129results about How to "Shorten the connection distance" patented technology

A socket detachably connects a connecting item to a substrate via connecting terminals. The socket includes a support member with first and second surfaces to fix the connecting terminals, and penetrating holes formed in the support member. Each connecting terminal includes first and second connecting parts formed on opposite ends thereof. Each connecting terminal is inserted into a corresponding penetrating hole in a state in which the first connecting part is fixed to the first surface and the second connecting part projects from the second surface of the support member.

A first memory chip (103a) and a second memory chip (103b) mounted in this order on one surface of a mounting board (101) each have a rectangular planar shape and include a plurality of electrode pads formed in a single line along one side of the rectangle. An electrode pad line of the second memory chip (103b) is formed in parallel with an electrode pad line of the first memory chip (103a). A chip select pad is disposed on an end of the electrode pad line. Control pads, address pads, or data pads (113a) of the first memory chip (103a) are wire bonded to first stitches (109) formed in a single line along one side of the rectangle. A chip select pad (121a) and a chip select pad (121b) are wire bonded to second stitches (111) formed in a line along a side adjacent to a side of the chip select pad (121a). Accordingly, an increase in package area is suppressed when a plurality of memory chips are stacked.

The invention provides a heat dissipation device which is suitable for carrying out heat dissipation on a plurality of heating elements in a middle and high voltage inverter. The heat dissipation device comprises a heat dissipation substrate, at least a set of heat pipes and a plurality of cooling fins, wherein at least one surface of a first surface and a second surface of the heat dissipation substrate is provided with the heating elements, and the set of heat pipes comprise a plurality of heat pipes. Each heat pipe comprises an evaporation segment and a condensation segment, and the evaporation segment is buried in an inner layer of the heat dissipation substrate to absorb heat from the heating elements. The plurality of cooling fins are arranged to be intersected with the heat pipes and fixedly connected with the condensation segments of the heat pipes, and therefore heat released by the condensation segments is transferred to the air. Moreover, contact portions between the set of heat pipes and the plurality of cooling fins are arranged in a triangle and intercrossing mode. A plurality of power devices in the inverter are placed on at least one surface of the heat dissipation substrate, and a plurality of sets of heat pipes are buried in the inner layer of the heat dissipation substrate. Moreover, the contact portions between the set of heat pipes and the plurality of cooling fins are arranged in a triangle and intercrossing mode so that heat dissipation efficiency of each power device can be effectively improved.

A socket detachably connects a connecting item to a substrate via connecting terminals. The socket includes a support member with first and second surfaces to fix the connecting terminals, and penetrating holes formed in the support member. Each connecting terminal includes first and second connecting parts formed on opposite ends thereof. Each connecting terminal is inserted into a corresponding penetrating hole in a state in which the first connecting part is fixed to the first surface and the second connecting part projects from the second surface of the support member.

Embodiments of the invention provide a head / slider supporting structure which has connection properties excellent in solder ball connections of a slider pad and a lead pad. According to one embodiment, in a head / slider supporting structure for connecting a slider and a lead wire by re-flowing a solder ball, a connection distance between a slider pad and an extreme end portion of the lead wire is reduced to enhance the performance of solder connection. The lead wire is inclined forwardly of the slider pad.