partial hydrolysis condensate thereof (having at least 1 and less than 10 Si atoms) as a cross-linking agent, and (C) 0.1-15 parts by mass of an organic titanium compound as a curing catalyst. The present invention forms a cured coating film having low viscosity, favorable coating properties without a solvent, and superior scratch resistance.

Description

technical field [0001] The present invention relates to a room temperature curable polyorganosiloxane composition and electric and electronic devices, and in particular to a room temperature curable polyorganosiloxane which forms a cured film excellent in scratch resistance and is useful as a coating material for electric and electronic devices, etc. An oxane composition and an electric / electronic device having a cured film of the room temperature curable polyorganosiloxane composition. Background technique [0002] Conventionally, various room temperature curable polyorganosiloxane compositions are known which cure at room temperature to produce a cured product such as a rubbery state. Among them, in the type that undergoes a curing reaction by contact with moisture in the air, materials such as alcohols or ketones that are less corrosive to metals are released during curing, and in addition to good workability, there is a possibility of corroding electrodes or wiring. Sin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08K5/5415C08K5/56C09D7/12C09D183/04C09D7/63
CPCC09D183/04C08L83/04C09D183/14C08L83/14C08K5/0091C08K5/5419C09D7/63Y10T428/31663C08L83/00C09D7/40C08L2203/202C09D183/06H05K1/181H05K2201/10015H05K2201/20
Inventor 饭田勋森田康仁
Owner MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
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