47 results about "Interconnect topology" patented technology

A memory system architecture/interconnect topology includes a configurable width buffered memory module having a configurable width buffer device with at least one switch element. A buffer device, such as a configurable width buffer device, is positioned between or with at least one integrated circuit memory device positioned on a substrate surface of a memory module, such as a DIMM. A switch element is positioned on or off a memory module and includes two transistors in embodiments of the invention. One or more switch elements are coupled to one or more channels to allow for upgrades of memory modules in a memory system. An asymmetrical switch topology allows for increasing the number of memory modules to more than two memory modules without adding switch elements serially on each channel. Switch elements allow for increasing the number of ranks of memory modules in a system, while also achieving many of the benefits associated with point-to-point topology.

A memory system architecture/interconnect topology that includes at least one point-to-point link between a master, and at least one memory subsystem. The memory subsystem includes a buffer device coupled to a plurality of memory devices. The memory system may be upgraded through dedicated point-to-point links and corresponding memory subsystems. The master communicates to the plurality of memory devices in each memory subsystem through the respective buffer device via each point-to-point link

A memory system architecture/interconnect topology that includes at least one point-to-point link between a master, and at least one memory subsystem. The memory subsystem includes a buffer device coupled to a plurality of memory devices. The memory system may be upgraded through dedicated point-to-point links and corresponding memory subsystems. The master communicates to the plurality of memory devices in each memory subsystem through the respective buffer device via each point-to-point link

The invention provides an ultra-scalable supercomputer based on MPU architecture in achieving the well-balanced performance of hundreds of TFLOPS or PFLOPS range in applications. The supercomputer system design includes the interconnect topology and its corresponding routing strategies, the communication subsystem design and implementation, the software and hardware schematic implementations. The supercomputer comprises a plurality of processing nodes powering the parallel processing and Axon nodes connecting computing nodes while implementing the external interconnections. The interconnect topology can be based on MPU architecture and the communication routing logic as required by switching logics is implemented in the FPGA chips while some modular designs for accelerating particular traffic patterns from applications and meliorating the communication overhead are able to be deployed as well.

An interconnect topology that includes vertical trench routing in a substrate is disclosed. In one embodiment, the interconnect comprises a substrate having a plurality of layers including a first ground plane layer; a pair of signal conductors that form a differential signal pair, each conductor of the pair of signal conductors having a first portion and a second portion, the second portion extending from the first portion into at least one of the plurality of layers, wherein width of the second portion is less than width of the first portion; and wherein the first ground plane layer is only a first partial layer and has a first void region that is closer to the pair of signal conductors than the first partial layer.

The invention is directed towards method and apparatus that consider diagonal wiring in placement. Some embodiments of the invention are placers that use diagonal lines in calculating the costs of potential placement configurations. For instance, some embodiments estimate the wirelength cost of a placement configuration by (1) identifying, for each net in a net list, a bounding box that encloses all the circuit elements of the net, (2) computing an attribute of each bounding box by using a line that can be completely or partially diagonal, and (3) computing the wirelength cost estimate based on the computed attributes. To estimate the wirelength cost of different placement configurations, other embodiments construct connection graphs that model the net interconnect topologies. These connection graphs can have edges that are completely or partially diagonal. Other embodiments use diagonal lines to measure congestion costs of potential placement configurations. For instance, some placers use diagonal lines as cut lines that divide the IC layout into regions. These placers then generate congestion-cost estimates by measuring the number of nets cut by the diagonal cut lines.

The invention relates to a power-generating interconnected topological structure of a transformerless water-turbine generator, which comprises a water-turbine generator set, a high-voltage rectifying topology, a direct-current bus and an inverting topology, wherein the high-voltage rectifying topology comprises a plurality of high-voltage rectifying modules, the inverting topology comprises a plurality of inverting modules, the high-voltage alternating current with any frequency generated by each water-turbine generator is rectified by the high-voltage rectifying topology to obtain a direct-current high voltage, the generated direct-current high voltages are connected together and collected onto the direct-current bus, the voltage on the direct-current bus is used as the direct-current side voltage of the inverting topology, and the direct-current side voltage is inverted into an alternating-current voltage by the inverting topology to generate a high voltage to be connected to a power grid. The invention has the advantages that: no transformer exists at an input end, thereby the equipment investment is saved, and the waterpower generation efficiency is greatly improved. The transformer does not exist at the input end, so that the volume of a waterpower-generating interconnected topology is reduced, the occupied land is reduced, the weight is lightened, and the cost is lowered; and meanwhile, the energy consumption can be lowered, so that the manufacturing process is simplified, and the production period is reduced.

A data communications apparatus includes a central device and a plurality of communication devices. The central device includes a plurality of central port pairs, in which each central port pair includes an input port and an output port. The plurality of communication devices is arranged in a spoke and ring configuration, in which each communication device is part of a communication spoke. Each communication spoke is in communication with a different central port pair. Each communication device is also a part of a communication ring, so that each communication device in a selected communication ring belongs to a different communication spoke.

A system for automatically discovering fabric topology includes at least one or more processing units, one or more memory devices, a security processor, and a communication fabric with an unknown topology coupled to the processing unit(s), memory device(s), and security processor. The security processor queries each component of the fabric to retrieve various attributes associated with the component. The security processor utilizes the retrieved attributes to create a network graph of the topology of the components within the fabric. The security processor generates routing tables from the network graph and programs the routing tables into the fabric components. Then, the fabric components utilize the routing tables to determine how to route incoming packets.

An interconnect topology is disclosed that includes a plurality of interconnections, each of which is coupled together using a via, where at least two of the vias are staggered with respect to each other. In one embodiment, the interconnect topology comprises a substrate, multiple signal traces routed through the substrate on multiple layers, and a plurality of vias, where each via couples a pair of the signal traces to form an interconnection between different ones of the multiple layers, and where a pair of vias comprise a first via to carry a positive differential signal via and a second via to carry a negative differential signal that are coupled to signal traces to form a differential signal pair. The differential first and second vias are staggered with respect to each other.