88results about "Circuit arrangements with support structures" patented technology

An electronic device assembly structure comprises two electronic devices and a fastening unit. Each electronic device includes a body and an electric connection module. The body has at least one opening formed thereon. The electric connection module is located in the body. The fastening unit fastens the two electronic devices together in an integrated manner. The electric connection modules of the two electronic devices form electric connection through the opening.

An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.

A stackable electronic device with latching bumper includes a housing, an electrical connector, a latching mechanism having a linking module, a latching module and a button. The housing has a bottom board, a side board formed with a button hole, and a bumper disposed on the bottom board formed with a latching hole. The linking module is disposed on an inner side of the side board, and has a first end extended into the button hole and a second end extended into the bumper. The latching module is movably disposed in the bumper between a locking position and an unlocking position. The second end is connected to the latching module. The button can be pressed for driving the first end to move the second end corresponding to the locking position and the unlocking position. The present disclosure also provides a stackable electronic device system.

The invention discloses a convenient-to-disassemble and assemble cooling power supply box, which comprises a power supply box profile, wherein a screw groove is formed in the bottom of the inner side of the power supply box profile; a power adapter plate is fixedly arranged in the power supply box profile by the power supply box profile through the screw groove and a waist-shaped hole formed in the power adapter plate; the top of the power adapter plate is fixedly connected with the bottom of a power supply; and a sliding block is arranged at the outer side of the power supply box profile and is in sliding connection with a slide chute in the inner side of a power cover plate. The power adapter plate and the power supply are fixedly arranged at the inner side of the power supply box profile through the formed screw groove and waist-shaped hole, the power cover plate is movably arranged at the top of the power supply box profile through the arranged sliding block and the formed slide chute, the heat dissipation effect of the power supply box is better through arranged connection plate, heat-conducting plate and trapezoidal block, and the power supply box is sealed through arranged lower end cover and upper end cover, so that the effect of preventing the power supply box from being burnt out by an over-high temperature in the power supply box is achieved.

A touch module with photovoltaic conversion function includes a touch zone and a non-touch zone. The touch zone includes a first clear substrate, a second clear substrate and a photovoltaic conversion unit. The first clear substrate has opposite first and second sides, and the second clear substrate has opposite third and fourth sides. A first and a second touch electrode layer are provided on the second side and the third side, respectively; and the photovoltaic conversion unit is provided on the first side of the first clear substrate. By providing the photovoltaic conversion unit in the touch zone of the touch module, the photovoltaic conversion unit can have increased light-absorption areas to enable conversion of light into more electric current and accordingly, enable a touch device using the touch module to have extended standby and operation time.

The invention relates to a three-dimensional micro-assembly low-frequency dual-band driving power amplifier. The power amplifier comprises a shell, an upper cover plate and a lower cover plate; the upper cover plate and the lower cover plate are respectively arranged at the upper and lower ends of the shell; a low-frequency connector, two radio frequency connectors and two radio frequency glass beads are arranged on the outer surface of the shell, wherein a push power amplifier, an LTCC plate and two power amplifier slides working in different wave bands are arranged in the shell, a control and power supply bare chip is mounted on the LTCC plate through a micro-assembly process, the LTCC plate is connected with the push power amplifier through a low-frequency glass bead, and components arearranged on the push power amplifier; the low-frequency connector receives an external power supply signal and a control signal and transmits the signals to the control and power supply bare chip, and the control and power supply bare chip selects a transmission path of a radio frequency signal according to the control signal. By using the three-dimensional micro-assembly technology, the active phased array radar dual-band antenna has the characteristics of small size, high reliability and the like, can work in low-frequency dual bands, and meets the dual-band working requirements of the active phased array radar.

The invention discloses a single-tube IGBT parallel motor control system and belongs to the IGBT field. The single-tube IGBT parallel motor control system module comprises an IGBT assembly, a controland drive integrated circuit board, a laminated busbar, a capacitor, a three-phase copper bar injection molding part, and a radiator for an IGBT; the structures and the corresponding connection relations of each phase of the IGBT assembly are identical respectively; the A phase is formed by a first A-phase upper bridge arm IGBT-, a second A-phase upper bridge arm IGBT-, a first A-phase lower bridge arm IGBT- and a second A-phase lower bridge arm IGBT-, wherein the first A-phase upper bridge arm IGBT- and the second A-phase upper bridge arm IGBT- are connected in parallel, and the first A-phaselower bridge arm IGBT- and the second A-phase lower bridge arm IGBT- are connected in parallel; the IGBT assembly is connected with the laminated busbar and an output copper bar- of the capacitor; a750V / 340A multi-tube IGBT parallel connection technology is adopted; meanwhile, direct connection and interconnection welding processes in different modes are adopted; compared with a single-tube scheme on the market, the system of the invention has better reliability and consistency. The system has the technical advantages of compact structure, high integration level, light weight, flexible platform expansion and the like; and meanwhile, traditional bolt connection and wiring harness connection are omitted in design, so that assembling is easier and more convenient. The system is suitable forautomatic batch manufacturing, and provides a technological basis for assembling with a higher automation degree.