The invention provides a Cu-Sn-Zn plating solution containing organic addition agent and an electroplating technique utilizing same; the plating solution has the parameters and the content of all components: 4-15g / L of Cu<2+>, 6-42g / L of Sn<4+>, 0.15-1g / L of Zn<2+>, 6-35g / L of KOH or NaOH, 20-60g / L of free NaCN or KCN, 0.05-2.5g / L of surface active agent, 1-30g / L of organic complexing agent and 0.5-35g / L of organic depolarizing agent; the pH value is more than 12, and the temperature is 30-65 DEG C. The practicability examination is carried out on the plating solution and the technical finished product, and the examination proves that plating layer under the technique of the addition agent has bright white color and achieves the effect of replacing nickel; the discoloration preventing capability is better, experimental effect of neutral salt spray resistance is good, and the solderability is excellent; furthermore, the plating layer contains no harmful substances such as heavy metal, cyanide, etc.