The invention discloses a sapphire wafer cutting equipment and process, comprising a first support plate, a second support plate, a bottom plate, a U-shaped support plate, a side slide plate, a strip groove, a long cylinder, a first cylinder, a strip cutter, Second cylinder, L-shaped plate, ring frame, bearing, ring gear, short cylinder, screw, servo motor, drive gear, balls, first suction cup, third cylinder, threaded long rod, second suction cup, threaded deep hole and Circular plate. The present invention is convenient to fix the two ends of the sapphire ingot to be cut through two corresponding suction cups and the connecting structure, and at the same time, it can be cut step by step under the push of the third cylinder and the assistance of the ball on the push rod of the first cylinder. The effect of material supply at the structure, by starting the second cylinder to push the connected strip cutter to cut the same part of the sapphire ingot in stages, can avoid the situation of knife jamming, ensure the same cutting amount each time, and avoid cutting out The problem of falling sapphire wafers can be solved, and the yield rate can be improved.