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112results about How to "Guaranteed encapsulation effect" patented technology

OLED display panel and a method for manufacturing same, and OLED display device

The present invention provides an OLED display panel and a method for manufacturing the same, and an OLED display device. A concave-convex structure is arranged at one side, far away from a substrate,on a planarization layer, after an organic light-emitting functional layer and an inorganic first package layer are formed on the planarization layer, positions of the organic light-emitting functional layer and the first package layer corresponding to the concave-convex structure are non-flat surfaces, namely concave-convex structures with the same shapes are formed at the positions, corresponding to the concave-convex structure, on the organic light-emitting functional layer and the first package layer; when an organic second package layer is formed, the non-flat surface of the first package layer can block the flow of the second package layer to a certain extent to reduce the liquidity of the second package layer, reduce the climbing distance of the edge of the second package layer andincrease the edge stress and an angle of gradient so as to achieve the product narrow-frame design, improve the thickness uniformity of the edges of the second package layer, avoid bad mura of a non-display area and ensure the package effect.
Owner:BOE TECH GRP CO LTD +1

Display panel preparation method, display panel and display device

The invention provides a display panel preparation method, a display panel and a display device. The method is characterized in that before an array film layer is prepared, a depression portion is formed on a substrate corresponding to a border area of a punching area, adverse effects on the array film during formation of the depression portion on the substrate after the array process is avoided,moreover, a depression portion of a non-display area is filled with an easily removable material, after the array film is prepared by the array process, a part of a second barrier layer directly abovethe depression portion is removed, the remaining unremoved second barrier layer directly above the depression portion is made to cover an opening edge of the depression portion, then, the easily removable material in the depression portion is removed, during subsequent formation of an organic light emitting layer, the organic light emitting layer is disconnected at the depression portion, when the display area is punched, the organic light emitting common layer can be effectively removed or disconnected in the punching area, and thereby the water and the oxygen are prevented from entering theorganic light emitting film layer of the display area along an inner side wall of the depression portion.
Owner:YUNGU GUAN TECH CO LTD

Extrusion-type backing plate for photovoltaic cell and preparation method of backing plate

The invention discloses an extrusion-type backing plate for a photovoltaic cell. The backing plate comprises an upper surface layer, a core layer and a lower surface layer, wherein the upper surface layer is composed of polyamide resin, filler, a flame retardant and additives, the core layer is composed of polypropylene resin and grafted polyethylene modified polyamide resin, filler, flame retardant and additives, the lower surface layer is composed of polyamide resin, flame retardant, a coupling agent and additives, the flame retardant is composed of a nanoscale inorganic flame retardant subjected to surface treatment and red phosphorus, the nanoscale inorganic flame retardant is selected from aluminum hydroxide and/or magnesium hydroxide of 10-100 nm, and a used surface treating agent is ethylene-based polyhedral oligomeric silsesquioxane of 1-5 nm. The extrusion-type backing plate is good in flame-retardant effect which reaches the A level through combustion tests, and it can be guaranteed that the flame retardant has no influence on the mechanical property, aging-resistant property, waterproof property, insulating property and the like of the extrusion-type backing plate.
Owner:SUZHOU DUCHAMPS ADVANCED MATERIALS CO LTD

Display device, display panel and manufacturing method thereof

The invention relates to a display device, a display panel and a manufacturing method thereof, and relates to the technical field of display. The display panel comprises a display substrate, a cover plate, a reinforcing layer, a retaining wall and a filling layer. The display substrate is provided with a display region and a peripheral region surrounding the display region. The cover plate and thedisplay substrate are arranged in a mutual covering way. The reinforcing layer is arranged in the peripheral region and is located between the display substrate and the cover plate. The reinforcing layer comprises a plurality of curved first protective corners which are spaced around the display region. The retaining wall is arranged in the peripheral region and is located between the display substrate and the cover plate. The retaining wall has a closed annular structure surrounding the reinforcing layer and is provided with a plurality of curved corners. The inner wall of each corner is correspondingly matched and fit with the outer wall of each first protective corner in a one-to-one way. The filling layer fills in the space formed by the display substrate, the cover plate, the first protective corners and the retaining wall through enclosing and the filling layer is matched and fit with the inner wall of the first protective corners. The display panel can improve the packaging effect and the reliability.
Owner:BOE TECH GRP CO LTD

Organic light-emitting display panel, preparation method and display device

The invention discloses an organic light-emitting display panel, a preparation method and a display device, wherein the organic light-emitting display panel comprises a display area and a non-displayarea surrounding the display area, the display panel comprises a substrate, an organic light-emitting structure array layer, a plurality of film layers, and a hydrophobic structure; the organic light-emitting structure array layer is located in the display area of the substrate; the plurality of film layers are located on one side of the substrate facing the organic light-emitting structure arraylayer and extend to the non-display area; and the hydrophobic structure is located between any two adjacent film layers of the plurality of film layers in the non-display area. According to the organic light-emitting display panel, the preparation method and the display device provided by the embodiment of the invention, water and oxygen can be effectively prevented from seeping into the gaps of the film layers in the non-display area, the light-emitting material and the cathode material in the organic light-emitting display panel are prevented from being corroded, effective blocking of waterand oxygen is realized, and the packaging effect of the organic light-emitting display panel is guaranteed.
Owner:KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD

OLED display panel and manufacturing method thereof

The invention provides an OLED display panel and a manufacturing method thereof. According to the manufacturing method of the OLED display panel, a light-shielding film is arranged on a packaging cover plate, and the laser can be prevented from irradiating electrodes on an OLED substrate in the laser scanning process of a frame adhesive. In this way, electrodes are effectively protected. Meanwhile, the part of the light-shielding film, overlapped with the film region of the frame adhesive, has a gradually-reduced light transmittance, so that the film region of the frame adhesive can be prevented from being burnt by the excessive laser energy. The packaging effect is fully guaranteed, and the generation of particulate matters is reduced. In addition, the surface of the light-shielding film,irradiated by the laser, is set to be a frosted surface, so that the laser irradiated on the light-shielding film can generate the diffuse reflection. As a result, the laser is prevented from being directly reflected to a laser head, so that the laser head is protected from being damaged by burns. The OLED display panel is prepared by adopting the above manufacturing method of the OLED display panel, so that the OLED display panel is good in packaging effect and high in production yield.
Owner:WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD

Device for detecting sealing performance of silica gel for packaging solar modules

The invention discloses a device for detecting the sealing performance of silica gel for packaging solar modules. The device comprises an experimental gas storage box, a circulating pressure pump, a pressure air chamber, a bond-line test frame, an airtight test chamber, a humidometer, a dust-loaded plate, an end face seal gasket and a fastener, wherein the humidometer is arranged in the airtight test chamber, and the dust-loaded plate is horizontally arranged at the bottom of the airtight test chamber; the bond-line test frame is arranged between the pressure air chamber and the airtight test chamber, and the bond-line test frame, the pressure air chamber and the airtight test chamber are fixedly connected by the end face seal gasket and the fastener; an output end of the circulating pressure pump is in closed connection with an air inlet of the pressure air chamber, and an air suction end of the circulating pressure pump is communicated with the experimental gas storage box; and the pressure of the cavity of the pressure air chamber ranges from (1.5*10<5>Pa) to (2.0*10<5>Pa). The device can be used for detecting the isolation performance of the silica gel (for packaging solar modules) to water vapor and dust in the air.
Owner:EGING PHOTOVOLTAIC TECHNOLOGY CO LTD

Display device, display panel and manufacture method thereof

The invention discloses a display device, a display panel and a manufacture method thereof. The display panel comprises a substrate, a protective dam, and a light-emitting unit, wherein the substratehas a preset hole, a protective area arranged around the preset hole, and a display area isolated from the preset hole by the protective area, the light-emitting unit covers the display area, the protective dam is convex in the thickness direction of the substrate in the protective area, and the protective dam comprises a firm dam, a second dam and a third dam that surround the preset hole in sequence from near to far. The invention further provides a display device comprising the display panel and a method of preparing the display panel. Water and oxygen at the preset hole are prevented fromeroding the light-emitting functional layer.
Owner:YUNGU GUAN TECH CO LTD

Array substrate, preparation method thereof and display device

The invention provides an array substrate, a preparation method thereof and a display device, and belongs to the technical field of display. The array substrate is provided with a hole opening area and a hole frame area. The preparation method of the array substrate comprises the steps that a source-drain metal layer is formed on one side of a substrate, a first isolation column surrounding a hole opening area is formed in a hole frame area of the source-drain metal layer, and the first isolation column comprises a first metal layer and a second metal layer located on the side, away from the substrate, of the first metal layer; forming a planarization layer at least covering the side surface of each first metal layer; forming a pixel electrode layer; forming a protective layer covering the pixel electrode layer, wherein the protective layer exposes the hole frame area; removing the part, located in the hole frame area, of the planarization layer; partially etching the first metal layer from the side surface to form a third metal layer; removing the protective layer; and sequentially forming an organic light-emitting layer and a common electrode layer. The preparation method of the array substrate can improve the yield of the array substrate.
Owner:BOE TECH GRP CO LTD +1

Display panel, preparation method thereof and display device

The embodiment of the invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a first groove, a retaining wall, a first inorganic layer and an organic layer. The first groove and the retaining wall are arranged on the substrate, the first groove is closer to the display area of the display panel than the retaining wall, and the retaining wall comprises a first organic layer far away from the substrate. The first inorganic layer is disposed on the first groove and the first organic layer. The second organic layer is arranged on the first inorganic layer close to one side of the display area relative to the first organic layer. According to the technical scheme, the number of the retaining walls can be reduced, the frame of the display panel is reduced, and a narrow frame is achieved.
Owner:YUNGU GUAN TECH CO LTD

Electrochemical battery and preparation method thereof

The invention belongs to the field of adhesive tape and electrochemical batteries and particularly relates to an adhesive tape and an electrochemical battery with the adhesive tape. The adhesive tape comprises a base material and an adhesive layer. The adhesive layer is attached to at least one surface of the base material, the adhesive tape is of a porous structure, the area of the hole region is S1, and the area of the non-hole region is S2; the thickness of the base material is h1, and the thickness of the adhesive layer is h2; (S2*h2) / (S1*h1) is smaller than or equal to 2. The electrochemical battery with the adhesive tape comprises a naked battery cell and an outer packaging part. The adhesive tape is arranged between the naked battery cell and the outer packaging part, and the naked battery cell and the outer packaging part closely adhere together. In the adhesive tape, (S2*h2) / (S1*h1) is smaller than or equal to 2, in other words, the volume of the portion, in the non-hole region, of the adhesive layer is smaller than or equal to twice of the volume of the portion, in the hole region, of the base material, the hole region has enough space to contain the portion, overflowing from the non-hole region, of the adhesive layer at the moment, and therefore the situation because of uncontrolled flowing of the adhesive layer, the packaging reliability of the battery is finally affected is limited.
Owner:GUANGDONG ZHUGUANG NEW ENERGY TECH

Quantum dot LED and preparation method thereof

The invention discloses a quantum dot LED and a preparation method thereof. The method comprises the steps that a cavity transmission layer is deposited on an anode; a quantum dot luminescent layer is deposited on the cavity transmission layer; an electron transmission layer and an electron injection layer are deposited on the quantum dot luminescent layer successively; a cathode is vapor-plated on the electron injection layer to prepare a QLED device; and a mixture of a thermal expansion material and a packaging glue is added to the periphery of the prepared QLED device drop by drop, a cover sheet is packaged, infrared baking is carried out, and packaging is completed. According to the invention, the packaging glue is mixed with the thermal expansion material, so that the packaging effect can be ensured, heat is conducted out timely, and the stability of the QLED device is enhanced. More importantly, the added thermal expansion material is very sensitive to heat, the thickness of the material can be adjusted according to temperature change, time that light emitted by the QLED device penetrates a thermal expansion material layer can be adjusted, and the wavelength of light penetrating the thermal expansion material layer is adjusted to optimize the color rendering performance.
Owner:TCL CORPORATION

Photoelectric sensor packaging structure

The invention relates to the technical field of sensor packaging, and discloses a photoelectric sensor packaging structure. The structure comprises a substrate and a packaging plate, the upper surfaceof the substrate is attached to the lower surface of the packaging plate, a frame body is fixedly connected to the upper surface of the substrate, a groove corresponding to the frame body is formed in the lower surface of the packaging plate, the frame body and the groove are arranged in a clamped mode, ,a matched sealing strip is installed at the joint of the frame body and the groove, a matchedcontrol processing chip is arranged in the frame body and electrically connected with the substrate, a matched photoelectric sensor chip is arranged at the groove bottom of the groove, the lower surface of the photoelectric sensor chip is attached to the top of the frame body, an opening is formed in the groove bottom of the groove and matched glass is fixedly mounted in the opening. According tothe invention, the packaging effect of the photoelectric sensor can be effectively ensured, the packaged photoelectric sensor can be conveniently maintained as required, and the maintenance efficiency is effectively ensured.
Owner:西安远讯光电科技有限公司

Direct-current direct-drive type driving chip with multiple packaging forms and packaging device and method

The invention relates to the technical field of chip packaging, and discloses a direct-current direct-drive type driving chip with multiple packaging forms and a packaging device and method. Stable and ordered blanking is completed through a simple mechanical structure by arranging an electric telescopic rod and the like, rapid heat fusion packaging is achieved by adopting a fluorescence labeling mode in cooperation with a hot melting gun, different chip packaging shells can be selected in a self-adaptive manner while precise packaging is realized, and the packaging efficiency is improved. Two clamping blocks at the corresponding positions are driven to rotate with the corresponding rotating shafts as the axes through the arrangement of clamping air cylinders and the like, then the clamping blocks on the two sides clamp the two sides of a to-be-packaged chip, the packaging stability is further improved, the displacement influence on the to-be-packaged chip caused by the operation of a conveying belt is avoided, a pushing plate pushes the corresponding to-be-packaged chip into a defective product groove through the operation of a material returning air cylinder, defective product collection is completed, and the packaging effect of an assembly line is ensured.
Owner:深圳市谦诚半导体技术有限公司
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