Display substrate, manufacturing method thereof, and display device

A production method and technology for display substrates, which are applied in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices, etc., can solve the problems of cracks in the packaging film, reducing the reliability of the packaging film, and failure of the packaging film, so as to avoid failure and improve the Reliability and effect of ensuring film thickness uniformity

Active Publication Date: 2019-05-10
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the setting of the isolation structure makes the film layer of the packaging film around the isolation structure thinner. At the same time, the packaging film produces a stress concentration area around the isolation structure. In the stress concentration area, the packaging film is prone to cracks, which eventually leads to the packaging film. failure, reducing the reliability of the encapsulation film in the area around the mounting hole

Method used

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  • Display substrate, manufacturing method thereof, and display device
  • Display substrate, manufacturing method thereof, and display device
  • Display substrate, manufacturing method thereof, and display device

Examples

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no. 1 example

[0067] According to the first embodiment of the present invention, there is a method for manufacturing a display substrate. The display substrate includes a display area, and an opening area is arranged in the display area. The manufacturing method includes:

[0068] S1: preparing the array structure layer;

[0069] S2: forming at least one isolation structure disposed around the opening area on the surface of the array structure layer, the isolation structure having a first side wall with a slope angle not greater than 90°;

[0070] S3: forming a stress concentration region in contact with the first sidewall and used for eliminating the inorganic thin film formed thereon.

[0071] In this embodiment, before S3, it also includes forming a pixel defining layer and a light emitting structure layer; after S3, it also includes forming a first inorganic thin film covering the filling structure and the isolation structure.

[0072] The method for fabricating a display substrate acc...

no. 2 example

[0095] The second embodiment of the present invention is a method for manufacturing a display substrate. The display substrate includes a display area, and an opening area is arranged in the display area. The manufacturing method includes:

[0096] S1: preparing the array structure layer;

[0097] S2: forming at least one isolation structure disposed around the opening area on the surface of the array structure layer, the isolation structure having a first side wall with a slope angle not greater than 90°;

[0098] S3: forming a stress concentration region in contact with the first sidewall and used for eliminating the inorganic thin film formed thereon.

[0099] In this embodiment, before S3, it also includes forming a pixel defining layer, a light-emitting structure layer, and forming a first inorganic thin film covering the isolation structure; A protective layer; after S3, further comprising forming a second inorganic thin film covering the filling structure and the isola...

no. 3 example

[0116] The third embodiment of the present invention provides a display substrate, such as figure 1 and Figure 12 As shown, the display substrate includes a display area, the display area is provided with an opening area 100, and an effective display area 200 outside the opening area 100, and the display substrate includes:

[0117] array structure layer;

[0118] an isolation structure disposed on the surface of the array structure layer and disposed around the opening area, the isolation structure has a first side wall with a slope angle not greater than 90°;

[0119] The filling structure 70 is in contact with the first sidewall and is used to eliminate the stress concentration area of ​​the inorganic thin film formed thereon.

[0120] Wherein, the slope angle of the side wall of the filling structure 70 for carrying the inorganic thin film is not less than 90°.

[0121] Wherein, the array structure layer includes a substrate 10 , a thin film transistor 20 disposed on the...

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Abstract

The invention discloses a display substrate and a manufacturing method thereof, and a display device. The display substrate comprises a display region, an opening region is arranged in the display region; the manufacturing method comprises the following steps: preparing an array structure layer; forming at least one isolation structure surrounding the opening region on a surface of the array structure layer, wherein the isolation structure is provided with a first sidewall with a slope angle not more than 90 DEG; and forming a filling structure contacting with the first sidewall and used for eliminating a stress concentration region of an inorganic film thereon, wherein the filling structure bears an inorganic film by replacing the isolation structure, and the filing structure can eliminate the stress concentration region of the inorganic film formed thereon. Therefore, the stress concentration region is prevented from being formed on the inorganic film, the package film invalidation is avoided, and the dependence of the package film surrounding the opening region is improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] In recent years, Organic Light Emitting Diode (OLED) has become a very popular emerging flat-panel display product at home and abroad, because OLED display devices have self-illumination, wide viewing angle, short response time, high luminous efficiency, wide color gamut, It has the characteristics of low working voltage, thin panel, large-size and flexible panel and simple manufacturing process, and it also has the potential of low cost. [0003] The flexible OLED display device can be folded or curled like paper. After the edge of the flexible display device is folded, a narrow frame display can be realized, or even a frameless display, which increases the screen-to-body ratio of the display device. When narrow frame or frameless display is applied to mobile terminal produ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L51/52H01L21/77
CPCH10K59/12H10K50/844H10K59/1201H10K71/00H01L21/77H10K59/123H10K59/1213Y02E10/549
Inventor 王有为张嵩蔡鹏
Owner BOE TECH GRP CO LTD
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