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49results about How to "Improved physical contact" patented technology

Integrally Molded Die And Bezel Structure For Fingerprint Sensors And The Like

A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.
Owner:APPLE INC

Buffer layer for sulfide solid-state battery, preparation method of buffer layer, and solid-state battery

The invention provides a buffer layer for a sulfide solid-state battery. The buffer layer comprises a polymer material and ethylene carbonate, and is formed in situ on an electrode plate through a buffer layer solution; and due to the existence of a polymer, poor physical contact between an electrode and an electrolyte caused by volume deformation of a positive electrode material in a charging/discharging process can be improved. The buffer layer is existent between the positive electrode and the solid electrolyte of the solid-state battery and between the negative electrode and the solid-state electrolyte, so that the solid-solid interface impedance can be reduced; and meanwhile, good ionic conductivity of the buffer layer can improve the lithium ion transmission capacity. The sulfide composite positive electrode in the solid-state battery provided by the invention contains the polymer material, and the existence of the polymer can improve the poor physical contact between the electrode and the electrolyte caused by the volume deformation of the positive electrode material in the charging/discharging process; and meanwhile, the solid-state battery contains the buffer layer, so that the solid-state battery has low interface resistance and high ionic conductivity, and is excellent in capacity and cycling performance.
Owner:SHANGHAI INST OF SPACE POWER SOURCES

Decoloring treatment method of printing and dyeing wastewater

The invention discloses a decoloring treatment method of printing and dyeing wastewater. The decoloring treatment method of the printing and dyeing wastewater is characterized by comprising the following steps: placing the printing and dyeing wastewater into a container or a treatment pond; performing suspended substance filtering treatment on the printing and dyeing wastewater; adding 3 to 6 square meters of nano-titanium dioxide immobilized catalytic pieces into each cubic meter of printing and dyeing wastewater which is subjected to filtering treatment; adding hydrogen peroxide, wherein the volume of the hydrogen peroxide is 0.001 to 0.01 percent of that of the printing and dyeing wastewater which is subjected to filtering treatment; stirring completely; irradiating by using a mercury lamp. The nano-titanium dioxide immobilized catalytic pieces are prepared by fixing titanium dioxide on the surface of ceramic by a physical burning and solidifying manner, have a good physical contact effect, are difficult to separate and achieve a long-term effective catalytic effect; the spectral range of the mercury lamp is wide and close to a natural spectrum, so the safety is higher; the nano-titanium dioxide immobilized catalytic pieces and organic matters in the printing and dyeing wastewater generate chemical reaction, so the color organic matters in the printing and dyeing wastewater can be effectively decolored and the treated water is free from secondary pollution.
Owner:乐山市洁宇纳米应用技术研究所

Server, mainboard and CPU mounting and fixing reinforcing module

The invention discloses a CPU mounting and fixing reinforcing module. The module comprises a PCB, a CPU slot, a CPU mounted in the CPU slot, a mounting lining plate arranged on the surface of the PCBand distributed around the CPU slot, a mounting back plate arranged on the back surface of the PCB, and a heat radiator shell mounted on the surface of the mounting lining plate and tightly pressed onthe surface of a CPU, an elastic plate capable of deforming in the vertical direction is arranged on the surface of the installation lining plate, the two ends of the elastic plate are connected withthe installation lining plate through first connecting pieces, and the installation lining plate and the installation back plate are tensioned through the first connecting pieces. A second connectingpiece is arranged on the elastic plate, and a pre-tightening adjusting piece used for being matching the second connecting piece and enabling the elastic plate to generate elastic deformation so as to tighten the radiator shell is arranged on the radiator shell. The structure of the CPU mounting module can be simplified, the dismounting and mounting efficiency is improved, the pressing force on the CPU is enhanced, and the heat dissipation performance and good physical contact are guaranteed. The invention also discloses a mainboard and a server, which have the above beneficial effects.
Owner:INSPUR SUZHOU INTELLIGENT TECH CO LTD
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