The invention relates to an
epoxy resin composition containing (a) an
epoxy resin and (b) a phenolic
hydroxy group-containing
polyamide resin having the structure represented by Formula (1), a method of curing the composition, a
varnish, prepreg, or sheet using the composition, and an
epoxy resin composition having the
polyamide resin represented by Formula (1) as the
active component. Cured products of the epoxy resin composition according to the present invention have a sufficient high flexibility when formed into a thin film, have a
flame resistance even though the cured compositions do not contain a
halogen flame retardant, an
antimony compound, or the like and are superior in
heat resistance and adhesiveness, and thus are extremely useful in a wide range of applications, for example, as molded materials, cast materials, laminate materials, paints, adhesives, resists, and the like. (wherein, 1 and m are averages, satisfying the formula: m / (1+m) =0.01; and 1+m is a positive number of 2 to 200. Ar1 represents a bivalent aromatic group; Ar2 represents a phenolic hydroxyl group-containing bivalent aromatic group; and Ar3 represents: -ph(R1)n- or -ph(R2)n-X-ph(R3)n-, wherein, -ph(R1)n-, -ph(R2)n- and -ph(R3)n- represent respectively R1-substituted, R2-substituted and R3-substituted
phenylene groups, or an unsubstituted
phenylene group; n is an integer of 0 to 3; R1, R2 and R3 each independently represent a C1 to C3
alkyl group or a C1 to C3
alkoxy group; and X represents O, S, CO, SO2 or a
single bond)