36results about How to "Avoid temperature overshoot" patented technology

A fuser apparatus including: a fuser member having an endless contact surface to be brought into contact with each of successively transported recording media and a non-contact surface and being arranged to apply heat to the recording medium from the contact surface to fix a toner on the recording medium; a heating member energized to supply heat to the contact surface; a contact surface temperature detecting member for detecting a temperature of the contact surface; a non-contact surface temperature detecting member for detecting a temperature of the non-contact surface; and an energization controlling member for controling energization power of the heating member; wherein the energization controlling member controls the heating member energization power so that the heating member energization power is reduced as a difference between the non-contact surface temperature and the contact surface temperature decreases.

The invention discloses a radio-frequency ablation instrument and a multi-pole ablation device with the same. The radio-frequency ablation instrument is capable of judging ablation effectiveness according to one or more conditions of an impedance decrease value, an impedance change rate, impedance change rate changes or impedance change from decreasing to increasing. By adoption of a sectional control method and dynamic smoothing for regulating radio-frequency output power, ablation temperature is controlled, quick temperature rise of ablation tissues is avoided, and radio-frequency output power smooth changes in an ablation process is guaranteed. The radio-frequency ablation instrument is further provided with a special protection mechanism for preventing repeated ablation, the temperature of a to-be-ablated part is detected in each-time ablation application, and ablation is not started if the temperature of a to-be-ablated part is higher than 40-60 DEG C. The radio-frequency ablationinstrument and the multi-pole ablation device with the same can be used for sending direct current, alternating current and radio-frequency energy to lesions and used for treatment of lung diseases.

The invention discloses a server fan control method and system based on component power consumption. The method comprises the steps that according to the power consumption value of a current samplingmoment and the power consumption value of a previous sampling moment of a to-be-cooled part in a server, a power consumption deviation of the to-be-cooled part is calculated; whether the power consumption deviation is larger than or equal to 10% or not is judged; if yes, the rotating speed of a fan of the server is controlled according to the power consumption deviation; and if not, the rotating speed of the fan of the server is controlled by utilizing a PID control method according to the temperature of the to-be-cooled part. The system mainly comprises a power consumption deviation calculation module, a judgment module, a power consumption control module and a PID control module. By means of the method and the device, the phenomena of rotating speed overshoot of the fan and temperature overshoot of the components can be avoided, the control stability of the rotating speed of the fan is improved, the noise generated by the server is lowered, and the user experience is improved.

A thermal compression bonding power source comprises a main circuit, a controller, a current sampling circuit, a voltage sampling circuit and a temperature detection circuit, wherein the main circuit outputs a direct current / a pulse current to a thermal compression bonding head, and the current sampling circuit, the voltage sampling circuit and the temperature detection circuit are respectively connected to the thermal compression bonding head. The main circuit adjusts the output current according to a PWM signal. The current sampling circuit collects the output current of the main circuit and obtains a feedback current value. The voltage sampling circuit collects voltages of two ends of the thermal compression bonding head and obtains a feedback voltage value. The temperature detection circuit detects the temperature of the welding position of the thermal compression bonding head and obtains a thermal electromotive force signal. The controller is used for controlling the temperature process of the thermal compression bonding head according to a preset temperature curve, obtaining a feedback temperature value according to the thermal electromotive force signal, and controlling a duty ratio of the PWM signal according to the feedback current value, the feedback voltage value and the feedback temperature value. According to the thermal compression bonding power source, identification for temperature sensing lag time is achieved, feed forward control over the temperature is conducted according to the lag time, the phenomenon of temperature overshooting caused by the temperature feedback lag is avoided, and stability of the temperature control is improved.

The invention discloses a control method for preventing temperature overshoot, which includes the following steps: S001: setting the preset temperature T0; S002: setting a counter, wherein, when the water quantity control switch is switched from a low position to a high position, the counter display The value is 0; when the water volume control switch is switched from the high position to the low position, the display value of the counter is greater than 0; S003: judge the display value of the counter; S004: set the target temperature according to the judgment result of step S003, such as the display value of the counter If it is 0, set the target temperature T=T0; if the display value of the counter is greater than 0, then set the target temperature T=T0-T1; S005: maintain the target temperature T=T0-T1 for a period of time and then return to the preset temperature T0. The invention also discloses a control system for preventing temperature overshoot. The temperature overshoot prevention control method or control system provided by the present invention ensures that the temperature overshoot phenomenon is avoided when gears are switched, and brings comfortable experience to users.

The invention provides a wafer temperature control system, a wafer temperature control method, and a reaction chamber. The wafer temperature control system includes a chuck for carrying a wafer, a heating device arranged in the chuck for heating the wafer, and a heating device for heating the wafer. The conveying device for conveying the heat exchange gas in the gap between the wafer and the chuck, the conveying device includes a conveying pipeline, and the conveying pipeline is used to convey the heat exchanging gas to the gap between the wafer and the chuck; There are temperature controllers for heating or cooling the heat exchange gas in the delivery line so that the heat exchange gas entering the gap between the wafer and the chuck reaches the target temperature. The wafer temperature control system provided by the invention can not only increase the temperature control speed of the wafer and increase the production capacity, but also can improve the accuracy of the wafer temperature control, thereby improving the uniformity of the process.

The invention provides a power control method and device. The method comprises the steps of: acquiring an actual measurement temperature of a controlled target; comparing the actual measurement temperature and a rated temperature, and, in response to the increase of the actual measurement temperature from a value lower than the rated temperature to a value higher than the rated temperature or thereduction of the actual measurement temperature from a value higher than the rated temperature to a value lower than the rated temperature, resetting an accumulative temperature error value acquired by accumulating temperature error values, wherein the temperature error values are the difference values between the rated temperature and the actual measurement temperature; based on the temperature error values and the accumulative temperature error value at the current moment, determining the input power upper limit value of the controlled target; controlling power provided for the controlled target based on the input power upper limit value. According to the technical solution, the temperature of a controlled target can be stabilized around a rated temperature faster, so that the performance of the controlled target can be maximized while the controlled target is protected.

The invention relates to an energy-saving temperature controlling heating stage and a constant temperature controlling method of the energy-saving temperature controlling heating stage. The energy-saving temperature controlling heating stage and the constant temperature controlling method of the energy-saving temperature controlling heating stage solve the problems that a conventional temperature controlling box is slow in temperature increase and temperature of a conventional electric heating plate can not be stably controlled. The energy-saving temperature controlling heating stage comprises a thermal insulation box cover, a heating cavity and an electric control operation box, wherein the thermal insulation box cover, the heating cavity and the electric control operation box are sequentially connected from top to bottom. A heating device and a soaking plate are arranged in the heating cavity. The upper surface of the heating device is tightly connected with the lower surface of the soaking plate. Heat insulating and preserving materials are filled in a cavity of the lower surface of the heating device. An automatic sealed ring controlling regulator, a heating switch, a power supply switch and a fuse cutout are arranged on the electric control operation box.

The invention discloses a CO 2 The temperature control method of the incubator, including: according to the set temperature st and CO 2 The real-time temperature t inside the incubator is used to calculate the temperature control deviation value er; 2 The incubator temperature control method controls the output power of the heating element, controls the CO 2 The temperature t in the incubator is within the precise range. This method effectively avoids temperature overshoot, effectively controls the stability and uniformity of the box temperature, and ensures that different cells can be cultivated under different environmental conditions, making CO 2 When the incubator is in the environment of 15-35°C and the set temperature is 30-50°C, the control error can be kept at ≤±0.2°C. When the set value is 37°C and the ambient temperature is 23°C, the control accuracy can be guaranteed At ≤±0.1°C.