An embedded
capacitor method and
system is provided for printed circuit boards. The
capacitor structure is embedded within an insulator substrate, minimizes real-estate usage, provides a
high capacitance, enhances
capacitance density, and yet forms an advantageous planar surface
topography. A cavity is defined within and contained by an insulator substrate layer, and a
dielectric material at least partially fills the cavity. The
dielectric material is connected to an
electrical conductor, and vias are used for interconnections and traces. In an aspect, a plurality of stacked insulator substrate
layers define a plurality of cavities filled with the
dielectric material, providing even greater
capacitance. In another aspect, an array of cavities is formed in the insulator substrate layer. The embedded
capacitor can be employed within numerous systems that utilize capacitors including
automotive electronics such as a
pressure sensor, an engine control module, a transmission controller, and radio systems including
satellite radio devices.