The invention discloses a multilayer film primary formed plate plating method. The multilayer film primary formed plate plating method comprises the following steps that a
raw material is subjected topretreatment, specifically, the
raw material is
cut according to the required dimension and specification through a template; the
raw material is
cut into wood plates which are the same in proportion, then, the surface of the raw material is subjected to
polishing treatment and
impurity removal till the surface is smooth and clean, and the preprocessed wood plates are obtained; then,
drying treatment is conducted, the cleaned wood plates are put into a
vacuum drying machine to be dried, the
water content of the dried plates is 30-35%, the plates are loaded into a
drying kiln, steam is injected, the temperature of the interior of the
kiln keeps to be 50 DEG C, the
humidity keeps to be 42%, steam is injected every 2-3 hours, and the process lasts for 2-3 days till the
water content of the dried plates is 10-125. According to the multilayer film primary formed plate plating method, during plating, a layer of environment-friendly paper is laid on the plate, then, plating is conducted, thus, the effect after plating is better, and the third dimension is higher.