The invention can include a thin-film forming device that is a device for forming a thin-film by applying a
coating solution onto a substrate, the
coating solution containing a
solvent and a film-forming material dissolved or dispersed therein. Also an ejection mechanism having a droplet ejection head for ejecting the
coating solution onto the substrate, a moving mechanism capable of relatively moving the positions of the droplet ejection head and the substrate, and a
control unit for controlling at least one of the ejection mechanism and the moving mechanism can be provided for the thin-film forming device. In addition, a
solvent vapor supply mechanism for supplying the
solvent vapor to the vicinity of the coating solution applied onto the substrate can also be provided for the thin-film forming device. Thereby, material losses are reduced by using a droplet ejection head, the thickness of the entire film can be made uniform, in addition, the patent provides also provides e a thin-film forming device and a thin-film forming method, a
liquid crystal display and a device and method for manufacturing the same, and a thin-
film structure and a device and method for manufacturing the same, in which material losses are reduced by using a droplet ejection head, and in addition, the thickness of the entire film can be made uniform.